JPS6057994A - Printed circuit board with printing resistor - Google Patents
Printed circuit board with printing resistorInfo
- Publication number
- JPS6057994A JPS6057994A JP58166961A JP16696183A JPS6057994A JP S6057994 A JPS6057994 A JP S6057994A JP 58166961 A JP58166961 A JP 58166961A JP 16696183 A JP16696183 A JP 16696183A JP S6057994 A JPS6057994 A JP S6057994A
- Authority
- JP
- Japan
- Prior art keywords
- printed
- resistor
- electrode
- ink
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本ζ゛案＆、１．１１に抗インキを印刷焼付して形成さ
れる印刷抵抗付プリント配線基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION This invention relates to a printed wiring board with a printed resistor formed by printing and baking an anti-ink on the industrial field of application of this invention.
従来例の構成とその問題点
一般にこの種の配線板の抵抗インキの印刷焼付部は第１
図の様に構成されている。同図は抵抗インキ６が印刷焼
ｆτ１された部分の断面図である。The structure of the conventional example and its problems In general, the printing part of the resistance ink of this type of wiring board is the first one.
It is configured as shown in the figure. This figure is a sectional view of a portion where the resistive ink 6 has been printed fτ1.
同図において、１けプリント配線板、２は抵抗部印刷電
極、３は１在点部電極、５はオーバーレイ、６は抵抗イ
ンキである。プリント配線板１に応じてオーバーレイ６
が印刷焼付されている。この場合、抵抗インキ６を抵抗
体として用いる場合、抵抗体の特性を悪化きせる第１要
因として、抵抗皮膜と電極部の焼料接着強度があげられ
る。だとえげ、面１歪Ｑ１１′性、耐湿度特性、耐高温
特性等において、抵抗体の特性は抵抗皮膜そのものの特
性に対１７て良好なものとｉｔいえず、近年の高性能化
の要望に必ずしも十分に対応できるものではなかった。In the figure, 1 is a printed wiring board, 2 is a resistor printed electrode, 3 is a dotted electrode, 5 is an overlay, and 6 is a resistor ink. Overlay 6 according to printed wiring board 1
is printed and baked on. In this case, when the resistive ink 6 is used as a resistor, the first factor that deteriorates the characteristics of the resistor is the adhesion strength of the firing material between the resistive film and the electrode portion. The characteristics of the resistor cannot be said to be as good as those of the resistive film itself in terms of sharpness, plane strain Q11', humidity resistance, high temperature resistance, etc., and the recent improvements in performance It was not always possible to fully meet the demands.
それでも抵抗体の高性能化が望まれた場合には抵３ 、
・ パ
抗体を印刷焼付する電極だけ、別途、銀ペーストを印刷
して、電極部接着強度を上げたり、又は抵抗体を印刷焼
付する′電極のメッキ処理の選抜、表面の洗浄等、種々
限定された条件の中で生産を１７なければ満足のいく製
品が得られなかった。又プリント配線板の抵抗インキを
オーバー１／イしだ１１Ｌ極を接点に用いる場合におい
ても、ぞの主催を刷子、接点等が当接、摺動した場合に
抵抗インキのオーバーレイの接着強度の観点かＣ）みて
、ノ、を金的にも必ずしも満足のいくものではなか−・
た。However, if higher performance of the resistor is desired,
・ There are various limitations such as printing a silver paste separately on the electrodes where the resistor antibody is printed and baked to increase the adhesive strength of the electrode, or selecting the plating treatment for the electrodes where the resistor is printed and baked, and cleaning the surface. Unless production was carried out under these conditions, a satisfactory product could not be obtained. In addition, even when using over 1/11 L poles of resistance ink for printed wiring boards as contacts, it is important to consider the adhesive strength of the overlay of resistance ink when the contact is brought into contact with a brush or the contacts slide. C) Look, it's not necessarily financially satisfactory.
Ta.
発明の目的
本発明はこの種の要望にこたえるべく、又ノ、（田に的
な構成を変えることなく、プリント配ρｉ！基板に印刷
される抵抗インキの接着強度を〜・段と向１・すること
を目的としだものである。OBJECTS OF THE INVENTION In order to meet this kind of demand, the present invention aims to improve the adhesive strength of the resistance ink printed on the printed circuit board without changing the basic structure. It is intended for the purpose of
発明の構成
この目的を達成するために、本発明は抵抗インキ電極の
接着性に着目し、表面拡大処理、例えば一般的に利用さ
れているサンドプラスト工法等を用いて抵抗インキを印
刷焼付する箇ハｊに６１面のあれだ電極を設けたもので
ある。この構成例より、一般的な）１１；本構成は変更
することなく、抵抗皮膜と電極の焼イ」接着強度を一段
と強め、抵抗体の特性を、はとんどｆｌｕ抗素子そのも
のの特性Ｋまであげることが可能であり、父、抵抗イン
キをオーバーレイした電極を接点として用いる場合にお
いてイ、その電イヤを刷子、接点等が当接、摺動した場
合に１１（抗インキ（バー４・−バーレイの接着強度が
向上し長力合作力吐（、かれＺ）。Structure of the Invention In order to achieve this object, the present invention focuses on the adhesiveness of resistive ink electrodes, and uses a surface enlarging process, such as a commonly used sandplast method, to print and bake resistive ink. 61 electrodes are provided on each side. From this configuration example, the general) 11; without changing this configuration, the adhesive strength between the resistive film and the electrode is further strengthened, and the characteristics of the resistor are almost the same as those of the flu resistive element itself. It is possible to raise up to 11 (resistance ink (bar 4 - The adhesive strength of Burley has improved, resulting in a long-lasting joint force (, Kare Z).
実施例の説明
以下本発明の実施例を第２図、第３図、第４図に示−Ｊ
−０第２図は本考案の印刷抵抗付プリント配線板の抵Ｊ
Ａ：印刷７’９１５の断面図、第３図は同基板の平面図
、第４Ｍｌ−１″第３図の基板の抵抗印刷焼付前の平面
図である。第２図において、１６はオーバーレイ、１６
目、抵抗インキである。第３図において印刷抵抗イτ１
プリント配線板１１の上にそれぞれの機能をもっ／こ回
路パターンが構成されている。すなわち、第３図におい
て抵抗部１１２Ｌ、接点部１１ｂ、半田付部１１ｃ、摺
動接点部１１ｄ、：＋５／・ −・
ネクタ一部１１θがプリント配線板１１［二に形成され
ている。ここで抵抗を印刷する電極１２と、抵抗インキ
をオーバーレイする接点部電極１３（第２図）があるが
、他の部分に影響１〜ない様にマスキングをして抵抗を
印刷する電極１２と抵抗インキをオーバーレイする接点
部電極１３に１実施例としてサンドブラストをかけ、表
面をあらす。DESCRIPTION OF EMBODIMENTS Examples of the present invention are shown in FIGS. 2, 3, and 4.
-0 Figure 2 shows the resistor of the printed wiring board with printed resistor of the present invention.
A: A cross-sectional view of printing 7'915, FIG. 3 is a plan view of the same board, and 4Ml-1'' is a plan view of the board of FIG. 3 before the resistive printing is baked. In FIG. 16
Eyes are resistive ink. In Figure 3, the printed resistance is τ1
Circuit patterns with respective functions are formed on the printed wiring board 11. That is, in FIG. 3, a resistance portion 112L, a contact portion 11b, a soldering portion 11c, a sliding contact portion 11d, and a connector portion 11θ are formed on the printed wiring board 11[2]. Here, there is an electrode 12 on which resistance is printed and a contact electrode 13 (Fig. 2) on which resistance ink is overlaid. In one embodiment, the contact electrode 13 overlaying the ink is sandblasted to roughen the surface.
１４は表面をあらされたサンドブラスト処理部である。14 is a sandblasted part whose surface has been roughened.
半田付部１１０、摺動接点部１１ｄ１コネクタ一部１１
ｅにマスキングを行なうのはそれぞれの部位により機能
が異なり、メッキ表面の１′滑性が要求される箇所など
があるため、千ノア、ぞノアの機能を損傷しないためで
ある。又、他の実施例としてプリント基板の表面をパフ
研摩するのも可能である。Soldering part 110, sliding contact part 11d1 connector part 11
The reason why masking is performed is to prevent damage to the functions of the plating surface, since each part has a different function and some parts require 1' smoothness of the plating surface. Further, as another embodiment, it is also possible to perform puff polishing on the surface of the printed circuit board.
発明の効果
以上の様に本発明は非常に簡易的な方法で実施でき、抵
抗体の特性を向上させることができるため、例えば従来
にみられる様に高性能化が望まＪ′１゜た場合において
抵抗体を印刷焼付する電停だけ、６ べ−＝ジ
別途銀ペーストを印刷して形成したりするといつた、に
つな工程が不安となり、かつ電極の精度もエツチング精
度を糾持できる。又、従来の方法では抵抗皮膜と′１ニ
極の焼付接着性の問題から抵抗体を印刷焼付する電極の
メッキ処理の選択１表面の洗浄管種々の限定された条件
があったが、本発明によれば、表向拡大処ｐｌｊにより
、電極表面の異物除去が行なえ、かつ接着強度が物理的
現象により一段と強くなるだめ、抵抗インキを印刷焼付
するプリント配線板のメッキ処理等を特に限定しなくて
も良くなり、抵抗付印刷配線板の応用範囲は広くなり、
その効果ＶＬ多大である。As described above, the present invention can be carried out in a very simple manner and can improve the characteristics of a resistor. For example, when high performance is desired as seen in the past, In the case where the resistor is printed and baked, there is no need to worry about the process of separately printing silver paste on the 6-base board, and the etching accuracy of the electrode can be maintained. In addition, in the conventional method, there were various limited conditions for selecting the plating treatment of the electrode for printing and baking the resistor due to the baking adhesion between the resistive film and the electrode. According to PLJ, surface enlargement treatment PLJ can remove foreign matter from the electrode surface and further strengthen the adhesive strength due to physical phenomena, so there are no particular restrictions on the plating treatment of printed wiring boards on which resistive ink is printed and baked. The range of applications for printed wiring boards with resistors has expanded.
The effect VL is enormous.
第１図シＪ、従来の印刷抵抗付プリント配線板の抵抗印
刷部の断面図、第２図は本ｆｅハの印刷抵抗付プリント
配線板の抵抗印刷部の断面図、第３図は本餐明の実施例
を簡易モデル化した印刷抵抗付プリント配線基板の平面
図、第４図は第３図の基板の抵抗印刷部（＝Ｊ前の平面
図である。
１１・・・・・・プリント配線板、１１ａ・・・・・・
抵抗部、１１ｂ・・・・・・接点部、１１０・・・・・
・半ｒＴｌ （＝１部、１１（１・・・・・・摺動接点
部、１１θ・・・・・・コネクタ一部、１２・・・・・
・抵抗印刷部電極、１３・・・・・・接点部゛［Ｅ極、
１４・・・・・・ザンドブラスト処理部、１６・・・・
・・オーバーレイ、１６・・・・・・抵抗インキ。
代理人の氏名 弁理１− 中 尾 敏 男 ？７１か１
名第１図
ｃＮFigure 1 C is a sectional view of the resistor printing part of a conventional printed wiring board with printed resistors, Figure 2 is a sectional view of the resistor printing part of a printed wiring board with printed resistors of this FE, and Figure 3 is the main text. FIG. 4 is a plan view of a printed wiring board with a printed resistor that is a simplified model of the embodiment shown in FIG. Wiring board, 11a...
Resistance part, 11b...Contact part, 110...
・Half rTl (=1 part, 11 (1...sliding contact part, 11θ...part of connector, 12...
・Resistance printed part electrode, 13...Contact part ゛[E pole,
14... Zandblast processing section, 16...
...Overlay, 16...Resistance ink. Name of agent Attorney 1- Toshio Nakao ? 71 or 1
Name Figure 1 cN
Claims (2)
・−レイとして抵抗体インキを印刷焼付された電極を有
するプリント配線基板において、前記低抗体を構成する
電極部と抵抗体インキによりオーバーレイされる電極部
はエツチングにて形成された金属箔で、かつ所定のメッ
キを施こされた電極とし、前記抵抗体インキを印刷焼付
する電極を部分的あるいは全面的に表面拡大処理にて表
面をあらしたことを特徴とする印刷抵抗付プリント配線
基板。(1) In a printed wiring board having at least one or more resistors and electrodes on which resistor ink is printed and baked as an overlay; The electrode part to be overlaid is a metal foil formed by etching, and the electrode is plated in a specified manner, and the electrode on which the resistor ink is printed is partially or completely surface-enlarged. A printed wiring board with a printed resistor, which is characterized by having a rough pattern.
３）電極の表面拡大処理はパフ研摩処理にて行な２ ・
゛(2) Surface enlargement treatment of the electrode is done by sandblasting [: method (
3) Electrode surface enlargement treatment is performed by puff polishing treatment2.
゛
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58166961A JPS6057994A (en) | 1983-09-09 | 1983-09-09 | Printed circuit board with printing resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58166961A JPS6057994A (en) | 1983-09-09 | 1983-09-09 | Printed circuit board with printing resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6057994A true JPS6057994A (en) | 1985-04-03 |
Family
ID=15840826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58166961A Pending JPS6057994A (en) | 1983-09-09 | 1983-09-09 | Printed circuit board with printing resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6057994A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54135364A (en) * | 1978-04-11 | 1979-10-20 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS5834701B2 (en) * | 1975-12-02 | 1983-07-28 | トヨタ自動車株式会社 | Jido Hensoku Kiyou Gear Train |
-
1983
- 1983-09-09 JP JP58166961A patent/JPS6057994A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834701B2 (en) * | 1975-12-02 | 1983-07-28 | トヨタ自動車株式会社 | Jido Hensoku Kiyou Gear Train |
| JPS54135364A (en) * | 1978-04-11 | 1979-10-20 | Matsushita Electric Ind Co Ltd | Printed circuit board |
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