JPS6057451B2 - Adhesion method of polyamide-imide film - Google Patents
Adhesion method of polyamide-imide filmInfo
- Publication number
- JPS6057451B2 JPS6057451B2 JP8836678A JP8836678A JPS6057451B2 JP S6057451 B2 JPS6057451 B2 JP S6057451B2 JP 8836678 A JP8836678 A JP 8836678A JP 8836678 A JP8836678 A JP 8836678A JP S6057451 B2 JPS6057451 B2 JP S6057451B2
- Authority
- JP
- Japan
- Prior art keywords
- formulas
- tables
- mathematical
- chemical formulas
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【発明の詳細な説明】
本発明は、優れた耐熱性および接着性を有するポリアミ
ドイミドフィルムの接着法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for adhering polyamide-imide films having excellent heat resistance and adhesive properties.
現在、ポリイミドフィルムは優れた耐熱性を有している
故に、各種電子部品に使用されているが、このポリイミ
ドフィルムは他のものに接着する際には、接着剤が必要
となり、この接着剤の為に耐熱性の低下をきたす。Currently, polyimide film is used in various electronic components because it has excellent heat resistance, but when bonding this polyimide film to other things, an adhesive is required, and this adhesive This results in a decrease in heat resistance.
一方、電子部品の高信頼化が進んでおり、優れた耐熱性
および接着性を有する耐熱性フィルムの接着法の開発が
望まれている。On the other hand, electronic components are becoming more reliable, and there is a desire to develop a method for bonding heat-resistant films that have excellent heat resistance and adhesive properties.
本発明は、芳香核の１、３の位置に結合を有する有機極
性溶媒可溶性のポリアミドフィルムはその表面を溶媒で
処理する事により、簡便な方法で均一接着が出来、かつ
優れた耐熱性および接着性を有する接着が可能てある事
実にもとづいたものである。In the present invention, an organic polar solvent-soluble polyamide film having bonds at the 1st and 3rd positions of the aromatic nucleus can be uniformly bonded by a simple method by treating its surface with a solvent, and has excellent heat resistance and adhesion. This is based on the fact that adhesives with properties are possible.
即ち、本発明は、下記一般式（１）、（２）、（３）で
表わされ還元粘度が０．３〜１．０である一種以上の芳
香族ポリアミドイミドフィルムの表面を、上記芳香族ポ
リアミドイミドを実質的に溶解する溶媒で処理した後、
圧着する事を特徴とするポリアミドイミドフィルムの接
着法（１）
〔式中のＮは、式Ｔ「
し（７」 甲 又は
（ただし、Ｒは水素原子、ハロゲン原子又はアルキル基
、Ｘは酸素原子、硫黄原子、スルホニル基、カルボニル
基、カルボキシル基、メチレン基又はジメチルメチレン
基であり、これらは互いに同一であつても異なつていて
も良い）で表わされる二価の残基、Ｎ″は式−）、＝Ｊ
「 ，一＼、−バーンー又は
（ただし、Ｒ．ｌ５Ｘとは前記と同じ意味をもつ）で”
表わされる二価の残基、ｎは正の整数である〕発明の詳
細な説明本発明は、優れた耐熱性および接着性を有する
ポリアミドイミドフィルムの接着法に関するものである
。That is, the present invention provides the surface of one or more aromatic polyamide-imide films represented by the following general formulas (1), (2), and (3) and having a reduced viscosity of 0.3 to 1.0, with the above-mentioned aromatic After treatment with a solvent that substantially dissolves the group polyamideimide,
Adhesion method of polyamide-imide film characterized by pressure bonding (1) [N in the formula is the formula T "shi(7" A) or (where R is a hydrogen atom, a halogen atom or an alkyl group, and X is an oxygen atom , a sulfur atom, a sulfonyl group, a carbonyl group, a carboxyl group, a methylene group, or a dimethylmethylene group, which may be the same or different from each other), N'' is a divalent residue represented by the formula −),=J
" , 1 \, - Burn - or (However, R.l5X has the same meaning as above)"
Divalent residue represented, n is a positive integer. DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for adhering polyamide-imide films having excellent heat resistance and adhesive properties.
現在、ポリイミドフィルムは優れた耐熱性を有している
故に、各種電子部品に使用されているが、このポリイミ
ドフィルムは他のものに接着する際には、接着剤が必要
となり、この接着剤の為に耐熱性の低下をきたす。Currently, polyimide film is used in various electronic components because it has excellent heat resistance, but when bonding this polyimide film to other things, an adhesive is required, and this adhesive This results in a decrease in heat resistance.
一方、電子部品の高信頼化が進んでおり、優れた耐熱性
および接着性を有する耐熱性フィルムの接着法の開発が
望まれている。On the other hand, electronic components are becoming more reliable, and there is a desire to develop a method for bonding heat-resistant films that have excellent heat resistance and adhesive properties.
本発明は、芳香核の１、３の位置に結合を有する有機極
性溶媒可溶性のポリアミドフィルムはその表面を溶媒で
処理する事により、簡便な方法で均一接着が出来、かつ
優れた耐熱性および接着性を有する接着が可能てある事
実にもとづいたものである。In the present invention, an organic polar solvent-soluble polyamide film having bonds at the 1st and 3rd positions of the aromatic nucleus can be uniformly bonded by a simple method by treating its surface with a solvent, and has excellent heat resistance and adhesion. This is based on the fact that adhesives with properties are possible.
即ち、本発明は、下記一般式（１）、（２）、（３）で
表わされ還元粘度が０．３〜１．０である一種以上の芳
香族ポリアミドイミドフィルムの表面を、上記芳香族ポ
リアミドイミドを実質的に溶解する溶媒で処理した後、
圧着する事を特徴とするポリアミドイミドフィルムの接
着法〔式中のＮは、式Ｔ７「
！Ｕ ！ 又は
（ただし、Ｒは水素原子、ハロゲン原子又はア，キル基
、Ｘは酸素原子、硫黄原子、スルホニル基、カルボニル
基、カルボキシル基、メチレン基又はジメチルメチレン
基であり、これらは互いに同一であつても異なつていて
も良い）で表わされる二価の残基、Ｎ″は式−ヌニー７
−，ーヌーニ２？＼−ーλ一又は
ひ．７−ゝ二（＝ニ７−（ただし、Ｒとｘとは前記と同
じ意味をもつ）で表わされる二価の残基、ｎは正の整数
である〕を提供するものである。That is, the present invention provides the surface of one or more aromatic polyamide-imide films represented by the following general formulas (1), (2), and (3) and having a reduced viscosity of 0.3 to 1.0, with the above-mentioned aromatic After treatment with a solvent that substantially dissolves the group polyamideimide,
Adhesion method of polyamide-imide film characterized by pressure bonding [N in the formula is the formula T7 "!U! or (where R is a hydrogen atom, a halogen atom, or an a, kyl group, and X is an oxygen atom or a sulfur atom. , a sulfonyl group, a carbonyl group, a carboxyl group, a methylene group, or a dimethylmethylene group, which may be the same or different from each other);
-, -Nooni 2? \--λ1 or hi. 7-ゝ2 (a divalent residue represented by = 7- (where R and x have the same meanings as above), n is a positive integer).
本発明に使用される芳香族ポリアミドイミドフィルムと
しては、のフィルムが好適であり、特に
のフィルムが好ましい。As the aromatic polyamide-imide film used in the present invention, a film of 1 is suitable, and a film of 1 is particularly preferred.
これらの芳香族ポリアミドイミドは、例えば又は（式中
のＲとＸは前記と同じ意味をもつ）で表わされる芳香族
ジアミンとトリメリット酸クロライドとを反応させるか
、あるいは一般式又は
（式中のＲ．ｌ５Ｘは前記と同じ意味をもつ）で表わさ
れるビスイミドカルボン酸とジフェニルー３・３″ージ
イソシアネートとを反応させるか、あるいは一般式０Ｃ
Ｎ−Ａｒ（又はＮ″）−ＮＣＯ（式中のＫ．ｌ５，Ａｒ
″は前記と同じ意味をもつ）で表わされるジイソシアネ
ートと、式で示されるビスイミドカルボン酸を反応させ
ることによつて製造することができる。These aromatic polyamideimides can be produced by reacting an aromatic diamine represented by or (in which R and X have the same meanings as above) with trimellitic acid chloride, or R.l5X has the same meaning as above) and diphenyl-3,3''-diisocyanate are reacted, or the general formula 0C
N-Ar (or N″)-NCO (K.l5, Ar
It can be produced by reacting a diisocyanate represented by the formula (" has the same meaning as above) with a bisimide carboxylic acid represented by the formula.
本発明に用いられる芳香族ポリアミドイミドは、還元粘
度が０．３〜１．０であることが必要である。The aromatic polyamideimide used in the present invention needs to have a reduced viscosity of 0.3 to 1.0.
還元粘度が０．３以下では機械強度が不充分であり、ま
た溶媒で処理する時に膨潤が大きく脱溶媒が困難となる
。１．０以下では溶媒で処理した時に均一な膨濶がなさ
れず、均一な接着が困難となる。If the reduced viscosity is 0.3 or less, the mechanical strength will be insufficient, and when treated with a solvent, swelling will be large and removal of the solvent will be difficult. If it is less than 1.0, uniform swelling will not occur when treated with a solvent, making uniform adhesion difficult.
上記ポリアミドイミドのフィルム作成法としては、キャ
スティング法など従来公知の方法が使用出来る。As a method for producing the polyamide-imide film, conventionally known methods such as a casting method can be used.
本発明に使用される溶媒は、前記芳香族ポリアミドイミ
ドを実質的に溶解しうるものであれば良く、特に制限は
ないが、例えばジメチルホルムアミド、ジメチルアセト
アミド、ジメチルスルホキシド、Ｎ−メチルピロリドン
、ヘキサメチルホスホルアミド、クレゾール及びこれら
と他の慣用溶一媒との混合系が好適である。The solvent used in the present invention is not particularly limited as long as it can substantially dissolve the aromatic polyamideimide, but examples include dimethylformamide, dimethylacetamide, dimethyl sulfoxide, N-methylpyrrolidone, hexamethyl Preferred are phosphoramide, cresol and mixtures thereof with other conventional solvents.
上記芳香族ポリアミドイミドフィルムの表面を溶媒で処
理する方法としては、フィルム表面に溶媒を噴霧する方
法、フィルム表面を溶媒と接触させる方法、フィルム表
面を溶媒を浸み込ませたもＪので処理する方法などがあ
り、上記ポリアミドイミドフィルムの極く表面層が溶媒
で膨潤するだけで充分である。Methods for treating the surface of the aromatic polyamide-imide film with a solvent include methods of spraying the film surface with a solvent, methods of contacting the film surface with a solvent, and methods of treating the film surface with a solvent impregnated with a solvent. There are various methods, and it is sufficient that only the very surface layer of the polyamide-imide film is swollen with a solvent.
このようにフィルム表面を溶媒で処理した後、圧着して
接着が行われる。After the film surface is treated with a solvent in this manner, adhesion is performed by pressure bonding.
圧着の方法としては通常の方法が使用できるが、加熱圧
着するのが好ましい。加熱条件としては５０〜３００℃
特に１００〜２００℃が好ましい条件である。次に、本
発明をより具体的に説明するために実施例を述べるが、
本発明はこれら実施例に限定されるものではない。Although a normal method can be used for compression bonding, heat compression bonding is preferable. Heating conditions are 50-300℃
Particularly preferred conditions are 100 to 200°C. Next, examples will be described to more specifically explain the present invention.
The present invention is not limited to these examples.
実施例１〜８
表１に示した如く、芳香族ポリアミドイミドフィルムを
溶媒で処理した後、１５０℃で３０分間加熱圧着して各
種基材に接着した。Examples 1 to 8 As shown in Table 1, aromatic polyamide-imide films were treated with a solvent and then bonded under heat and pressure at 150° C. for 30 minutes to adhere to various substrates.
その後、４００℃で１時間の耐熱性テストを行つた結果
、フクレや剥がれは見られず、優れた耐熱性および接着
性を有しており、特に、実施例１で使用したポリアミド
イミドが良好な結果を与えた。また実施例１のポリマー
を用いて、基材としてポリイミドフィルム、ガラス、銅
板を用いた場合も同様に優れた耐熱性、接着性を有して
いた。Thereafter, a heat resistance test was conducted at 400°C for 1 hour, and no blistering or peeling was observed, indicating that the polyamide-imide used in Example 1 had excellent heat resistance and adhesion. gave results. Further, when the polymer of Example 1 was used and a polyimide film, glass, or copper plate was used as the base material, similarly excellent heat resistance and adhesiveness were obtained.
Claims (1)
粘度が０．３〜１．０である一種以上の芳香族ポリアミ
ドイミドフィルムの表面を、上記芳香族ポリアミドイミ
ドを実質的に溶解する溶媒で処理した後、圧着する事を
特徴とするポリアミドイミドフィルムの接着法▲数式、
化学式、表等があります▼（１）▲数式、化学式、表等
があります▼（２）▲数式、化学式、表等があります▼
（３）〔式中のＡｒは、式▲数式、化学式、表等があり
ます▼、▲数式、化学式、表等があります▼ ▲数式、化学式、表等があります▼又は ▲数式、化学式、表等があります▼ ▲数式、化学式、表等があります▼ （ただし、Ｒは水素原子、ハロゲン原子又はアルキル基
、Ｘは酸素原子、硫黄原子、スルホニル基、カルボニル
基、カルボキシル基、メチレン基又はジメチルメチレン
基であり、これらは互いに同一であつても異なつていて
も良い）で表わされる二価の残基、Ａｒ′は式▲数式、
化学式、表等があります▼、▲数式、化学式、表等があ
ります▼ ▲数式、化学式、表等があります▼又は ▲数式、化学式、表等があります▼ （ただし、ＲとＸとは前記と同じ意味をもつ）で表わさ
れる二価の残基、ｎは正の整数である〕[Scope of Claims] 1. The surface of one or more aromatic polyamideimide films represented by the following general formulas (1), (2), and (3) and having a reduced viscosity of 0.3 to 1.0 is Adhesion method of polyamide-imide film characterized by treating with a solvent that substantially dissolves aromatic polyamide-imide and then press-bonding ▲Mathematical formula,
There are chemical formulas, tables, etc.▼(1)▲There are mathematical formulas, chemical formulas, tables, etc.▼(2)▲There are mathematical formulas, chemical formulas, tables, etc.▼
(3) [Ar in the formula is the formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ or ▲ Mathematical formulas, chemical formulas, tables, etc. There are ▼ ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (However, R is a hydrogen atom, a halogen atom, or an alkyl group, and X is an oxygen atom, a sulfur atom, a sulfonyl group, a carbonyl group, a carboxyl group, a methylene group, or a dimethylmethylene group. and these may be the same or different from each other), Ar' is the formula ▲ formula,
There are chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ or ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (However, R and X are the same as above) divalent residue represented by ), n is a positive integer]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8836678A JPS6057451B2 (en) | 1978-07-21 | 1978-07-21 | Adhesion method of polyamide-imide film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8836678A JPS6057451B2 (en) | 1978-07-21 | 1978-07-21 | Adhesion method of polyamide-imide film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5516027A JPS5516027A (en) | 1980-02-04 |
| JPS6057451B2 true JPS6057451B2 (en) | 1985-12-14 |
Family
ID=13940793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8836678A Expired JPS6057451B2 (en) | 1978-07-21 | 1978-07-21 | Adhesion method of polyamide-imide film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6057451B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2797044B2 (en) * | 1992-04-20 | 1998-09-17 | ニッポン高度紙工業 株式会社 | Bonding method and adhesive member |
| KR101870831B1 (en) * | 2017-08-18 | 2018-06-27 | 주식회사 픽슨 | A mixed corrugated steel pipe containing of adhesive composition and a preparation method thereof |
-
1978
- 1978-07-21 JP JP8836678A patent/JPS6057451B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5516027A (en) | 1980-02-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4562119A (en) | Flexible, printed circuit | |
| US4496794A (en) | Flexible base materials, their preparation and their use for printed circuits | |
| KR101854722B1 (en) | Manufacturing method of composite sheet with excellent heat resistance, chemical resistance and flexibility | |
| US4503285A (en) | Flexible base materials, their preparation and their use for printed circuits | |
| JPS6268817A (en) | Polymide and heat-resistant adhesive consisting of polyimide | |
| JP5092452B2 (en) | Modified polyamideimide resin, adhesive using the same, and printed circuit board | |
| JPH02115265A (en) | Heat-resistant film and its laminate | |
| EP0393638A2 (en) | Thermosetting resin compostion and thermosetting dry film | |
| JPH059254A (en) | Production of polyamideimidesiloxane polymer | |
| JP3687044B2 (en) | Copolymerized polyimide film and method for producing the same | |
| KR19980079256A (en) | Polyimide precursor solution, preparation method thereof, film or film obtained from such solution and preparation method of film | |
| JPS6057451B2 (en) | Adhesion method of polyamide-imide film | |
| KR20110035620A (en) | Polyimide film | |
| JPH0741559A (en) | Polyamideimide film | |
| EP0308270B1 (en) | Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof | |
| JPH0423879A (en) | Heat-resistant imide adhesive | |
| EP0260833B1 (en) | Process for producing polyamide acid having siloxane bonds and polyimide having siloxane bonds and isoindoloquinazolinedione rings | |
| JPS6159906B2 (en) | ||
| JPS6030353B2 (en) | Polyimide film with heat-resistant adhesive layer | |
| JPS63199239A (en) | Novel solvent-soluble polyimide and production thereof | |
| JPH01174439A (en) | Laminate of flexible metallic foil | |
| JPS62151458A (en) | Moisture-and heat-resistant resin composition | |
| JPH0432289A (en) | Board for flexible printed circuit and manufacture thereof | |
| JPH0670136B2 (en) | Method for producing modified polyimide composition | |
| JPH044281A (en) | Heat-resistant adhesive |