JPH05208423A - Processing of molded thermistor - Google Patents
Processing of molded thermistorInfo
- Publication number
- JPH05208423A JPH05208423A JP4238492A JP4238492A JPH05208423A JP H05208423 A JPH05208423 A JP H05208423A JP 4238492 A JP4238492 A JP 4238492A JP 4238492 A JP4238492 A JP 4238492A JP H05208423 A JPH05208423 A JP H05208423A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- fluororesin
- thermistor
- fluorine resin
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、サーミスタのモールド
加工方法に関し、更に詳しくは、金型からの離型性を向
上させて、モールド品の形状不良を減少させることので
きるサーミスタのモールド加工方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of molding a thermistor, and more particularly, a method of molding a thermistor capable of improving mold releasability from a mold and reducing defective shapes of a molded product. It is about.
【０００２】[0002]
【従来の技術】従来、サーミスタをモールド加工するに
際しては、電線にスポット溶接したサーミスタをフッ素
樹脂チューブ内に挿入し、これをモールド用金型内にセ
ットして加熱加圧し、該フッ素樹脂チューブを溶融して
所定の形状にモールド加工することが行われている。2. Description of the Related Art Conventionally, when molding a thermistor, a thermistor spot-welded to an electric wire is inserted into a fluororesin tube, which is set in a molding die and heated and pressed to form the fluororesin tube. It is performed by melting and molding into a predetermined shape.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うな従来のモールド加工法では、図２に示すように、サ
ーミスタ１の外周で溶融したフッ素樹脂３が金型４に強
固に融着し、金型４から取り外す際に変形し、形状不良
となるという問題があった。However, in such a conventional molding method as described above, as shown in FIG. 2, the fluororesin 3 melted on the outer periphery of the thermistor 1 is firmly fused to the mold 4 to form a metal mold. There is a problem in that the shape is deformed when it is removed from the mold 4, resulting in a defective shape.
【０００４】本発明の目的は、かかる従来技術の問題点
を解消し、溶融フッ素樹脂の金型からの離型性を改良
し、形状不良のないサーミスタモールド品を製造するこ
とのできるサーミスタのモールド加工方法を提供するこ
とある。The object of the present invention is to eliminate the problems of the prior art, improve the mold releasability of the molten fluororesin from the mold, and manufacture a thermistor mold product having no shape defect. A processing method may be provided.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記目的を
達成すべく種々検討を重ねた結果、金型内面と溶融フッ
素樹脂との間に高融点のフッ素樹脂テープを介在させれ
ばよいこと見出し、本発明を完成させた。Means for Solving the Problems As a result of various studies to achieve the above object, the present inventor may interpose a high melting point fluororesin tape between the inner surface of the mold and the molten fluororesin. That is, the present invention has been completed.
【０００６】即ち、本発明は、金属内でサーミスタをフ
ッ素樹脂によりモールド加工するに際し、該フッ素樹脂
と金型内面との間に該フッ素樹脂の融点よりも高い融点
を有するフッ素樹脂テープを介在させることを特徴とす
るサーミスタのモールド加工方法である。That is, according to the present invention, when a thermistor is molded in a metal with a fluororesin, a fluororesin tape having a melting point higher than that of the fluororesin is interposed between the fluororesin and the inner surface of the mold. A method of molding a thermistor, which is characterized in that
【０００７】本発明方法を図１により説明すると、サー
ミスタ１を電線２にスポット溶接し、その上にフッ素樹
脂チューブ３をかぶせ、これをモールド用金型４内にセ
ットする。その際、金型４の内面とフッ素樹脂チューブ
３との間に、該フッ素樹脂チューブ３の融点よりも高い
融点を有するフッ素樹脂テープ５を介在させる。次い
で、所定の温度、圧力で金型を加熱加圧して、フッ素樹
脂チューブ３を溶融し、所定形状にモールド加工する。The method of the present invention will be described with reference to FIG. 1. The thermistor 1 is spot-welded to an electric wire 2, a fluororesin tube 3 is placed thereon, and the thermistor 1 is set in a molding die 4. At that time, a fluororesin tape 5 having a melting point higher than that of the fluororesin tube 3 is interposed between the inner surface of the mold 4 and the fluororesin tube 3. Next, the mold is heated and pressed at a predetermined temperature and pressure to melt the fluororesin tube 3 and mold it into a predetermined shape.
【０００８】サーミスタ１にかぶせるフッ素樹脂３とし
ては、例えばテトラフルオロエチレン−ヘキサフルオロ
プロピレン共重合体などを用いることができる。また、
チューブに限定されるものではなく、チューブ以外の任
意の形態で用いることができる。As the fluororesin 3 to cover the thermistor 1, for example, a tetrafluoroethylene-hexafluoropropylene copolymer can be used. Also,
The tube is not limited to the tube, and can be used in any form other than the tube.
【０００９】金型４の内面とフッ素樹脂３との間に介在
させるフッ素樹脂テープ５は、フッ素樹脂３の融点より
も高い融点を有することが必要であり、例えばフッ素樹
脂３として上述のテトラフルオロエチレン−ヘキサフル
オロプロピレン共重合体（ｍ．ｐ．２６０℃）を使用し
た場合は、ポリテトラフルオロエチレン（ｍ．ｐ．３２
５℃）などが好適に用いられる。フッ素樹脂テープ５の
融点がフッ素樹脂３の融点よりも低い場合は、離型性の
向上が望めず、本考案の目的を達成することができな
い。The fluororesin tape 5 interposed between the inner surface of the mold 4 and the fluororesin 3 needs to have a melting point higher than the melting point of the fluororesin 3. When an ethylene-hexafluoropropylene copolymer (mp 260 ° C.) is used, polytetrafluoroethylene (mp 32)
5 ° C.) and the like are preferably used. When the melting point of the fluororesin tape 5 is lower than the melting point of the fluororesin 3, improvement in releasability cannot be expected and the object of the present invention cannot be achieved.
【００１０】フッ素樹脂テープ５の厚さは、通常０．１
〜０．２ｍｍ程度が適当である。金型４の加熱、加圧条
件は、通常温度が２００〜３８０℃、圧力が１．０〜
２．０Ｋｇ／ｃｍ2 である。The thickness of the fluororesin tape 5 is usually 0.1.
About 0.2 mm is suitable. Regarding the heating and pressurizing conditions of the mold 4, a normal temperature is 200 to 380 ° C. and a pressure is 1.0 to
It is 2.0 Kg / cm 2 .
【００１１】[0011]
【作用】本発明方法においては、金型４の内面とフッ素
樹脂３との間に離型性の良好なフッ素樹脂テープが介在
しているため、金型４内で溶融したフッ素樹脂が金型４
に強固に融着するようなことがなく、金型４から容易に
取り外すことができ、モールド品が変形して、形状不良
となるようなことはない。In the method of the present invention, since the fluororesin tape having a good releasability is interposed between the inner surface of the die 4 and the fluororesin 3, the fluororesin melted in the die 4 becomes the die. Four
There is no strong fusion, and it can be easily removed from the mold 4, and the molded product will not be deformed to cause a defective shape.
【００１２】[0012]
【実施例】以下、実施例により本発明方法を更に詳細に
説明する。スポット溶接により電線に接続させたダイオ
ード型サーミスタを、内径３．２ｍｍ、肉厚０．９５ｍ
ｍ、長さ４５ｍｍのテトラフルオロエチレン−ヘキサフ
ルオロプロピレン共重合体チューブ内に挿入し、モール
ド用金型内にセットした。その際、上下金型とテトラフ
ルオロエチレン−ヘキサフルオロプロピレン共重合体チ
ューブとの間には、厚さ０．１ｍｍ、幅２０ｍｍ、長さ
６０ｍｍのポリテトラフルオロエチレンテープを配設し
た。次いで、プレス機により、圧力１．８Ｋｇ／ｃ
ｍ2 、温度２８０℃で３分間加圧、加熱し、サーミスタ
モールド品を作成した。EXAMPLES The method of the present invention will be described in more detail below with reference to examples. A diode type thermistor connected to an electric wire by spot welding has an inner diameter of 3.2 mm and a wall thickness of 0.95 m.
It was inserted into a tetrafluoroethylene-hexafluoropropylene copolymer tube having a length of m and a length of 45 mm and set in a molding die. At that time, a polytetrafluoroethylene tape having a thickness of 0.1 mm, a width of 20 mm and a length of 60 mm was arranged between the upper and lower molds and the tetrafluoroethylene-hexafluoropropylene copolymer tube. Then, with a press machine, pressure 1.8 Kg / c
The thermistor mold product was prepared by pressurizing and heating at m 2 and a temperature of 280 ° C. for 3 minutes.
【００１３】この方法により、１０個のモールド品を作
成したところ、いずれも金型からの離型性は良好で、形
状不良の発生はなかった。When 10 pieces of molded products were prepared by this method, all of them had good mold releasability from the mold and no defective shape.
【００１４】比較例 一方、比較のために、上記実施例において、ポリテトラ
フルオロエチレンテープを使用せず、その他の条件は上
記実施例と同一にしてモールド加工を行ったところ、金
型からの離型性が悪く、１０個のモールド品がすべて形
状不良となった。Comparative Example On the other hand, for comparison, in the above example, the polytetrafluoroethylene tape was not used, and the other conditions were the same as those in the above example. The moldability was poor, and all 10 molded products had defective shapes.
【００１５】[0015]
【発明の効果】本発明方法によれば、サーミスタモール
ド品の金型からの離型性が向上し、モールド品の形状不
良発生がなくなり作業性も大幅に向上する。According to the method of the present invention, the releasability of the thermistor molded product from the mold is improved, the defective shape of the molded product is eliminated, and the workability is greatly improved.
【図１】本発明方法を説明するための装置の断面図であ
る。1 is a cross-sectional view of an apparatus for explaining the method of the present invention.
【図２】従来の方法を説明するための装置の断面図であ
る。FIG. 2 is a cross-sectional view of an apparatus for explaining a conventional method.
１ サーミスタ ３ フッ素樹脂 ４ 金型 ５ フッ素樹脂テープ 1 Thermistor 3 Fluorine resin 4 Mold 5 Fluorine resin tape
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｋ 105:20 Ｂ２９Ｌ 31:00 4Ｆ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI Technical display area B29K 105: 20 B29L 31:00 4F
Claims (1)
モールド加工するに際し、該フッ素樹脂と金型内面との
間に該フッ素樹脂の融点よりも高い融点を有するフッ素
樹脂テープを介在させることを特徴とするサーミスタの
モールド加工方法。1. When molding a thermistor with a fluororesin in a mold, a fluororesin tape having a melting point higher than the melting point of the fluororesin is interposed between the fluororesin and the inner surface of the mold. Molding method for the thermistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4238492A JPH05208423A (en) | 1992-01-30 | 1992-01-30 | Processing of molded thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4238492A JPH05208423A (en) | 1992-01-30 | 1992-01-30 | Processing of molded thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05208423A true JPH05208423A (en) | 1993-08-20 |
Family
ID=12634575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4238492A Pending JPH05208423A (en) | 1992-01-30 | 1992-01-30 | Processing of molded thermistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05208423A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110044375A1 (en) * | 2008-03-13 | 2011-02-24 | Gerald Kloiber | Sensing device for detecting a physical quantity and method for producing said sensor |
| US20190265108A1 (en) * | 2017-03-16 | 2019-08-29 | Shibaura Electronics Co., Ltd. | Temperature sensor |
| EP3115759B1 (en) | 2014-03-07 | 2020-02-26 | Shibaura Electronics Co., Ltd. | Temperature sensor and temperature sensor manufacturing method |
-
1992
- 1992-01-30 JP JP4238492A patent/JPH05208423A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110044375A1 (en) * | 2008-03-13 | 2011-02-24 | Gerald Kloiber | Sensing device for detecting a physical quantity and method for producing said sensor |
| US9370887B2 (en) | 2008-03-13 | 2016-06-21 | Epcos Ag | Sensing device for detecting a physical quantity and method for producing said sensor |
| EP3115759B1 (en) | 2014-03-07 | 2020-02-26 | Shibaura Electronics Co., Ltd. | Temperature sensor and temperature sensor manufacturing method |
| EP3115759B2 (en) † | 2014-03-07 | 2023-04-26 | Shibaura Electronics Co., Ltd. | Temperature sensor and temperature sensor manufacturing method |
| US20190265108A1 (en) * | 2017-03-16 | 2019-08-29 | Shibaura Electronics Co., Ltd. | Temperature sensor |
| US10935434B2 (en) * | 2017-03-16 | 2021-03-02 | Shibaura Electronics Co., Ltd. | Temperature sensor |
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