JPS6081834A - Chip part mounting device - Google Patents

Abstract

PURPOSE:To enable to mount mixed chip parts with different shape and/or size efficiently by a method wherein multiple dispenser heads interlocking with mounting head is provided thereon to preliminarily coat a substrate with adhesive. CONSTITUTION:When a shifting lever 61 turns forward to shift a dispenser head 4 from the one dot chain lined position to the solid lined position, a push lever 62 turns forward to the two dot chain lined position to push down the dispenser head 4. At this time, when an abutting plate 81 of the dispenser head 4 abuts against a substrate 6, a hoisting rod 79 only is pushed down against the tension of a compression spring 96. Resultantly the upper part of a cylinder 75 is supplied with compressed air from an air hole 84 to push down a push plate 82 coating the substrate 6 with adhesive 73 discharged from an outlet 80. At this time, the amount and shape of coated adhesive may be delicately controlled by means of adjusting air pressure etc. When it is needless to coat the substrate with adhesive, the dispenser heads 4, 5 may be prevented from being pushed down utilizing a height adjusting bolt 71 as a stopper.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention has a mounting head for chip components, and is used to mount a mixture of chip components of different shapes and/or sizes on a substrate constituting an electronic circuit. The present invention relates to a chip component mounting device that can perform the above-mentioned chip component mounting device, and more particularly to a chip component mounting device that has a plurality of dispenser heads that are optimal for applying adhesive used for fixing the mixed chip components.

Background technology and its problems A chip component mounting device (chip racer) that automatically mounts chip components onto a substrate that constitutes an electronic circuit.
Conventionally, there is no device that can mount a mixture of square chips and cylindrical chips, and the devices are only for square chips or cylindrical chips.

For example, even if the device is exclusively for cylindrical chips,
As shown in the figure, it is necessary to change the amount of adhesive applied depending on the size, but conventional equipment can handle only one size. Moreover, between cylindrical chips and square chips, it is not only a matter of quantity, but also the application shape (one point, two points) and the type of adhesive, as shown in Figures 1A to 2B. .

(Figures 2A and 2B show the procedure for fixing chip parts using, for example, an ultraviolet curing adhesive.) On the other hand, from the viewpoint of circuit configuration or versatility as a device, these chips There is a need to mount a mixture of parts.

In response to this, for example, a chip component mounting device using a chip component mounting head equipped with a plurality of chucking heads has been invented (for example, Japanese Patent Application No. 58-5099).
Alternatively, it has become possible to mount a mixture of chip components of different sizes.

Purpose of the Invention The present invention is directed to a chip component mounting device that can mount a mixture of chip components of different shapes and/or sizes, which has become possible under the above-mentioned circumstances. To provide a chip component mounting device equipped with a dispenser head that can apply an adhesive suitable for the chip component in advance at a position corresponding to the chip component to be mounted by such a device. be.

SUMMARY OF THE INVENTION In order to achieve the above objects, the present invention provides a chip component that has a mounting head for chip components, and that allows chip components of different shapes and/or sizes to be mounted on a substrate in a mixed manner. In this mounting device, an adhesive is applied in advance to the mounting head.

With the above configuration, adhesive suitable for the chip component to be mounted can be applied in advance to the position corresponding to the chip component in conjunction with the mounting head, so in the next process. On the board coated with this adhesive, mount the chip components that match their respective positions.
This allows chip components of different shapes and/or sizes to be mixed and mounted efficiently.

EXAMPLE Hereinafter, an example of a chip component mounting apparatus to which the present invention is applied will be described with reference to the drawings.

(Schematic description of the entire apparatus) First, the entire apparatus will be described with reference to FIGS. 3 and 4. Reference numeral (1) is a mounting head for chip components, and on both sides there is a pair of chip component feeders (21(3)) that supply chip components to the chucking head of this mounting head (1).
are arranged. Also, symbols (4) and (5) are dispenser heads, and these dispenser heads are 4) (5).
) to which an adhesive is applied, and a substrate (7) to which a chip component is mounted by the mounting head (1).
) are juxtaposed at predetermined positions on a pair of turntables (9) α1 on the XY table (8). And the α value of this pair of turntables (9) is 9 at the same time in the same direction.
It is configured to be able to rotate 0 degrees back and forth. A new board is fed from the standby station to the turntable (9), and a board that has been coated with adhesive is fed to the turntable (1).
1 and carrying out of the board on which the chip components have been mounted to the next process is performed by a conveyor (not shown) provided on the near side in FIG.

In Fig. 3, the symbol (1) is the control device storage case in which the control device is housed, the symbol (1) is the main operation panel, and the symbol I is the one that adjusts the time and pressure to adjust the amount of adhesive applied. This is the dispenser setting board.

Further, in FIG. 4, the symbol - is a sub-operation panel such as a manual switch, and the symbol tLQ is a drive motor for each operation of the main mounting device, which will be explained later, and is installed on the frame above the control device storage case a). , and the sign αη is Bell) I
'lF! It is a speed reducer driven by a drive motor via i. The symbol kan is the rotary drive shaft connected to the output shaft of this reducer H, and the symbol - is the cam mechanism (
21), which are supported by brackets on the frame.

(Schematic explanation of the chip component mounting head and its operation) Next, the chip component mounting head and its operation will be explained with reference to FIGS. 4 to 7B. As shown in FIG. 6, the mounting head (1) is in a position perpendicular to the central holding member (c) fixed to the support shaft (material), and
It consists of two chucking heads (c) that can slide up and down inside the chucking head (c) without interfering with each other. As shown in Fig. 7A, these chucking heads (A) and (B) have a double structure, with an inner and outer structure, respectively, with a fixed chuck C33 and a rotating chuck (H) attached to the tip of the outer chuck member (toward). ) is provided, and is configured to grip and hold the chip component Gl with the chuck claw (to) 01) at the tip thereof. A bushing rod (b) that is slidable independently of the outer chuck member (a) is inserted into the inside of the chuck member (b). As described later, the rotating chuck (c) is automatically opened when the chucking head (c) rotates 90 degrees and comes to the parts supply position, and vice versa. When it starts rotating toward the board (7), it closes and firmly grips the chip component (to).

In addition, as shown in Fig. 6, the support shaft (G) supported by the bearing (G)
goods) is connected to the rotation axis cm via a link (1)07) etc.
<Fig. 4), and the rotation of this rotation shaft (a)
Therefore, it is configured to rotate back and forth by 90 degrees.

Therefore, the chucking head (a) rotates in the direction of the double arrow in FIG. 5, and the chucking head (5) rotates in the direction of the double arrow in FIG.
It alternately rotates back and forth between the parts supply port (to) in (3). Further, in Fig. 6, reference numeral Cl (40 is a pressure lever) is connected to the rotating shaft fi'J (Fig. 4) via a cam mechanism, and the pressure lever OI rotates forward against a return spring. As a result, the chuck member (A) is pushed down, and the push lever arm rotates forward against the return spring, thereby pushing down the bushing rod 04).

On the other hand, as shown in FIGS. 4 and 5, each of the chip component feeders (2) (3) has a plurality of magazines (4
1) are provided radially in the radial direction, and the desired magazine (41) is moved and positioned to a predetermined position by the rotary drive device (4).
The chip parts that have descended from the supply pipe (43) are transferred to the parts via the escapement (4! It is configured to be supplied from the supply port C3 comb to the chuck claws (to) 0 and 0 of the chucking heads (A) and (C).

With the structure described above, in FIG. 5, when the chucking head (5) that receives chip components from the chip component feeder (3) rotates 90 degrees and comes to the top of the substrate (force), (At the same time, the XY table moves and the desired mounting position is directly below the chucking head (5))
The pressing lever first presses the head of the chuck member. When the chuck claw at the tip (up to C31) is pushed down to the position just before contacting the substrate (7),
Subsequently, the suppression lever (41) is actuated to press the head of the bushing rod (B), so that the chip component is pressed against the board (7).
) (Figure 7B). Meanwhile, another chip component was being supplied to the chucking head (2), which was rotating toward the chip component feeder (2), and the chucking head (2) had finished mounting the above component. When it is rotated toward the component feeder (3), the chucking head (a) comes over the board (7) and mounts the next component.

In this way, chip components can be mounted alternately by reciprocating the mounting head +1) by 90 degrees, and the component feeder (2) (3) has multiple magazines (41) for different shapes and sizes of chip components. are arranged, and the magazine (40) can be moved to a desired component supply position.Therefore, by this mounting head (1), it is possible to mount a mixture of chip components of different shapes and/or sizes.

(Description of Dispenser) Next, the dispenser will be explained with reference to FIGS. 8 to 11.

As shown in FIGS. 8 to 10, two support plates (4ω) are provided on the base plate (48), and the left notch edge surface 6I of the support plate (4!1 in FIG. 8) is provided on the base plate (48). An L-shaped bearing stand is fixed to the stepped portion 6I).

Two guide rods 54) are inserted into two sets of slide bearings S3) provided on this bearing stand 6 so as to be able to slide left and right, and an overhanging piece t5!51 on the upper part of the bearing stand 6 is inserted. An air cylinder 6@ is mounted on the top. Further, the right end portions of the two guide rods in FIG. 8 are integrally fixed to the end plate 67), and the left end portions are integrally fixed to the L-shaped dispenser holding member 5 barrel (FIG. 9). A tension spring 69) is tensioned between the end play) 67) and the bearing stand 64, and the guide rod I! i is biased in the direction of arrow C.

Further, a fulcrum shaft is provided between the two support plates (49) at the upper part of the two support plates (49).
In FIG. 8, a moving lever 6υ on the near side and a pressing lever (64) on the rear side are respectively rotatably attached. One end of the forked moving lever 1) is connected to the end plate. 6η, and the other end is connected via a pin to the elongated hole of the rotating lever 0 provided on the rotating shaft (21 (FIG. 4)).

On the other hand, a tension spring (64) is tensioned between the suppression lever and the bearing stand, so that the suppression lever is biased to rotate in the counterclockwise direction of arrow d. There is.

One end of the rotary shaft (11
(Figure 4)
The other end has a fulcrum pin (66) connected to it. (6?) is provided protrudingly. Further, at predetermined positions of the six suppression levers, a roller is protruded through a fulcrum pin, and the roller contacts the height adjustment pole (71) at the upper part of the cylinder rod σ1 of the air cylinder 6e. It is configured as follows.

The dispenser head 4) f5) is a cylindrical container in which an adhesive (73) is placed, as shown in FIG.
4) (5) each consists of a cylinder (7 cylinders) with a conical through hole (r4) formed at the bottom, and an upper lid σe and a lower lid ff? that are screwed into this cylinder U chamber, and the upper part is the upper lid. It is suspended from a hanging long dog via a cylinder head member (C) interposed between σ0 and the upper end of the cylinder (C). In addition, the lower lid (?η has a predetermined shaped discharge port @0
A contact plate (6'7) is provided on both sides of the lower cover (6'7), and the lower cover (6'7) can be easily replaced depending on the shape and/or size of the chip component. And cylinder U! A suppressing plate @2 is provided inside the housing 9 and is slidable therein.

In addition, an air hole is formed in the center of the hanging long dog tube, and the upper part is closed and the lower part is open.
851 is formed, and an air pipe (FIG. 8) is connected to this air inlet (G). The hanging iron σ value is such that the lower part thereof is configured to be able to slide within the through hole (8η) of the cylinder head member σ frame, and the flange (c) at the end allows the dispenser head to be
) and (5) are suspended as described above, and are supported so as to be slidable up and down within the dispenser holding member (g).

On the other hand, this dispenser holding member (to) is provided with a pressed rod O0 having a pressed portion at its upper end so as to be slidable up and down in parallel with the hanging rod σl.

And the pressed μrad is its upper flange al)
(The band (9■) provided between 9' and 4 is connected to the above-mentioned hanging rod, and it slides up and down with this hanging rod.Then, the flange O side and the dispenser holding member 5 Since a compression spring 04) is fitted between the ends of the rod, the compressed rod is normally pushed upward, and the end plate (T) fixed to the lower end of this rod (T) Its position is regulated by coming into contact with the lower end surface of the dispenser holding member 6 frame.This end plate (G) extends to the part of the hanging long dog, and the hanging long dog smell is regulated by this end plate. It passes through the plate (g), and this end plate (9!it and dispenser head part 4) (5)
A compression spring (OA
is fitted.

Next, the operation of the dispenser constructed as above will be explained mainly with reference to FIG.

When the drive motor (10 (Fig. 4) is started and the rotating shaft α field, and therefore the cam 1Ii5) starts rotating, the dispenser head (4) (5) moves the moving lever @D for each revolution of the cam haze. As a result, it is moved to the position shown by the solid line against the tension spring 6I, and then moved back to the position shown by the dashed-dotted line by the biasing force of the tension spring r51. On the other hand, for each rotation of the rotating shaft, the power of the pressing lever is increased. The dispenser head (4) or (5) that came directly under (6?) is
The pressure lever G is pressed down against the biasing spring (94) by the roller (6η) at the tip of the bottle, which is biased by the biasing spring, and the pressure lever 12 is pressed down against the biasing spring. When it moves back, it repeats the return motion by the biasing spring.

Therefore, if the timing between the movement of the moving lever and the movement of the suppression lever 6 is set appropriately, for example, as shown in FIG. 8, the moving lever (B1) moves forward and the dispenser head (4) When moving from the position indicated by the dot-dashed line to the position indicated by the solid line, the two suppression levers υ rotate forward to the position indicated by the two-dot chain line and press down the dispenser head (4). At this time, when υ of the contact plate at the tip of the disvenser head (4) shown in Fig. 11 comes into contact with the substrate (6), only the hanging iron σ is pushed down against the compression spring. , substrate (6
) will not be loaded with a load greater than the weight of the dispenser head (4), and the board (6) will not be damaged.

Then, the pulp (not shown) of the air pipe opens and compressed air is sent from the air hole to the top of the cylinder (7!9), and the compressed air pushes the suppression plate.
The adhesive σ tank stored inside is applied onto the substrate (6) from the discharge port (fil).At this time, the amount of application and the application shape (1 point, 2 points) are determined by the size and shape of the discharge port. Depending on the situation, even the same size discharge port can be finely controlled by adjusting the air pressure and supply time of the compressed air that is supplied.And if there is no need to apply adhesive by selection, the air The cylinder rond U1 of the cylinder 60 rises to a predetermined position, and the height adjustment pole at its upper end (height adjustment pole) H comes into contact with the suppression lever & the middle roller (61) of the cylinder 60 and becomes a stopper, pushing the dispenser head (4) (5). Therefore, even if the dispenser head (4) (5) is in the predetermined position, the adhesive is not applied.On the other hand, as mentioned above, the rotation axis 0 and this chip component mounting head are prevented from being lowered. The 90 degree reciprocating movement of (1) is linked, and the rotation axis - is used to push down the chucking head (c) (5) onto the board (7) and move the chip component onto the board (7). The mount movement of the dispenser head (
4) Since the movement of (ii>) can be made to correspond one-to-one to the movement of the mounting head (1), apply adhesive suitable for this chip component in advance at the position corresponding to the chip component to be mounted. You can keep it.

DETAILED DESCRIPTION OF THE INVENTION According to the present invention, a plurality of dispenser heads are provided, the plurality of dispenser heads comprising:
It is configured to work in conjunction with a chip component mounting head that can mount a mixture of chip components of different shapes and/or sizes on a substrate. Therefore, adhesive suitable for the chip components to be mixed and mounted can be applied in advance in conjunction with the mounting head. By mounting compatible chip components, chip components of different shapes and/or sizes can be mixed and mounted efficiently.

[Brief explanation of drawings]

Figures 1A to 2B are enlarged explanatory diagrams showing that the amount and shape of adhesive applied differ depending on the shape and size of the chip component. Figures 3 and 2B are explanatory diagrams showing the procedure for fixing when using ultraviolet curing adhesive, Figures 3 to 11
The figures show an embodiment of a chip component mounting device to which the present invention is applied, and FIG. 3 is a front view showing the entire device, and FIG.
The figure is a plan view of FIG. 3, FIG. 5 is a front view showing the relationship between the chip component mounting head and the component supply machine, FIG. 6 is a partial perspective view for explaining the operation of the mounting head, and FIGS. 7th
Figure B is a partial detailed sectional view of the tip of the mounting head, showing the front and rear of the mounting of the chip component, Figure 8 is a front view of the dispenser, Figure 9 is a plan view of Figure 8, and Figure 10 is a bearing stand. FIG. 11 is a perspective view taken along the line XI-XI in FIG. In addition, in the symbols used in the drawings, (1)......Chip component mounting head (2+ (3)...Chip component supply Machine (4X5)・・・・・・・・・・・・・・・・Tissencer head 0I・・・・・・・・・・・・・・・・
・Rotation axis (ground......Rotation axis (
)・・・・・・・・・・・・・Holding member■幀・・・
......Chucking head t31 (
41・・・・・・・・・・・・Press lever (4)・
・・・・・・・・・・・・・・・Air cylinder 60...
・・・・・・・・・・・・Transfer 111t/bar wheel・・・・
・・・・・・・・・Press lever υη・・・・・・
・・・・・・・・・It is the lower lid. Agent Ueya Katsutsunekane Yoshio Sugiura Toshiki, 9゜7・' 啼波* S 5 Yasuichi゛'N'掩◇ 〉 U(,he)

Claims (1)

[Claims] A chip component mounting device having a chip component mounting head and capable of mounting a mixture of chip components of different shapes and/or sizes on a board using the mounting head, characterized in that the mounting spatula is configured as described above. A device for mounting chip parts.