JPS6071148U - diode - Google Patents
diodeInfo
- Publication number
- JPS6071148U JPS6071148U JP16421383U JP16421383U JPS6071148U JP S6071148 U JPS6071148 U JP S6071148U JP 16421383 U JP16421383 U JP 16421383U JP 16421383 U JP16421383 U JP 16421383U JP S6071148 U JPS6071148 U JP S6071148U
- Authority
- JP
- Japan
- Prior art keywords
- diode
- protrusion
- electrode
- lower electrode
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例の断面図、第2図はこの考案の実施例を
示す断面図、第3図は下電極の平面図、第4図A、 B
は別の実施例における下電極の平面図と側面図、第5図
A、 Bは更に別の実施例における下電極の平面図と側
面図である。
1・・・・・・パッケージ、2・・・・・・上電極、3
・・・・・・下電極、6・・・・・・ダイオードチップ
、7・・・・・・表面、9・・・・・・突部。Figure 1 is a sectional view of a conventional example, Figure 2 is a sectional view of an embodiment of this invention, Figure 3 is a plan view of the lower electrode, and Figures 4A and B.
5A and 5B are a plan view and a side view of a lower electrode in another embodiment, and FIGS. 5A and 5B are a plan view and a side view of a lower electrode in yet another embodiment. 1... Package, 2... Upper electrode, 3
...Lower electrode, 6...Diode chip, 7...Surface, 9...Protrusion.
Claims (1)
下電極を挿入し、前記上下電極間でダイオードチップを
挾持してなるダイオードにおいて、前記下電極の表面に
突部を設け、前記突部の頂面に前記パッケージの下端を
のせてなるダイオード。, in a diode in which an upper electrode and a lower electrode are inserted into the upper and lower ends of a glass cylindrical package, and a diode chip is sandwiched between the upper and lower electrodes, a protrusion is provided on the surface of the lower electrode, and the protrusion A diode with the lower end of the package placed on the top surface of the diode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16421383U JPS6071148U (en) | 1983-10-24 | 1983-10-24 | diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16421383U JPS6071148U (en) | 1983-10-24 | 1983-10-24 | diode |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6071148U true JPS6071148U (en) | 1985-05-20 |
JPH0414938Y2 JPH0414938Y2 (en) | 1992-04-03 |
Family
ID=30360081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16421383U Granted JPS6071148U (en) | 1983-10-24 | 1983-10-24 | diode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6071148U (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5828859A (en) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | Leadless glass sealing diode |
JPS5869953U (en) * | 1981-11-02 | 1983-05-12 | 日本電気株式会社 | semiconductor equipment |
JPS5943558A (en) * | 1982-09-02 | 1984-03-10 | Sumitomo Electric Ind Ltd | Diode electrode part |
-
1983
- 1983-10-24 JP JP16421383U patent/JPS6071148U/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5828859A (en) * | 1981-08-13 | 1983-02-19 | Matsushita Electronics Corp | Leadless glass sealing diode |
JPS5869953U (en) * | 1981-11-02 | 1983-05-12 | 日本電気株式会社 | semiconductor equipment |
JPS5943558A (en) * | 1982-09-02 | 1984-03-10 | Sumitomo Electric Ind Ltd | Diode electrode part |
Also Published As
Publication number | Publication date |
---|---|
JPH0414938Y2 (en) | 1992-04-03 |
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