JPH0371010B2 - - Google Patents
Info
- Publication number
- JPH0371010B2 JPH0371010B2 JP59159213A JP15921384A JPH0371010B2 JP H0371010 B2 JPH0371010 B2 JP H0371010B2 JP 59159213 A JP59159213 A JP 59159213A JP 15921384 A JP15921384 A JP 15921384A JP H0371010 B2 JPH0371010 B2 JP H0371010B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- mold
- molds
- engraved
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 4
- 238000000071 blow moulding Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C49/00—Blow-moulding, i.e. blowing a preform or parison to a desired shape within a mould; Apparatus therefor
- B29C49/42—Component parts, details or accessories; Auxiliary operations
- B29C49/48—Moulds
- B29C49/4823—Moulds with incorporated heating or cooling means
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、中空成形用金型で特に中空容器の表
面の一部に商標、マーク等の凹凸模様を中空成形
と同時に賦形するようにした中空成形用金型に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a hollow mold for forming a hollow container, in particular a mold for molding a hollow container, in which an uneven pattern such as a trademark or a mark is formed on a part of the surface of the hollow container simultaneously with the blow molding. This relates to a mold for molding.
従来の技術
中空成形に用いられる分割金型は内部に冷却水
が通してあつて均一に冷却されており、上記凹凸
模様を彫刻した彫刻部分とそれ以外の部分とは均
一な温度になつている。Conventional technology Split molds used for hollow molding have cooling water passed through them and are cooled uniformly, so that the engraved part with the above-mentioned uneven pattern and the other parts are at a uniform temperature. .
発明が解決しようとする問題点
金型に設けた彫刻部分を成形体の正面に賦形す
る場合、キヤビテイ表面の温度が低いとその賦形
性が悪くなる。特にブロー比が1.5倍以上である
と、パリスン自体も冷えてきて彫刻部分で樹脂が
伸びず文字や図形等の凹凸模様が鮮明に再現され
ない。Problems to be Solved by the Invention When shaping an engraved part provided in a mold onto the front surface of a molded article, if the temperature of the cavity surface is low, the shaping performance deteriorates. In particular, if the blow ratio is 1.5 times or more, the parison itself will cool down and the resin will not stretch in the engraved area, making it impossible to clearly reproduce uneven patterns such as letters and figures.
ところが従来の金型は上記したように金型全体
が均一に冷却されていること、及びこの金型の温
度は成形サイクルを短くして成形能率を向上する
ためにある程度低くおさえられていることによ
り、凹凸模様を彫刻した彫刻部分の温度は凹凸模
様を良好に賦形できるための温度より低くなつて
いた。 However, as mentioned above, with conventional molds, the entire mold is cooled uniformly, and the temperature of this mold is kept low to a certain extent in order to shorten the molding cycle and improve molding efficiency. The temperature of the engraved part where the uneven pattern was engraved was lower than the temperature required to form the uneven pattern well.
このため、上記従来の中空成形方法にあつては
凹凸模様の賦形性が悪いという問題があつた。 For this reason, the above-mentioned conventional blow molding method had a problem in that the shapeability of the uneven pattern was poor.
この問題に対する対策としては成形サイクルを
犠牲にして金型温度を凹凸模様の賦形性が良くな
る温度まで高くするという方法がとられている。 As a countermeasure to this problem, a method has been adopted in which the mold temperature is increased to a temperature at which the shapeability of the uneven pattern is improved at the expense of the molding cycle.
しかし、この方法では冷却に要する時間が多く
なり、生産性がきわめて悪いという欠点を有して
いる。 However, this method has the disadvantage that it takes a long time for cooling and the productivity is extremely low.
本発明は上記のことにかんがみなされたもの
で、分割金型を成形サイクルにあわせた温度に冷
却した場合においても、またブロー比が1.5倍以
上であつても、成形時には彫刻部分が他の部分よ
り２〜50℃高くなつて成形品の表面への凹凸模様
の賦形を良好に行うことができ、しかもこの部分
の金型の温度降下が他の部分よりさして遅れるこ
とがなくこの凹凸模様の賦形による生産性の低下
をなくすることができるようにした中空成形用金
型を提供しようとするものである。 The present invention has been developed in consideration of the above-mentioned problems, and even when the split mold is cooled to a temperature that matches the molding cycle, and even when the blow ratio is 1.5 times or more, the engraved part does not overlap with other parts during molding. The temperature is 2 to 50°C higher than that of the molded product, making it possible to form an uneven pattern on the surface of the molded product.Moreover, the temperature drop of the mold in this area is not much slower than in other areas, making it possible to form an uneven pattern on the surface of the molded product. It is an object of the present invention to provide a hollow molding die that can eliminate a decrease in productivity due to shaping.
問題点を解決するための手段及び作用
上記目的を達成するために、本発明に係る中空
成形用金型は、分割金型の彫刻部分を他の部分と
別体にすると共に、この彫刻部分を熱伝導度
（Kcal／ｍ・hr・℃）が70以上である材料にて構
成してあり、分割金型の彫刻部分を他の部分と別
体にすることにより、成形時に彫刻部分が他の部
分より２℃以上高くなつて成形品の表面への凹凸
模様の賦形を良好に行なうことができ、また彫刻
部分を熱伝導度が70以上としたことにより、成形
時の彫刻部分の温度上昇を50℃以下におさえるこ
とができ、この部分の金型の温度降下が他の部分
よりさして遅れることがない。Means and Effects for Solving the Problems In order to achieve the above object, the hollow molding mold according to the present invention separates the engraved part of the split mold from other parts, and separates the engraved part from the other parts. It is made of a material with a thermal conductivity (Kcal/m・hr・°C) of 70 or higher, and by separating the engraved part of the split mold from other parts, the engraved part is separated from other parts during molding. The temperature of the engraved part is 2°C or more higher than that of the molded part, making it possible to form uneven patterns on the surface of the molded product.Also, by setting the thermal conductivity of the engraved part to 70 or higher, the temperature of the engraved part during molding can be increased. can be kept below 50°C, and the temperature drop in this part of the mold is not much slower than in other parts.
実施例
本発明の実施態様を図面に基づいて説明する。
図中１，２は分割金型、１ａ，２ａはそのキヤビ
テイ、７は両分割金型１，２間に押出されるパリ
スンである。３，４は0.02〜0.8mm程度の細かい
凹凸模様を彫刻した彫刻金型で、この彫刻金型
３，４は分割金型１，２と別体に、かつ密着に嵌
合してあり、ブロー比が1.5倍以上の部分に彫刻
金型３，４を構成している。そしてこの彫刻金型
３，４は熱伝導度（Kcal／ｍ・hr・℃）が70以
上の材料にて構成されていて、この彫刻金型３，
４の温度が分割金型１，２の温度に対して２〜50
℃高くなつている。５は、冷却水を通す水冷孔で
ある。Embodiments Embodiments of the present invention will be described based on the drawings.
In the figure, 1 and 2 are divided molds, 1a and 2a are cavities thereof, and 7 is a parison extruded between the two divided molds 1 and 2. 3 and 4 are engraving molds that are engraved with a fine uneven pattern of about 0.02 to 0.8 mm. These engraving molds 3 and 4 are separate and tightly fitted to the split molds 1 and 2, and are blown away. The engraving molds 3 and 4 are formed in the portion where the ratio is 1.5 times or more. The engraving molds 3 and 4 are made of a material with a thermal conductivity (Kcal/m・hr・℃) of 70 or more.
The temperature of 4 is 2 to 50% compared to the temperature of split molds 1 and 2.
The temperature is rising. 5 is a water cooling hole through which cooling water passes.
すなわち彫刻金型３，４が分割金型１，２と別
体となつて嵌合されていること、及びこの彫刻金
型３，４が熱伝導度が70以上と高い材料で構成さ
れているため、この嵌合部の温度上昇が速く、し
かも、この嵌合部における空気層等による断熱効
果により彫刻金型３，４は分割金型１，２の温度
より２℃以上高くなる。 That is, the engraving molds 3 and 4 are fitted separately from the split molds 1 and 2, and the engraving molds 3 and 4 are made of a material with a high thermal conductivity of 70 or more. Therefore, the temperature of the fitting portion increases rapidly, and the temperature of the engraving molds 3 and 4 becomes 2° C. or more higher than that of the split molds 1 and 2 due to the heat insulating effect of the air layer or the like in the fitting portion.
一方成形サイクルが進行するにつれて彫刻金型
３，４の温度は上記断熱効果にてどんどん上昇し
ようとするが、この彫刻金型３，４の構成材料の
熱伝導度が70以上であることによりその差は50℃
以下に抑えることができる。 On the other hand, as the molding cycle progresses, the temperature of the engraving molds 3 and 4 tends to rise rapidly due to the above-mentioned insulation effect, but since the thermal conductivity of the constituent materials of the engraving molds 3 and 4 is 70 or higher, The difference is 50℃
It can be kept below.
ここで、ブロー比が1.5とは、パリスン径に対
して彫刻金型３，４部分の中空容器の径が1.5倍
であるということである。一般にパリスンの薄く
なる比率とブロー比とは正比例しており、例えば
ブロー比が1.5の部分の肉厚はパリスンの肉厚の
約１／1.5になる。 Here, the blow ratio of 1.5 means that the diameter of the hollow container of the engraving molds 3 and 4 is 1.5 times the diameter of the parison. Generally, the thinning ratio of the parison is directly proportional to the blow ratio, and for example, the wall thickness of a portion where the blow ratio is 1.5 is approximately 1/1.5 of the wall thickness of the parison.
上記熱伝導度が70以上の材料としては、アルミ
ニウム、あるいはアルミニウムにマグネシウム、
マンガン、ケイ素、鉄、銅、ニツケル等を数％混
入したアルミニウム合金、及び銅、あるいは黄
銅、青銅、ベリリウム銅のような銅に亜鉛、鉛、
ケイ素、アルミニウム、鉄等を混入した銅合金、
さらに亜鉛等である。 Materials with a thermal conductivity of 70 or higher include aluminum, aluminum and magnesium,
Aluminum alloys containing a few percent of manganese, silicon, iron, copper, nickel, etc., or copper such as brass, bronze, beryllium copper, zinc, lead, etc.
Copper alloy mixed with silicon, aluminum, iron, etc.
Furthermore, there are zinc and the like.
しかして温度制御されて成形サイクルが良好な
温度に冷却されている分割金型１，２間にパリス
ン７を押出し、ついで両分割金型１，２を型締め
し、圧力流体を吹込むことにより中空容器８が成
形され、これと同時にこの中空容器８の表面に彫
刻金型３，４に彫刻した模様９が賦形される。 By extruding the parison 7 between the split molds 1 and 2 whose temperature is controlled and cooled to a temperature suitable for the molding cycle, then by clamping both the split molds 1 and 2, and by blowing pressure fluid into the molds. A hollow container 8 is molded, and at the same time, a pattern 9 engraved by the engraving molds 3 and 4 is formed on the surface of the hollow container 8.
このとき、彫刻金型３，４の温度は分割金型
１，２の温度より２〜50℃高いことにより、成形
品の表面への凹凸模様の賦形が良好に行なわれ
る。 At this time, the temperature of the engraving molds 3 and 4 is 2 to 50° C. higher than the temperature of the divided molds 1 and 2, so that the uneven pattern can be well formed on the surface of the molded product.
また上記成形工程が終了して型開きしたときに
おいて、上記彫刻金型３，４は熱伝導度が70以上
と高いため、この部分の金型の温度降下が他の部
分よりさして遅れることなく冷却される。 Furthermore, when the mold is opened after the above molding process is completed, the engraving molds 3 and 4 have a high thermal conductivity of 70 or more, so the temperature of the mold in these parts cools down without much delay compared to other parts. be done.
発明の効果
本発明によれば、分割金型を成形サイクルにあ
わせた温度に冷却した場合においても、またブロ
ー比が1.5倍以上であつても、彫刻部分が分割金
型の他の部分と別体になつていると共に、熱伝導
度が70以上と高い材料で構成されていること、及
びその嵌合部の空気層等による断熱効果により、
特別の熱源を用いることなしに、この部分が他の
部分より彫刻模様の賦形に必要十分な高温となつ
て成形品の表面への凹凸模様の賦形を良好に行う
ことができる。しかも、上記彫刻部分の熱伝導度
が70以上と大きいため、型開き時におけるこの部
分の金型の温度降下が他の部分よりさして遅れる
ことがなく、この凹凸模様の賦形による生産性の
低下をなくすることができる。Effects of the Invention According to the present invention, even when the split mold is cooled to a temperature that matches the molding cycle, and even when the blow ratio is 1.5 times or more, the engraved part is separated from other parts of the split mold. Due to the fact that it is made of a material with a high thermal conductivity of 70 or more, and the insulation effect of the air layer in the fitting part,
Without using a special heat source, this part becomes hotter than other parts, which is necessary and sufficient for forming the engraved pattern, so that the uneven pattern can be well formed on the surface of the molded product. Moreover, since the thermal conductivity of the above-mentioned engraved part is high at 70 or more, the temperature drop of the mold in this part is not much slower than in other parts when the mold is opened, and productivity decreases due to the formation of this uneven pattern. can be eliminated.
図面は本発明の実施例を示すもので、第１図は
型締め前の状態を示す断面図、第２図は型締め後
の状態を示す断面図、第３図は成形された中空容
器を示す斜視図である。
１，２は分割金型、７はパリスン。
The drawings show an embodiment of the present invention; FIG. 1 is a sectional view showing the state before the mold is clamped, FIG. 2 is a sectional view showing the state after the mold is clamped, and FIG. 3 is a sectional view showing the molded hollow container. FIG. 1 and 2 are split molds, and 7 is a parison.
Claims (1)
割金型１，２間にパリスン７をはさみこみ、その
後圧力流体を吹込んで中空成形するようにし、か
つ成形サイクルにあわせた温度に調温され、さら
にキヤビテイ内面に凹凸模様を彫刻した中空成形
用金型において、上記分割金型１，２の彫刻部分
を他の部分と別体にすると共に、この彫刻部分を
熱伝導度（Kcal／ｍ・hr・℃）が70以上である
材料にて構成したことを特徴とする中空成形用金
型。1. The parison 7 is sandwiched between the split molds 1 and 2 that can be cooled by a cooling device such as a cooling channel, and then pressure fluid is blown into the mold to perform hollow molding, and the temperature is adjusted to match the molding cycle. Furthermore, in a hollow molding mold in which an uneven pattern is engraved on the inner surface of the cavity, the engraved parts of the split molds 1 and 2 are separated from other parts, and the engraved parts have a thermal conductivity (Kcal/m・hr A blow molding mold characterized by being made of a material with a temperature of 70°C or higher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15921384A JPS6137416A (en) | 1984-07-31 | 1984-07-31 | Blow mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15921384A JPS6137416A (en) | 1984-07-31 | 1984-07-31 | Blow mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6137416A JPS6137416A (en) | 1986-02-22 |
| JPH0371010B2 true JPH0371010B2 (en) | 1991-11-11 |
Family
ID=15688796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15921384A Granted JPS6137416A (en) | 1984-07-31 | 1984-07-31 | Blow mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6137416A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0754008B2 (en) * | 1987-01-28 | 1995-06-07 | 松下電器産業株式会社 | Sanitary washing equipment |
| JP2826553B2 (en) * | 1989-06-09 | 1998-11-18 | 旭化成工業株式会社 | Decorative molding method and apparatus |
| JP5958709B2 (en) * | 2013-01-17 | 2016-08-02 | キョーラク株式会社 | Blow molding mold and blow molding container |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52110073U (en) * | 1976-02-18 | 1977-08-22 |
-
1984
- 1984-07-31 JP JP15921384A patent/JPS6137416A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6137416A (en) | 1986-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |