JPS6059745A - Probe substrate for measuring semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To enable to shorten the time of measuring a wafer by providing a plurality of holes in which probes are aligned on a probe card, thereby increasing the number of parallel measurements. CONSTITUTION:Two holes 4, 5 are provided at an insulating plate 1, and probes 4a, 4b and 5a, 5b to be used for individual LSIs are disposed along the edges of the plate. A distance Z between the two holes 4, 5 is set to serveral integer times of a pitch (y). Thus, even if there is a probe which is disposed adjacently out of the pitch, two parallel measurements can be expanded to four parallel measurements for a probe card. When the wafer is measured by using this probe card, the feeding pitch of the wafer may be x in term of X direction, but when it is fed at y Z/y times in term of Y direction, it is jumped ahead by Z+y, and it is again fed at y Z/y times. This system may be employed.

Description

Detailed Description of the Invention The present invention relates to a probe substrate used for measuring semiconductor integrated circuits arranged at a constant pitch on a semiconductor substrate.With the recent progress in LSI manufacturing technology, the functions of LSI chips have also expanded dramatically. The amount of time it takes to measure these characteristics is also increasing. This increase in time has a serious effect of reducing efficiency during LSI production. For this reason, it is possible to measure multiple LSIs in parallel at the same time (
(hereinafter abbreviated as "parallel measurement"), but in any case, measurements are taken after the LSIs have been assembled into a package, but measurements are taken when the LSIs are lined up on a wafer, which is a semiconductor substrate, and are not separated. (hereinafter abbreviated as wafer measurement) involves various problems. One of these issues is
There is a problem with the measurement probe board (hereinafter referred to as the globe card).

In the conventional parallel measurement of wafers, at most two to four wafers were measured simultaneously.

Recently, parallel measurement of eight or more units has also been studied. At this time, as a problem in probe card design,
The placement of the probe for electrical connection with the LSI on the wafer has emerged as a problem.

FIG. 1 is a plan view of a conventional probe card that can perform two parallel measurements. In the figure, an opening 2 is provided in an insulating plate 1, and a plurality of probes 3a and a plurality of probes 3b are arranged along the edge of the opening.

X and y are the pitches at which the LSIs to be measured are arranged on the wafer. As is clear from Fig. 1, when trying to make the aperture 2 larger and arrange the probes for two parallel measurements, four or eight probes, one of the probes 3a and 3b. Because the edge part protrudes from the LSI pitch,
A newly required probe for an adjacent LSI cannot be placed.

The purpose of the present invention is to solve such a problem! An object of the present invention is to provide a probe substrate for measuring semiconductor integrated circuits which solves the above problems and makes it possible to measure three or more LSIs in parallel.

The probe substrate of the present invention has a structure in which a plurality of openings are provided in an insulating plate and a large number of probes are arranged along the edges of these openings.

Next, the present invention will be explained by examples.

FIG. 2 is a plan view showing an opening in an embodiment of the present invention, with the external outline omitted. In FIG. 2, two openings 4 and 5 are provided in the insulating plate 1, and probes 4a and 4b are provided along the respective edges of the openings 4 and 5 to target each individual LSI.
and 5a, 5b are arranged. In addition, X and y are
As in FIG. 1, the distance 2 between the two openings 4 and 5, which is the pitch at which the LSIs are lined up, is set to be an integral multiple of the pitch y. In this way, even if there is a probe protruding from the pitch and adjacent to it, it is possible to expand the probe card from 2 probes in parallel to 4 probes in parallel. When measuring a wafer, the feeding pitch of the wafer in the X direction can remain as X, but in the Y direction, if it is fed Z/y times, it will jump forward by Z + y, and then it will move Z/y times again. It is clear that we must adopt a method of sending only y. Measurement time can be shortened and production efficiency can be greatly improved.

[Brief explanation of drawings]

Fig. 1 is a plan view of a conventional probe substrate for measuring semiconductor integrated circuits, and Fig. 2 is a plan view of an embodiment of the present invention. ...Opening, 3a. 3b, 4a, 4b, 5a, 5b・----・Tip Orr
+ +', Agent Patent Attorney Uchihara, l -, Ha, "j j,
, Section 1 District Information 2

Claims (1)

[Claims] A probe substrate for semiconductor integrated circuit measurement in which an opening is provided in an insulating plate and a large number of probes are arranged along the edge of the opening, characterized by having a plurality of openings in which the probes are arranged. A probe substrate for measuring semiconductor integrated circuits.