JPH04211912A - Mold for molding of thermoplastic resin - Google Patents
Mold for molding of thermoplastic resinInfo
- Publication number
- JPH04211912A JPH04211912A JP165591A JP165591A JPH04211912A JP H04211912 A JPH04211912 A JP H04211912A JP 165591 A JP165591 A JP 165591A JP 165591 A JP165591 A JP 165591A JP H04211912 A JPH04211912 A JP H04211912A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- thin film
- molten resin
- thermoplastic resin
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims description 20
- 238000000465 moulding Methods 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 239000010409 thin film Substances 0.000 claims abstract description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 12
- 239000010408 film Substances 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 8
- 229910001928 zirconium oxide Inorganic materials 0.000 description 8
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 7
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 238000000071 blow moulding Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004408 titanium dioxide Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、熱可塑性樹脂成形用金
型に関し、さらに詳しくは、射出成形、ブロー成形等に
より成形品表面に光沢や微細な模様を確実に形成し得る
熱可塑性樹脂成形用金型に関する。[Industrial Application Field] The present invention relates to a mold for molding a thermoplastic resin, and more specifically, a thermoplastic resin molding mold that can reliably form gloss and fine patterns on the surface of a molded product by injection molding, blow molding, etc. Regarding molds for use.
【０００２】0002
【従来の技術】従来の熱可塑性樹脂成形用金型は、通常
、一般鋼材、ステンレス鋼、ニッケル、アルミニウム合
金、銅合金等の金属材料にて作製されている。そして、
そのキャビティ内に溶融樹脂を圧入して該溶融樹脂を所
定形状とすると同時に、キャビティ表面の光沢や微細な
模様をその表面に転写した成形品を得る。BACKGROUND OF THE INVENTION Conventional molds for molding thermoplastic resins are usually made of metal materials such as general steel, stainless steel, nickel, aluminum alloy, copper alloy, and the like. and,
A molten resin is press-fitted into the cavity to shape the molten resin into a predetermined shape, and at the same time, a molded product is obtained in which the gloss and fine pattern on the surface of the cavity are transferred to the surface.
【０００３】0003
【発明が解決しようとする課題】このような金属製の金
型を用いて射出成形する場合、成形品表面の光沢や模様
を型表面の光沢や模様に近づけることは容易ではなく、
例えば、型表面の状態が不均一に転写されたり、成形品
表面にウエルドマーク、フローマーク等が発生しやすい
。その理由は次のように考えられる。射出成形用金型は
、通常、熱伝導性の良好な金属材料にて形成されている
ため、このような金型を使用して射出成形する場合、キ
ャビティ内に充填される溶融樹脂は型表面と接すると瞬
時に、樹脂表面に固化層が形成される。その上、溶融樹
脂の充填工程では型内圧が低いため、溶融樹脂は型表面
に十分に接触しない状態で、また、ゲート付近の乱流や
不整流等により溶融樹脂表面が不均一な状態で充填が進
行すると同時にその表面に固化層の生成が進む。このた
め、溶融樹脂の充填が完了と同時に所定の高圧が付与さ
れたとしても、すでに溶融樹脂表面には固化層が形成さ
れているために、型表面は十分には転写されず、また、
ウエルドマーク、フローマーク等の発生にもつながる。[Problem to be solved by the invention] When injection molding is performed using such a metal mold, it is not easy to make the gloss and pattern on the surface of the molded product close to the gloss and pattern on the mold surface.
For example, the condition of the mold surface may be transferred unevenly, or weld marks, flow marks, etc. may easily occur on the surface of the molded product. The reason may be as follows. Injection molding molds are usually made of a metal material with good thermal conductivity, so when using such molds for injection molding, the molten resin filled into the cavity will be absorbed by the mold surface. When it comes into contact with the resin, a solidified layer is instantly formed on the resin surface. Furthermore, because the pressure inside the mold is low during the molten resin filling process, the molten resin does not make sufficient contact with the mold surface, and the molten resin surface is filled unevenly due to turbulent flow or irregular flow near the gate. At the same time as this progresses, a solidified layer is formed on the surface. Therefore, even if a predetermined high pressure is applied at the same time as the filling of the molten resin is completed, the mold surface will not be sufficiently transferred because a solidified layer has already been formed on the surface of the molten resin.
It also leads to the occurrence of weld marks, flow marks, etc.
【０００４】これらの転写不良を改善するために、通常
、２つの方法が単独であるいは組み合わされて使用され
る。第１の方法は、溶融樹脂を高圧で充填して型表面に
強く押し付ける方法である。この場合、射出成形機が大
型化し、さらに、バリ、ソリ等の欠陥が発生しやすいた
めに、高精度の射出成形機が要求される。また、高圧に
耐えるように金型自体も厚肉にする必要があるため、金
型の製造にコストがかかるとともに、高圧充填により成
形品に高い内部応力が残留するために成形品の品質が低
下するという問題もある。[0004] In order to improve these transfer defects, two methods are usually used alone or in combination. The first method is to fill the mold with molten resin under high pressure and forcefully press it against the mold surface. In this case, the injection molding machine becomes large, and defects such as burrs and warpage are likely to occur, so a high-precision injection molding machine is required. In addition, the mold itself needs to be thick to withstand high pressure, which increases the cost of manufacturing the mold, and high internal stress remains in the molded product due to high pressure filling, reducing the quality of the molded product. There is also the problem of doing so.
【０００５】第２の方法は、金型全体を８０℃以上、好
ましくは９０℃以上に昇温する方法である。これにより
、充填溶融樹脂の表面に固化層が生成されることが遅延
され、充填完了後の保持圧により溶融樹脂は型表面に密
着しやすくなる。しかし、金型をこのような高温状態に
すると、キャビティ内に充填された溶融樹脂の冷却、固
化に長時間を要し、成形作業効率が著しく低下するとい
う問題が生じる。[0005] The second method is to raise the temperature of the entire mold to 80°C or higher, preferably 90°C or higher. This delays the formation of a solidified layer on the surface of the filled molten resin, and the holding pressure after filling is completed makes it easier for the molten resin to adhere to the mold surface. However, when the mold is heated to such a high temperature, it takes a long time to cool and solidify the molten resin filled in the cavity, resulting in a problem that the efficiency of the molding operation is significantly reduced.
【０００６】このような問題は、熱可塑性樹脂をブロー
成形する場合も同様に存在する。熱可塑性樹脂のブロー
成形では、通常、溶融した熱可塑性樹脂のパリソンを割
型内に配置して挟み込むと同時に、該パリソンの中に圧
縮空気を送り込んで該パリソンを膨張させ、キャビティ
に押し付けながら冷却固化することにより成形品が得ら
れる。[0006] Such problems also exist when blow molding thermoplastic resins. In blow molding of thermoplastic resin, normally a parison of molten thermoplastic resin is placed and sandwiched in a split mold, and at the same time, compressed air is sent into the parison to expand the parison, and the parison is cooled while being pressed against a cavity. A molded article is obtained by solidification.
【０００７】このようなブロー成形に使用される金型も
、通常、熱伝導性に優れた金属材料にて作製されている
ため、溶融樹脂のパリソンが型表面に接すると瞬時にそ
の表面に固化層が形成され、さらには、パリソン内部に
吹き込む空気圧力があまり高くないため、パリソンを型
表面に完全に密着させることができない。従って、型表
面の状態は、成形品表面に完全に転写されない。[0007] The molds used for such blow molding are usually made of metal materials with excellent thermal conductivity, so when the molten resin parison comes into contact with the mold surface, it instantly solidifies on the surface. A layer is formed, and furthermore, since the air pressure blown into the inside of the parison is not very high, the parison cannot be brought into complete contact with the mold surface. Therefore, the condition of the mold surface is not completely transferred to the molded product surface.
【０００８】特開昭５６−１１５２３６号公報には、キ
ャビティ内面の陽極酸化により約２００μｍの厚さの硬
質アルマイト加工が施されたアルミニウム合金製の金型
が開示されている。この公報に開示された金型は、キャ
ビティ内の型表面の成形品への転写については何も考慮
されず、加工性のよいアルミニウム合金材の表面硬度を
改善しているだけである。しかも、陽極酸化により形成
された硬質アルマイト層の表面は、通常、知られている
ように、多孔質であるために、型表面の鏡面性が得られ
ず、外観性を要求される成形品の製造には、このような
金型は使用できない。[0008] JP-A-56-115236 discloses an aluminum alloy mold in which the inner surface of the cavity is hard alumite processed to a thickness of about 200 μm by anodizing. The mold disclosed in this publication does not give any consideration to the transfer of the mold surface inside the cavity to the molded product, and merely improves the surface hardness of the aluminum alloy material, which has good workability. Moreover, the surface of the hard alumite layer formed by anodic oxidation is usually porous, so it is difficult to obtain mirror finish on the mold surface. Such molds cannot be used for manufacturing.
【０００９】本発明は、上記従来の問題を解決するもの
であり、その目的は、キャビティ内の型表面の状態を確
実に成形品表面に転写することができて、外観の美しい
成形品を得ることができる熱可塑性樹脂成形用金型を提
供することにある。The present invention solves the above-mentioned conventional problems, and its purpose is to reliably transfer the condition of the mold surface inside the cavity onto the surface of the molded product, thereby obtaining a molded product with a beautiful appearance. The object of the present invention is to provide a thermoplastic resin molding mold that can be used to mold a thermoplastic resin.
【００１０】0010
【課題を解決するための手段】本発明の熱可塑性樹脂成
形用金型は、溶融樹脂が充填されるキャビティ内の型表
面の少なくとも一部が、断熱性の薄膜でコーティング処
理されてなり、そのことにより上記目的が達成される。[Means for Solving the Problems] The thermoplastic resin molding mold of the present invention is such that at least a part of the surface of the mold inside the cavity filled with molten resin is coated with a heat insulating thin film. This achieves the above objective.
【００１１】薄膜の熱伝導率は、０．１ｃａｌ／ｃｍ・
ｓｅｃ・℃程度以下が好ましく、また、薄膜の厚さは、
０．１〜５０μｍ程度が好ましい。The thermal conductivity of the thin film is 0.1 cal/cm・
The thickness of the thin film is preferably about sec・℃ or less, and the thickness of the thin film is
The thickness is preferably about 0.1 to 50 μm.
【００１２】前記薄膜としては、酸化チタン、酸化イッ
トリウム、酸化ジルコニウム等の金属酸化物、酸化けい
素等のけい素酸化物、ガラス等のけい素系複合酸化物、
あるいはプラズマ重合プラスチック膜や電着プラスチッ
ク膜等が好ましい。The thin film may include metal oxides such as titanium oxide, yttrium oxide, and zirconium oxide, silicon oxides such as silicon oxide, silicon-based composite oxides such as glass,
Alternatively, a plasma polymerized plastic film, an electrodeposited plastic film, etc. are preferable.
【００１３】また、前記薄膜は、少なくともキャビティ
サイドに設けられていればよいが、キャビティサイドお
よびコアサイドの両方に設けられるとさらに好ましい。[0013]Although it is sufficient that the thin film is provided at least on the cavity side, it is more preferable that the thin film is provided on both the cavity side and the core side.
【００１４】[0014]
【作用】本発明の熱可塑性樹脂成形用金型では、キャビ
ティ内に充填された高温の溶融樹脂が、型表面にコーテ
ィングされた断熱性の良好な薄膜に接触すると、瞬時に
薄膜表面の温度が上昇し、溶融樹脂は該薄膜に対してす
ぐれた濡れ性および密着性を発現する。従って、溶融樹
脂表面は型内を流れる流動圧により薄膜表面と接触する
と瞬時に密着し、該溶融樹脂は薄膜表面を緻密に濡らし
ながら充填が進行し、充填が終了する。その結果、充填
が完了した樹脂に加えられる保持圧が低くても、薄膜表
面の状態は成形品表面に精密に転写され得る。また、充
填された溶融樹脂にて薄膜表面が瞬時に昇温すると、発
現される薄膜表面と溶融樹脂との濡れ性による密着性お
よび両者の界面の高温化により、充填樹脂のゲート近辺
の乱流や充填中の不整流は溶融樹脂の充填圧によって瞬
時に緩和され、溶融樹脂は薄膜表面と均一に密着される
。従って、ジェッティング、フローマーク、あるいはウ
エルドマーク等の発生が防止できる。薄膜は、０．１〜
５０μｍ程度と非常に薄いために、溶融樹脂が接触する
ことによる薄膜表面の瞬時の昇温は、１秒以下のごく短
時間で速やかに薄膜を通して放熱され、成形サイクルが
延びるおそれがなく、また、型表面の形状を損なうおそ
れもない。[Operation] In the thermoplastic resin molding mold of the present invention, when the high temperature molten resin filled in the cavity comes into contact with the thin film with good heat insulation properties coated on the mold surface, the temperature of the thin film surface instantly increases. The molten resin exhibits excellent wettability and adhesion to the thin film. Therefore, when the molten resin surface comes into contact with the thin film surface due to the fluid pressure flowing in the mold, the molten resin instantly adheres to the thin film surface, and filling proceeds while the molten resin densely wets the thin film surface, until the filling is completed. As a result, even if the holding pressure applied to the filled resin is low, the state of the thin film surface can be accurately transferred to the molded product surface. In addition, when the temperature of the thin film surface instantaneously rises with the filled molten resin, turbulent flow near the gate of the filled resin occurs due to the developed adhesion due to wettability between the thin film surface and the molten resin and the high temperature of the interface between the two. The irregular flow during filling is instantly alleviated by the filling pressure of the molten resin, and the molten resin is brought into uniform contact with the thin film surface. Therefore, occurrence of jetting, flow marks, weld marks, etc. can be prevented. The thin film is 0.1~
Because it is very thin, about 50 μm, the instantaneous temperature rise on the surface of the thin film due to contact with the molten resin is quickly dissipated through the thin film in a very short time of 1 second or less, and there is no risk of extending the molding cycle. There is no risk of damaging the shape of the mold surface.
【００１５】このような現象および効果は、薄膜の断熱
性、即ち熱伝導率が小さいほど、また、薄膜と溶融樹脂
との濡れ性が良好なほど、良好な結果が得られる。薄膜
の熱伝導率は、０．１ｃａｌ／ｃｍ・ｓｅｃ・℃程度以
下が特に好ましく、また、薄膜の濡れ性は水との接触角
で３０度以下、特に１５度以下が好ましい。[0015] Regarding such phenomena and effects, the lower the heat insulating property, that is, the thermal conductivity, of the thin film, and the better the wettability between the thin film and the molten resin, the better results can be obtained. The thermal conductivity of the thin film is particularly preferably about 0.1 cal/cm·sec·° C. or less, and the wettability of the thin film is preferably 30 degrees or less, especially 15 degrees or less in terms of contact angle with water.
【００１６】[0016]
【実施例】以下、本発明を実施例について説明する。[Examples] The present invention will be explained below with reference to Examples.
【００１７】
（実施例１）
板状のキャビティを有するアルミニウム製の金型におい
て、キャビティ内における型表面の一面を光沢化処理し
た。そして、その表面の半分に、厚さ０．３μｍ程度の
二酸化けい素（ＳｉＯ２、熱伝導率＝０．０２ｃａｌ／
ｃｍ・ｓｅｃ・℃）の薄膜をコーティングし、残りの半
分にはこのようなコーティング処理をしなかった。この
ような金型を使用して、溶融ＡＢＳ樹脂（アクリロニト
リル−ブタジエン−スチレン共重合樹脂）製の板状の成
形品を射出成形により製造した。金型の温度は６０℃と
し、２２０℃の溶融ＡＢＳ樹脂をキャビティ内に充填し
た。キャビティ内におけるコーティング表面およびコー
ティングされていない表面に特殊熱電対をそれぞれ配置
して、溶融樹脂がキャビテイ内に充填されたときのそれ
ぞれの型表面温度を測定したところ、二酸化けい素膜が
コーティングされた表面は瞬時に１３３℃に上昇した。
これに対して、コーティング処理されていない表面は、
瞬時に８５℃までしか上昇しなかった。得られた成形品
は、二酸化けい素のコーティング膜に接触した部分が、
非コーティング処理表面に接触した部分に比較して、格
段に光沢があり、型表面の状態がきわめて良好に転写さ
れていた。(Example 1) In an aluminum mold having a plate-shaped cavity, one surface of the mold surface inside the cavity was treated to make it glossy. Then, on half of its surface, silicon dioxide (SiO2, thermal conductivity = 0.02 cal/
cm·sec·°C), and the other half was not subjected to such coating treatment. Using such a mold, a plate-shaped molded product made of molten ABS resin (acrylonitrile-butadiene-styrene copolymer resin) was manufactured by injection molding. The temperature of the mold was 60°C, and the cavity was filled with molten ABS resin at 220°C. Special thermocouples were placed on the coated and uncoated surfaces of the cavity to measure the surface temperature of each mold when the cavity was filled with molten resin, and it was found that the silicon dioxide film was coated. The temperature of the surface instantly rose to 133°C. In contrast, uncoated surfaces
The temperature only rose to 85°C instantly. The part of the obtained molded product that came into contact with the silicon dioxide coating film was
Compared to the part that came into contact with the non-coated surface, it was much more glossy and the condition of the mold surface was transferred very well.
【００１８】
（実施例２）
金型材料として一般鋼を使用した以外は実施例１と同様
の条件で、板状のＡＢＳ樹脂成形品を製造した。二酸化
けい素膜処理表面は、ＡＢＳ樹脂充填時に、瞬時に１３
７℃にまで上昇したが、コーティング処理されていない
表面は、８６℃にまでしか上昇しなかった。得られた成
形品は、二酸化けい素のコーティング膜に接触した部分
が、非コーティング処理表面に接触した部分に比較して
、格段に光沢があり、型表面の状態がきわめて良好に転
写されていた。(Example 2) A plate-shaped ABS resin molded product was manufactured under the same conditions as in Example 1 except that general steel was used as the mold material. The silicon dioxide film treated surface instantly becomes 13% when filled with ABS resin.
The temperature increased to 7°C, while the uncoated surface only increased to 86°C. In the resulting molded product, the part that came into contact with the silicon dioxide coating film was much more glossy than the part that came into contact with the non-coated surface, and the condition of the mold surface was transferred very well. .
【００１９】
（実施例３）
光沢化処理された型表面の半分に、０．３μｍ程度の二
酸化チタン（ＴｉＯ２、熱伝導率＝０．０２ｃａｌ／ｃ
ｍ・ｓｅｃ・℃）の薄膜をコーティングしたこと以外は
実施例１と同様の条件で、板状のＡＢＳ樹脂成形品を製
造した。二酸化チタンの表面温度は、溶融樹脂の充填に
より、瞬時に１３６℃まで上昇したが、コーティング処
理されていない表面は、８４℃にまでしか上昇しなかっ
た。得られた成形品は、二酸化チタンのコーティング膜
に接触した部分が、非コーティング処理表面に接触した
部分に比較して格段に光沢があり、型表面の状態がきわ
めて良好に転写されていた。(Example 3) About 0.3 μm of titanium dioxide (TiO2, thermal conductivity = 0.02 cal/c) was applied to half of the gloss-treated mold surface.
A plate-shaped ABS resin molded product was manufactured under the same conditions as in Example 1, except that a thin film of m·sec·°C) was coated. The surface temperature of titanium dioxide instantly rose to 136°C due to filling with molten resin, but the uncoated surface only rose to 84°C. In the obtained molded article, the part that came into contact with the titanium dioxide coating film was much more glossy than the part that came into contact with the uncoated surface, and the condition of the mold surface was transferred very well.
【００２０】
（実施例４）
金型材料として一般鋼を使用した以外は実施例３と同様
である。二酸化チタンの表面温度は、溶融樹脂の充填に
より、瞬時に１４０℃まで上昇したが、コーティング処
理されていない表面は、８６℃にまでしか上昇しなかっ
た。
得られた成形品は、酸化チタンのコーティング膜に接触
した部分が、非コーティング処理表面に接触した部分に
比較して、格段に光沢があり、型表面の状態がきわめて
良好に転写されていた。(Example 4) The same as Example 3 except that general steel was used as the mold material. The surface temperature of titanium dioxide instantly rose to 140°C due to filling with the molten resin, but the uncoated surface only rose to 86°C. In the obtained molded article, the part that came into contact with the titanium oxide coating film was much more glossy than the part that came into contact with the uncoated surface, and the condition of the mold surface was transferred very well.
【００２１】
（実施例５）
光沢化処理された型表面の半分に、０．３μｍ程度の酸
化イットリウム（Ｙ２Ｏ３）の薄膜をコーティングした
こと以外は実施例１と同様の条件で、板状のＡＢＳ樹脂
成形品を製造した。酸化イットリウムの表面温度は、溶
融樹脂の充填により、瞬時に１４７℃まで上昇したが、
コーティング処理されていない表面は、８３℃にまでし
か上昇しなかった。得られた成形品は、酸化イットリウ
ムのコーティング膜に接触した部分が、非コーティング
処理表面に接触した部分に比較して、格段に光沢があり
、型表面の状態がきわめて良好に転写されていた。(Example 5) A plate-shaped ABS was manufactured under the same conditions as in Example 1, except that half of the gloss-treated mold surface was coated with a thin film of yttrium oxide (Y2O3) of about 0.3 μm. A resin molded product was manufactured. The surface temperature of yttrium oxide instantly rose to 147°C due to filling with molten resin, but
The uncoated surface only rose to 83°C. In the obtained molded article, the part that came into contact with the yttrium oxide coating film was much more glossy than the part that came into contact with the uncoated surface, and the condition of the mold surface was transferred very well.
【００２２】
（実施例６）
金型材料として一般鋼を使用した以外は実施例５と同様
である。酸化イットリウムの表面温度は、溶融樹脂の充
填により、瞬時に１５２℃まで上昇したが、コーティン
グ処理されていない表面は、８５℃にまでしか上昇しな
かった。得られた成形品は、酸化イットリウムのコーテ
ィング膜に接触した部分が、非コーティング処理表面に
接触した部分に比較して、格段に光沢があり、型表面の
状態がきわめて良好に転写されていた。(Example 6) The same as Example 5 except that general steel was used as the mold material. The surface temperature of the yttrium oxide instantly rose to 152°C due to filling with the molten resin, but the uncoated surface only rose to 85°C. In the obtained molded article, the part that came into contact with the yttrium oxide coating film was much more glossy than the part that came into contact with the uncoated surface, and the condition of the mold surface was transferred very well.
【００２３】
（実施例７）
光沢化処理された型表面の半分に、０．３μｍ程度の酸
化ジルコニウム（ＺｒＯ２、熱伝導率＝０．００６４）
の薄膜を形成したこと以外は実施例１と同様である。酸
化ジルコニウムの表面温度は、溶融樹脂の充填により、
瞬時に１５７℃まで上昇したが、コーティング処理され
ていない表面は、８３℃にまでしか上昇しなかった。得
られた成形品は、酸化ジルコニウムのコーティング膜に
接触した部分が、非コーティング処理表面に接触した部
分に比較して、格段に光沢があり、型表面の状態がきわ
めて良好に転写されていた。(Example 7) Zirconium oxide (ZrO2, thermal conductivity = 0.0064) with a thickness of about 0.3 μm was placed on half of the surface of the mold that had been brightened.
The process was the same as in Example 1 except that a thin film was formed. The surface temperature of zirconium oxide increases due to filling with molten resin.
It instantly rose to 157°C, but the uncoated surface only rose to 83°C. In the resulting molded article, the part that came into contact with the zirconium oxide coating film was much glossier than the part that came into contact with the uncoated surface, and the condition of the mold surface was transferred very well.
【００２４】
（実施例８）
金型材料として一般鋼を使用した以外は実施例７と同様
である。酸化ジルコニウムの表面温度は、溶融樹脂の充
填により、瞬時に１６２℃まで上昇したが、コーティン
グ処理されていない表面は、８５℃にまでしか上昇しな
かった。得られた成形品は、酸化ジルコニウムのコーテ
ィング膜に接触した部分が、非コーティング処理表面に
接触した部分に比較して、格段に光沢があり、型表面の
状態がきわめて良好に転写されていた。(Example 8) The same as Example 7 except that general steel was used as the mold material. The surface temperature of the zirconium oxide instantly rose to 162°C due to filling with the molten resin, but the uncoated surface only rose to 85°C. In the resulting molded article, the part that came into contact with the zirconium oxide coating film was much glossier than the part that came into contact with the uncoated surface, and the condition of the mold surface was transferred very well.
【００２５】
（実施例９）
金型材料として銅合金を使用したこと以外は実施例７と
同様である。酸化ジルコニウムの表面温度は、溶融樹脂
の充填により、瞬時に１２６℃まで上昇したが、コーテ
ィング処理されていない表面は、７９℃にまでしか上昇
しなかった。得られた成形品は、酸化ジルコニウムのコ
ーティング膜に接触した部分が、非コーティング処理表
面に接触した部分に比較して、格段に光沢があり、型表
面の状態がきわめて良好に転写されていた。(Example 9) The same as Example 7 except that copper alloy was used as the mold material. The surface temperature of the zirconium oxide instantly rose to 126°C due to filling with the molten resin, but the uncoated surface only rose to 79°C. In the resulting molded article, the part that came into contact with the zirconium oxide coating film was much glossier than the part that came into contact with the uncoated surface, and the condition of the mold surface was transferred very well.
【００２６】[0026]
【発明の効果】本発明の熱可塑性樹脂成形用金型は、こ
のように、熱伝導率が小さい薄膜によってキャビティ内
の型表面をコーティングしているために、充填される溶
融樹脂により薄膜の表面温度が瞬時に昇温される。これ
により、型表面と溶融樹脂との濡れ性および密着性が発
現されるため、従来よりも低圧で型表面の状態を成形品
表面に精密に転写することができる。また、キャビティ
内に充填された溶融樹脂は、接触する薄膜表面が瞬時に
昇温されるため、溶融樹脂表面での乱流や不整流が瞬時
に緩和され、成形品表面にフローマーク、ウエルドマー
ク等の発生が防止できる。さらに、表面処理膜は薄膜の
ために、型表面の形状がくずれたり、状態が損なわれる
ことなく成形品に転写される。また、昇温した薄膜表面
は急速に冷却され、成形サイクルが延びるおそれもない
。このように、本発明の熱可塑性樹脂成形用金型は、溶
融樹脂の充填圧力が従来より低圧で転写不良や表面欠陥
の発生が解決され、しかも、美しい外観を有する高品質
の成形品が安定的に得られ、しかも、生産性が向上する
。また、本発明の金型を使用してヒケ防止低発泡成形を
行うと、従来よりもさらに低温での中心部のみが発泡し
た成形品表面のきれいな薄肉成形が可能である。Effects of the Invention In the thermoplastic resin molding mold of the present invention, since the mold surface inside the cavity is coated with a thin film having low thermal conductivity, the surface of the thin film is The temperature is raised instantly. As a result, wettability and adhesion between the mold surface and the molten resin are developed, so that the state of the mold surface can be accurately transferred to the molded product surface at a lower pressure than before. In addition, the molten resin filled in the cavity instantly raises the temperature of the thin film surface it comes into contact with, which instantly alleviates turbulence and irregular flow on the molten resin surface, resulting in flow marks and weld marks on the surface of the molded product. etc. can be prevented from occurring. Furthermore, since the surface treatment film is a thin film, it can be transferred to a molded product without distorting the shape of the mold surface or damaging its condition. Furthermore, the heated thin film surface is rapidly cooled, and there is no fear that the molding cycle will be extended. As described above, the thermoplastic resin molding mold of the present invention solves the problem of poor transfer and surface defects by filling the molten resin at a lower pressure than conventional ones, and moreover, it can stably produce high-quality molded products with a beautiful appearance. can be obtained, and productivity is improved. In addition, when the mold of the present invention is used to perform sink-proof, low-foam molding, it is possible to perform thin-wall molding with a clean surface of a molded product in which only the center portion is foamed at a lower temperature than before.
Claims (7)
型表面の少なくとも一部が、断熱性の薄膜でコーティン
グ処理されている熱可塑性樹脂成形用金型。1. A mold for molding a thermoplastic resin, wherein at least a part of the surface of the mold inside a cavity filled with molten resin is coated with a heat-insulating thin film.
／ｃｍ・ｓｅｃ・℃程度以下である請求項１に記載の熱
可塑性樹脂成形用金型。2. The thin film has a thermal conductivity of 0.1 cal.
2. The mold for thermoplastic resin molding according to claim 1, which has a temperature of about /cm·sec·°C or less.
程度である請求項１に記載の熱可塑性樹脂成形用金型。3. The thickness of the thin film is 0.1 to 50 μm.
The mold for thermoplastic resin molding according to claim 1, wherein the mold is about the same size as the mold.
度以下の濡れ性を有している請求項１に記載の熱可塑性
樹脂金型。4. The thermoplastic resin mold according to claim 1, wherein the thin film has wettability with a contact angle with water of about 30 degrees or less.
、けい素系複合酸化物、あるいはプラスチックである請
求項１に記載の熱可塑性樹脂成形用金型。5. The mold for thermoplastic resin molding according to claim 1, wherein the thin film is a metal oxide, a silicon oxide, a silicon-based composite oxide, or a plastic.
れている請求項１に記載の熱可塑性樹脂成形用金型。6. The thermoplastic resin molding die according to claim 1, wherein the thin film is provided on a cavity side.
アサイドの両方に設けられている請求項１に記載の熱可
塑性樹脂成形用金型。7. The thermoplastic resin mold according to claim 1, wherein the thin film is provided on both the cavity side and the core side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP165591A JPH04211912A (en) | 1990-01-10 | 1991-01-10 | Mold for molding of thermoplastic resin |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP382490 | 1990-01-10 | ||
| JP2-3824 | 1990-01-10 | ||
| JP165591A JPH04211912A (en) | 1990-01-10 | 1991-01-10 | Mold for molding of thermoplastic resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04211912A true JPH04211912A (en) | 1992-08-03 |
Family
ID=26334929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP165591A Pending JPH04211912A (en) | 1990-01-10 | 1991-01-10 | Mold for molding of thermoplastic resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04211912A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0866927A (en) * | 1994-06-22 | 1996-03-12 | Asahi Chem Ind Co Ltd | Matte synthetic resin injection-molded article and manufacture thereof |
| JP2008105229A (en) * | 2006-10-24 | 2008-05-08 | Niles Co Ltd | Mold for resin product |
| US7784764B2 (en) | 2004-11-02 | 2010-08-31 | Towa Corporation | Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material |
| US20120076886A1 (en) * | 2004-03-26 | 2012-03-29 | Takaki Kuno | Method of evaluating adhesion property, low-adhesion material, and mold for molding resin |
-
1991
- 1991-01-10 JP JP165591A patent/JPH04211912A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0866927A (en) * | 1994-06-22 | 1996-03-12 | Asahi Chem Ind Co Ltd | Matte synthetic resin injection-molded article and manufacture thereof |
| US20120076886A1 (en) * | 2004-03-26 | 2012-03-29 | Takaki Kuno | Method of evaluating adhesion property, low-adhesion material, and mold for molding resin |
| US7784764B2 (en) | 2004-11-02 | 2010-08-31 | Towa Corporation | Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material |
| JP2008105229A (en) * | 2006-10-24 | 2008-05-08 | Niles Co Ltd | Mold for resin product |
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