JPS6049695A - Method of exfoliating cover film of photosensitive resin with cover film bonded to substrate for printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The invention relates to a method for removing a cover film from a photosensitive resin film with a cover film attached to a substrate for a printed wiring board. processed;
rt7' (A photosensitive resin film is attached to a printed wiring board substrate of a wiring board or an insulating board, and exposed and developed to form a cured resin metal resist, etching resist, and solder resist.n,/).

When laminating a photosensitive resin film to a substrate for a printed wiring board, a photosensitive resin film with a cover film is used. FIG. 1 is a sectional view showing a photosensitive resin film 5 with a cover film 2 attached to a substrate 1 for a printed wiring board.

In such a photosensitive resin film with a cover film,
It is necessary to peel off the cover film before the developing process.

In order to automatically peel off the cover film from the photosensitive resin film, the cover film is laminated with the photosensitive resin film. The printed fat board substrate τ is moved in a constant direction, the cover film is peeled off from the tip in the moving direction, and the peeled cover film is moved in the same direction vc as the moving direction of the substrate.
It is protruded by the TM ejection bottle, and this protrusion n, *
Grasp the cover film and hold the cover film 7 on the substrate [1].
In a device that peels off in one direction, if the thickness of the printed wiring board substrate is thin, the tip of the printed wiring board substrate may bend or bend in the direction of peeling when the cover film is peeled off.

In view of this point in the present invention, a photosensitive resin film with a cover film is laminated with a substrate tray for a printed wiring board. The tip force in the direction of movement when held by the two-ring is the force of the tip and the force/l'm? The peeled off cover film r is ejected by an ejector that moves in the same direction as the moving direction of the substrate, and this protrusion 1. Grip the cover film purple and peel it off in the direction of movement of the cover film r substrate.
1-This invention has a special feature, that is, the present invention has a photosensitive resin film with a cover film attached to it.
r- When the printed wiring board substrate is moved in a certain direction and the cover film 2 is peeled off from the tip in the moving direction, the tip of the printed wiring board substrate is clamped with a knife to prevent cover film peeling, etc. What I am looking forward to is τorganic and just the right thing.

As shown in FIG. 2, the main body of the apparatus includes a knife cutting section, a tape head section, and a winding section A.

yt, electric tube 4, timer 5. It consists of a roller conveyor 6, a stopper 7, and a cutter 8. Tie from the time the board 9 passes through the phototube 4 =? -52 activated, roller conveyor 6° stopper 7, cutter 8
, the movement of the tape head 1° is controlled.

The stopper 7 positions the tip of the substrate 9 so that when the cutter 8 is lowered onto the substrate 9, it will not damage the cover film 11 by 5 mm from the tip of the substrate.

Is the cutter 8 slightly peeled off due to residual stress in the cover film 11? This is an installation to make.

As shown in Figures 2 and 6, there is a 7" chi on the tape head.
Air cylinder for vertical movement of the head 12° Adhesive tape 1
6. 141 rolls of crimping roll @ take-up bobbin 15, a ratchet gear 16 for rotating the crimping roll, and a ratchet claw 17 attached to the air cylinder. The device is covered with a cover film so that it faces upward, and its tip is fixed to the winding bobbin 15.

The roll USp of the adhesive tape 15 has a ratchet mechanism.
Rotating the pressure roll 14 and applying the rotational force of the housing t-chain 1
8! 71. The winding machine S, which is also a rotary type that feeds the winding machine in parallel, consists of an ejector bin 19, a take-up conveyor, and a basket 20η). A barrel with a hemispherical tip attached to an air cylinder (hereinafter referred to simply as a push-out bottle 19)
) moves horizontally from the front of the tape head, and moves in the same direction as the moving direction of the board. It is adjusted so that about 5 mm bites between the 1-Lee 21 of the pick-up conveyor and the 5-Lee of the pulley 21. F17J cover film that sticks out like this? There is also a basket 20 after the take-up conveyor. As shown in Figure 4, the holding part is a cylinder with a cutter 26τ tip VC attached, a slide arm 25 attached to this cylinder hMjI, a fixed guide 24, and a fixed guide groove 26.
It consists of When the slide arm 25U1M plate 9 is placed directly below the pressure roller 14, the tape head 10 rotates around the substrate 9 and moves downwards or upwards, so that the slide arm 25U1M is shaped as shown in FIG. 4, for example.

This blade 26 is IM until the cover film 11 is peeled off from the substrate 9 and it stops just below the pressure roller 14.
When the substrate 9 stops at any position, the blade 25 faces the substrate 9 and moves along with the substrate 9, making two cranks, and when the peeling starts, the knife 25 moves at the same speed as the substrate 9. Travel horizontally.

When the fixed guide 24 is provided with a steel layer as shown in Fig. 4, the blade 6-3 of the fixed guide 24 escapes to the F side and advances to the base of the bale. The photosensitive resin film 5KS has an anti-chip rating of 7 and is 64 years old.

[This], the cover film 11 is peeled off with a sliding motion below from the machine vC. The substrate 9 is carried by a roller conveyor B, and when it passes the phototube 4, the stopper 7 is lowered. When the substrate 9 is placed on the stopper 7, the roller conveyor 6 stops for a few seconds, and the cutter 8 moves up and down to cut the substrate 9, cutting the cover film 11. Return to the quick position with the basin attached.Next step (stopper 7 rises and the roller conveyor 6 moves again) The top pressure roller 1 of the board 9
4 J'l:, Carry to 'F and stop 〇Cutter 2 on board 9
5, the tape head is lowered or raised together with the substrate 9. When the pressure roll 14 reaches the substrate, the adhesive tape 16 rotates and the cover film 11 is rotated.
is glued and rolled up.

At this time, the base plate 9 is slightly advanced, so the cutter 23 is also advanced accordingly. The board 9 is clamped with a cutter 23 1. Therefore, the peeling τ of the cover film 11 which is occurring at this time cannot be prevented.

Next, the tape head 10 is raised or lowered, and the roller conveyor 6 and the cutter 25r are removed while peeling off the σ cover film 11.
When the tape head 10 returns to the normal position mvc, the ejector bin 10 moves forward and takes up the cover film 11' and pushes it into the conveyor. It depends on the thickness of the root 9, but stj
! ] By setting the length r of the I-leg guide groove 26 to a certain value, the rigidity of the substrate 9 can be made to overcome the force when the cover film 11 is peeled off even after the clamp is released.

The cutter 26 is released from the clamp at the innermost part of the fixed guide groove 26. The ejector bottle 19 returns to the position after pushing the cover film 11'al", and the cover film 11 is carried to the basket 20 by the winding conveyor. On the other hand, the substrate 9 is transported to the next process by the roller conveyor 6.

Part of the cover film due to the tip force in the direction of substrate movement? To peel it off, as explained in Figures 2 and 3, press the adhesive tape τ onto the eye area of the cover film and remove it from the adhesive tape head. As the process progresses, the tip of the substrate may be wiped off the surface using, for example, a brush-like object. Alternatively, apply a rotating brush to the tip of the substrate,
You can use the sashiko method or the like with adhesive tape after applying a slight cover film.

As explained above, in the present invention, since the tip of the cover substrate can be securely held and the cover film can be prevented from peeling off, it is possible to reliably peel off even a particularly thin substrate.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a printed wiring board substrate, FIGS. 2 and 3 are simplified side views of the peeling device, and FIG. 4 is a perspective view of a holding portion. Explanation of symbols 1, printed wiring board substrate 2, cover film 9-5, photosensitive resin film 6, roller conveyor 8, cutter 9, substrate 10, tape head 11, cover film 16, stacking tag 14, pressure bonding roll 15 , winding bobbin 19, ejection bin 22, V belt 26, cutter 24, fixed guide 25, slide arm 26, fixed guide groove 10-

Claims (1)

[Claims] 1. A photosensitive resin film with a cover film is laminated.
'1. The printed wiring board substrate was moved in a certain direction, and the cover film τ was peeled off from the tip in the moving direction while the tip of the printed wiring board substrate was held by a knife-like clamp. This protrusion n is ejected by an ejector pin that moves in the same direction as the J direction. A method for peeling off a cover film from a photosensitive fi* film attached to a printed wiring board substrate, characterized in that the cover film R is gripped and the cover film is peeled off in the moving direction of the substrate.