JPS6071236A - Molding of heat resistant resin - Google Patents
Molding of heat resistant resinInfo
- Publication number
- JPS6071236A JPS6071236A JP17896383A JP17896383A JPS6071236A JP S6071236 A JPS6071236 A JP S6071236A JP 17896383 A JP17896383 A JP 17896383A JP 17896383 A JP17896383 A JP 17896383A JP S6071236 A JPS6071236 A JP S6071236A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- mold
- resin
- release agent
- heat resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【発明の詳細な説明】
(技術分野)
本発明は、作業性に優れた耐熱61脂の成形方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method for molding heat-resistant 61 resin with excellent workability.
(従来技14::1)
従来、4か1脂の加熱11縮成形においでは、成形後の
離型を円滑にするべ(、予め金型に離型剤を塗布り゛る
手)人が採られている。しかじなhくら、このような手
法にd3いては、高温の金型に離型剤を塗布覆るため、
作業の安全性の面から問題があり、特に通常よりも高い
成形温度を必要とする耐熱樹脂の成形にJ7いCは、前
記欠点が顕著となる。(Conventional technique 14::1) Conventionally, in heating 11 shrink molding of 4 or 1 fat, it was necessary for people to release the mold smoothly after molding (by applying a mold release agent to the mold in advance). It is taken. However, in this method, a mold release agent is coated on the hot mold, so
There is a problem in terms of work safety, and the above-mentioned drawbacks are particularly noticeable in J7C when molding heat-resistant resins that require a molding temperature higher than usual.
(本発明の目的)
本発明の目的は、このような従来技術の欠点を改善し、
作業性に優れた成形fノ法を提供1することにある。(Object of the present invention) The object of the present invention is to improve the drawbacks of such prior art,
An object of the present invention is to provide a molding method with excellent workability.
(本発明の構成)
ずなわち、本発明は予め予1iiiI成形した(か1脂
成形品の表面に離型剤を塗布しic後、その子M6成形
品を加熱圧縮成形?lろことを!121徴と1する耐熱
4fiJ脂の成形方法に関するするものである。(Structure of the present invention) In other words, the present invention involves applying a mold release agent to the surface of a molded product that has been molded in advance, and then heating and compression molding the M6 molded product. This article relates to a method for molding heat-resistant 4fiJ resin with characteristics 121 and 1.
本発明では、離型剤処理された樹脂予1ii!+成形品
を加熱圧縮するため、成形時に溶811する樹脂に(ま
適用することができない。従って、本発明か適用される
樹脂は、融点あるいはカラス転移点か極めて高く、成形
時に流動しない樹11ir−Cあり、具体的には、ポリ
アリーレン樹脂、ポリへテロ芳香1m +A4脂などの
特殊耐熱樹脂を対τ!どjl dl 、。In the present invention, the mold release agent treated resin preform 1ii! + Since the molded product is heated and compressed, it cannot be applied to resins that melt during molding. Therefore, the resin to which the present invention is applied has an extremely high melting point or glass transition point, and does not flow during molding. -C, specifically, special heat-resistant resins such as polyarylene resin, polyheteroaromatic 1m+A4 resin, etc. are used.
本発明でいう予備成形どCよ、樹脂を15め最終成形品
の形状にしておくことをm ’1)ll L/、こ−)
σることにより、離型剤の塗布が可能となる。従−)−
(、予備成形時には、加熱されl〔金型を用いる必要は
なく、作業者にとって好ましいと1^磨を選択づること
かできる。また、離型剤の途イIIは直接、布あるいは
刷毛等を用いることもできるが、作業の前便さ及び効率
の面からスプレーを用いることが好ましい′。このよう
にして得られた予備成形品は、成形に必要な温度に加熱
された金型内で圧縮成形される°が、予め離型剤が塗布
されているため、極めて円滑に離型することができる。In the present invention, preforming refers to shaping the resin into the shape of the final molded product.
By σ, it becomes possible to apply a mold release agent. Follow-)-
(During pre-forming, there is no need to use a mold and polishing can be selected as it is preferable for the operator.) Also, when applying a mold release agent, use a cloth or brush directly. Although it is possible to use a spray, it is preferable to use a spray from the viewpoint of ease of operation and efficiency.The preform thus obtained is compressed in a mold heated to the temperature required for molding. Since the part to be molded is coated with a mold release agent in advance, it can be released from the mold very smoothly.
(本発明の効果)
本発明によれば1、従来性なわれていた高温の金型に離
型剤処理をするという困難な作業が全く不必要になる。(Effects of the present invention) According to the present invention, 1. The difficult work of treating a high-temperature mold with a mold release agent, which was conventionally done, is completely unnecessary.
また、予備成形及び予備成形品への離型剤塗布はいずれ
も室温で行なうことができるので、その作業は極めて容
易である。Further, since both the preforming and the application of the mold release agent to the preformed product can be carried out at room temperature, the operations are extremely easy.
以下に実施例を挙げ、本発明をさらに詳述する。EXAMPLES The present invention will be explained in further detail with reference to Examples below.
実m例1
ピロメリット酸二無水物及び4−4′−ジアミノジフェ
ニルエーテルより合成したポリピロメリットイミド樹脂
(II硫酸中、30℃、0.5%で測定した対数粘度が
0.70>を室温で、80IIllφX 3 mmtの
円盤に予備成形した。この予備成形品にボロンナイトラ
イドをスプレーで塗布した後、500℃の金型を用い、
800 kq −/ o+fの圧力をかけて圧縮成形し
た。成形後、金型からの離型は極めて容易に行なわれ、
良好な成形品が得られた。Practical example 1 A polypyromellitimide resin synthesized from pyromellitic dianhydride and 4-4'-diaminodiphenyl ether (with a logarithmic viscosity of 0.70> measured at 30°C and 0.5% in II sulfuric acid) at room temperature. Then, it was preformed into a disk of 80IIllφX 3mmt.After spraying boron nitride on this preform, using a mold at 500℃,
Compression molding was performed by applying a pressure of 800 kq −/o+f. After molding, it is extremely easy to release from the mold.
A good molded product was obtained.
比較例1
ボロンナイトライドの塗イ1]をイ5なわ′/、Cい以
外は実質的に実施例1と同様な方法C゛圧縮成形を行な
った。しかしながら、成形品は金型からすみやかに離型
することかできず、成形品に破損が生じた。Comparative Example 1 Compression molding was carried out in substantially the same manner as in Example 1 except that the boron nitride coating was changed to A1 and C. However, the molded product could not be released from the mold quickly, and the molded product was damaged.
比較例2
ボロンナイトライドの塗布を金型面に行ない、実施例1
の成形を試みた。しかしながら、500℃の金型に塗布
する作業は極めて回部(であり、また均一な塗布ができ
ないため、成形品の表面にむらが生じた。Comparative Example 2 Boron nitride was applied to the mold surface, Example 1
I tried to mold it. However, the process of applying the resin to a mold at 500°C was extremely slow and the coating could not be applied uniformly, resulting in uneven surfaces of the molded products.
Claims (1)
した後、該予備成形品を加熱メ]]縮成形づることを特
徴とづる耐熱樹脂の成形方法。(1) A method for molding a heat-resistant resin, which comprises applying a mold release agent to the surface of a preformed resin molded product, and then heating the preformed product and performing compression molding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17896383A JPS6071236A (en) | 1983-09-27 | 1983-09-27 | Molding of heat resistant resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17896383A JPS6071236A (en) | 1983-09-27 | 1983-09-27 | Molding of heat resistant resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6071236A true JPS6071236A (en) | 1985-04-23 |
Family
ID=16057720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17896383A Pending JPS6071236A (en) | 1983-09-27 | 1983-09-27 | Molding of heat resistant resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6071236A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007138408A (en) * | 2005-11-15 | 2007-06-07 | Sekisui Chem Co Ltd | Soundproof movable partition structure |
-
1983
- 1983-09-27 JP JP17896383A patent/JPS6071236A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007138408A (en) * | 2005-11-15 | 2007-06-07 | Sekisui Chem Co Ltd | Soundproof movable partition structure |
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