JPS605613A - Oscillator - Google Patents

Abstract

PURPOSE:To simplify constitution and facilitate manufacture and assembly by forming a wiring pattern of an oscillating piece and a conductive material on a substrate formed of a piezoelectric material. CONSTITUTION:The tuning fork type oscillating piece 2 is formed on the substrate 1 made of a quartz plate as the piezoelectric material. Further, the wiring pattern 3 is formed on the substrate 1 by vacuum-depositing gold, etc., as the conductive material. Then, a driving electrode 4 is formed on the oscillating piece 2 simultaneously with the wiring pattern 3. An IC chip 6 is fixed to the substrate 1 with a conductive adhesive, etc., and includes an oscillation circuit for driving the oscillating piece 2, a frequency dividing circuit which divides the resonance frequency of the oscillating piece 2, and other circuits. Thus, a quartz oscillator is constituted, and while the oscillating piece 2 is united with the substrate 1, the wiring pattern 3 and driving electrode 4 are formed at the same time, so the constitution is simplified, the manufacture and assembly are facilitated, and the thickness is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an oscillator using a piezoelectric vibrator.

Conventionally, in an oscillator using a crystal resonator, the crystal resonator is sealed in a sealed container and soldered to a wiring board, and a C chip is fixed on the wiring board and covered with a molding material. As a result, the number of parts increased, manufacturing was complicated, and automatic assembly was not possible.

The present invention eliminates the above-mentioned drawbacks and provides an oscillator that is simple in construction, easy to manufacture, and capable of automatic assembly.

Examples of the present invention will be described in detail below.

In FIGS. 1 to 3, reference numeral 1 denotes a substrate made of a quartz plate, which is a piezoelectric material. A tuning fork-shaped vibrating piece 2 is formed in the substrate 1 by a notch 1α formed by an Enochip or the like. Further, a wiring pattern 6 is formed on the substrate 1 by vacuum-depositing gold or the like as a conductive material. A driving electrode 4 is formed on the JliU moving piece 2 of the substrate 1 at the same time as the wiring pattern 6. The drive electrode 4 is formed up to the end face of the vibrating element 2, as shown in FIG.

5.5 is a load mass provided at the tip of the vibrating element 2.

Reference numeral 6 designates the engineering C-deep, which is fixed to the substrate 1 with a conductive adhesive or the like, and includes an oscillation circuit that drives the vibrating element 2, a frequency dividing circuit that divides the resonant frequency of the vibrating element 2, and other circuits. There is. Reference numerals 7 and 7 designate chip capacitors constituting an oscillation circuit, which are fixed onto the wiring pattern 3 of the substrate 1 with a conductive adhesive. Glass plates 8 and 9 are sealing members for sealing the vibrating element 2, and are fixed to the substrate 1 by insulating adhesive layers 1o and ii without contacting the vibrating part of the vibrating element 2 on the substrate 1. ing. These adhesive layers can be easily set to a predetermined thickness by using an adhesive containing spacers such as glass beads, and the vibrating portion of the vibrating element 2 can be easily kept out of contact with the substrate 1. Reference numeral 12 denotes a sealing cap, which is fixed to the substrate 1 with an insulating adhesive, and is attached to the IC chip 6.
, a chip capacitor 7.7 is enclosed in the crystal oscillator of this embodiment. It is easy to manufacture and assemble, and it is possible to achieve a thinner structure. Adjustment of the resonant frequency of the vibrating piece 2 is performed by applying a laser beam through the glass plate 8 to the load mass 5,
This is done by removing 5.

Note that the glass plate 9 may have the same shape as the glass plate 8.

Further, as the sealing member, a metal plate may be used in addition to the glass plate, and a camp shape such as the sealing camp 12 is also possible. When a metal plate sealing member is used, resonance frequency adjustment is performed using a trimmer capacitor or the like. Further, the sealing cap 12 is not necessarily required, and may be molded with a molding material.

FIG. 6 shows another embodiment of the present invention, in which the vibrating element 2 of the substrate 1
The sealing portion tA8A that encloses the C chip 6 as well. In this case, a spacer 13 is required to provide a space for enclosing the IC chip 6, and it is also necessary to form a lead-out portion of the wiring pattern up to the end surface of the substrate 1.

Note that the spacer 1 and the sealing member 8A can be integrated. According to this embodiment, the sealing cap for the IC chip can be omitted, and the structure and manufacturing can be simplified.

FIG. 7 shows still another embodiment of the present invention, which is characterized in that a take-out hole 1b for recessing the IC chip is provided in the substrate 1A. This allows the entire oscillator to be made thin. Other symbols are substantially the same as in the two embodiments.

As detailed above, according to the present invention, the substrate is formed from a piezoelectric material.1. A vibrating piece is formed on this board, and a wiring pattern is formed on the J5 plate, and a driving electrode is formed on the vibrating piece using a conductive phase, so the configuration can be simplified and manufacturing and assembly can be facilitated. .

Furthermore, if the movable piece is sealed with a sealing member, the oscillator can be made with high accuracy and is less susceptible to the influence of the outside world.

[Brief explanation of drawings]

FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a bottom view,
Figure 6 is the figure 1 m-m diagonal! 4 is a plan view of the substrate, FIG. 5 is a partially cutaway perspective view of the substrate, and FIGS. 6 and 7 are sectional views of other embodiments. 1.1A... Board 2... Vibration piece 3...
... Wiring pattern 4 ... Pa drive electrode 6 ...
・C chip 8, 8 A-i-9...Sealing member/equipment Applicant Seikosha Co., Ltd. Agent Patent attorney Mogami Affairs Fig. 1 Fig. 2 Fig. 2 Fig. 3 1 b] 2 9 Figure 4 Figure 5 Figure 6・Y ID Z 9

Claims (1)

[Scope of Claims] 1. A substrate made of a piezoelectric material, a vibrating piece formed on the substrate, a wiring pattern made of a conductive material on the substrate, and a drive made of a conductive material on the vibrating piece. An oscillator including an electrode and an oscillation circuit that drives the vibrating piece and a mechanical chip fixed to the substrate (2) A substrate made of a piezoelectric material, a vibrating piece formed on this substrate, A wiring pattern formed of a conductive material on the substrate, a drive electrode formed of a conductive material on the vibrating piece, an IC chip including an oscillation circuit for driving the vibrating piece and fixed to the substrate, and the vibrating piece. An oscillator provided with a sealing member for enclosing the oscillator. 6. The oscillator according to claim 2, wherein the sealing member is an integrated cover that is bonded to both sides of the substrate without contacting the vibrating element. 4. The oscillator according to claim 2 or 6, wherein the sealing member also encapsulates an IC chip.