JPS6052668U - chip parts - Google Patents

chip parts

Info

Publication number
JPS6052668U
JPS6052668U JP14455283U JP14455283U JPS6052668U JP S6052668 U JPS6052668 U JP S6052668U JP 14455283 U JP14455283 U JP 14455283U JP 14455283 U JP14455283 U JP 14455283U JP S6052668 U JPS6052668 U JP S6052668U
Authority
JP
Japan
Prior art keywords
chip parts
mounting surface
external electrodes
chip component
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14455283U
Other languages
Japanese (ja)
Inventor
渡部 教夫
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP14455283U priority Critical patent/JPS6052668U/en
Publication of JPS6052668U publication Critical patent/JPS6052668U/en
Pending legal-status Critical Current

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Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は従来のチップ部品を用いた部品実装
方法を示す説明図、第3図は従来のチップ部品による部
品装着の欠点を示す説明図、第4図は本考案に係るチッ
プ部品の一実施例を示す斜視図、第5図は第4図の部品
を装置した状態を示す側面図、第6図は本考案の他の実
施例を示す斜視図、第7図は本考案のもう一つの他の実
施例を示す斜視図、第8図は本考案のさらにもう一つの
他の実施例を示す斜視図、第9図は第8図の部品を装着
した状態を示す側面図である。 5・・・チップ部品、5a・・・外部電極、5b、5d
・・・溝部分、5c・・・凹部、5e・・・帯状突部。
Figures 1 and 2 are explanatory diagrams showing a component mounting method using conventional chip components, Figure 3 is an explanatory diagram showing the drawbacks of component mounting using conventional chip components, and Figure 4 is a chip according to the present invention. FIG. 5 is a side view showing an installed state of the parts shown in FIG. 4, FIG. 6 is a perspective view showing another embodiment of the present invention, and FIG. 7 is a perspective view showing an embodiment of the present invention. FIG. 8 is a perspective view showing still another embodiment of the present invention, and FIG. 9 is a side view showing a state in which the parts shown in FIG. 8 are installed. It is. 5... Chip component, 5a... External electrode, 5b, 5d
...Groove portion, 5c...Concave portion, 5e...Strip-like protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品本体の装着面の両端に外部電極が配設された構造の
チップ部品において、前記装着面の中間位置に双方の外
部電極にほぼ平行な少な(とも1つの溝部分若しくは少
なくとも2つの帯状突部を設けたことを特徴とするチッ
プ部品。
In a chip component having a structure in which external electrodes are arranged at both ends of a mounting surface of a component body, a groove portion or at least two band-like protrusions approximately parallel to both external electrodes are provided at an intermediate position of the mounting surface. A chip component characterized by being provided with.
JP14455283U 1983-09-20 1983-09-20 chip parts Pending JPS6052668U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14455283U JPS6052668U (en) 1983-09-20 1983-09-20 chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14455283U JPS6052668U (en) 1983-09-20 1983-09-20 chip parts

Publications (1)

Publication Number Publication Date
JPS6052668U true JPS6052668U (en) 1985-04-13

Family

ID=30322321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14455283U Pending JPS6052668U (en) 1983-09-20 1983-09-20 chip parts

Country Status (1)

Country Link
JP (1) JPS6052668U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017217308A1 (en) * 2016-06-17 2017-12-21 株式会社村田製作所 Electronic component, vibration plate, electronic device, and method for manufacturing electronic components
JPWO2017212990A1 (en) * 2016-06-07 2018-11-08 株式会社村田製作所 Electronic components, diaphragms and electronic equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017212990A1 (en) * 2016-06-07 2018-11-08 株式会社村田製作所 Electronic components, diaphragms and electronic equipment
US10796837B2 (en) 2016-06-07 2020-10-06 Murata Manufacturing Co., Ltd. Electronic component, diaphragm, and electronic device
WO2017217308A1 (en) * 2016-06-17 2017-12-21 株式会社村田製作所 Electronic component, vibration plate, electronic device, and method for manufacturing electronic components
US10770215B2 (en) 2016-06-17 2020-09-08 Murata Manufacturing Co., Ltd. Electronic component, diaphragm, electronic device, and electronic component manufacturing method

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