JPS6047306A - Method of producing low impedance bus - Google Patents
Method of producing low impedance busInfo
- Publication number
- JPS6047306A JPS6047306A JP15591783A JP15591783A JPS6047306A JP S6047306 A JPS6047306 A JP S6047306A JP 15591783 A JP15591783 A JP 15591783A JP 15591783 A JP15591783 A JP 15591783A JP S6047306 A JPS6047306 A JP S6047306A
- Authority
- JP
- Japan
- Prior art keywords
- low impedance
- insulating coating
- metal strip
- impedance bus
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003000 extruded plastic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は、低インピーダンス母線のa遣方法に関り−る
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method of providing a low impedance bus bar.
L発明の技術的背景とその問題点]
従来から、低インピーダンス母線としては、三相同軸ケ
ーブル、多心形低インピーダンスケーブル、三相絶縁バ
スダクトが知られている。Technical background of the invention and its problems] Conventionally, three-phase coaxial cables, multicore low-impedance cables, and three-phase insulated bus ducts have been known as low-impedance busbars.
しかるに、三相同軸ケーブルは、それぞれの導体が同軸
状に配置されているので、リアクタンスが極めて小さい
という利点を有するが、大電流の送電が困翔であるとい
う欠点を有し、多心形低インピーダンス母線のケーブル
は一相当りの導体数を増すことでリアクタンスを少なく
することができ、各相のインピーダンスも平衡するとい
う利点を有するが、大電流の送電が困難なうえ、ケーブ
ルの端末では多数の専心を処理する必要があるため、ケ
ーブルの端末の処理作業がやっかいになるという欠点を
有し、三相絶縁バスダクトは大電流の送電が可能である
という利点を有するが、リアクタンス低減にも限麿があ
るうえ、長尺のものになると相聞電圧の不平衡が大きく
なるとともに相ねん架する必要が生じるという欠点を有
していた。However, since three-phase coaxial cables have each conductor arranged coaxially, they have the advantage of extremely low reactance, but they have the disadvantage of making it difficult to transmit large currents, and are Impedance bus cables have the advantage of reducing reactance by increasing the number of conductors per unit, and balancing the impedance of each phase, but it is difficult to transmit large currents, and there are many conductors at the terminals of the cable. However, three-phase insulated bus ducts have the advantage of being able to transmit large currents, but are limited in reducing reactance. Not only that, but if the length is long, the unbalance of the phase-to-phase voltage becomes large, and it is necessary to install a bridge between the phases.
[発明の目的]
本発明はこれらの欠点を解決するためになされたもので
、リアクタンスが小さく、相聞電圧の不平衡も解消され
、かつ大電流の送電をも可能とず<)低インピータンス
母線の製造方法を提供することを目的とづ−る。[Object of the Invention] The present invention has been made to solve these drawbacks, and provides a low impedance bus that has low reactance, eliminates phase-to-phase voltage unbalance, and is not capable of transmitting large currents. The purpose is to provide a manufacturing method for.
1光明のIII要l
’Jイi−ね43本発明の低インピーダンス母線の製造
ノ゛、法は、(イ)連続的に送り出される金属帯板の9
1周lこ絶縁被覆を施こし、(ロ)続いてこの絶縁被覆
の周りに導電金属帯板を断面コの字状に成形しでなる一
対の導電成形体を各々の四部を内側に向()C被嵌し、
その外周の両端突合せ部を固着し、(ハ)ざらにこの絶
縁被覆の周りに前記(ロ)の工程を繰り返すことにより
導電成形体および絶縁被覆を順に設置)ることを特徴と
する。1. Komei's III Essentials 43 The method for manufacturing the low impedance busbar of the present invention is (a) 9 s of metal strips fed out continuously.
An insulating coating is applied around the insulating coating, and (b) a pair of conductive molded bodies made by forming a conductive metal band plate into a U-shaped cross section is placed around the insulating coating, with each of the four parts facing inward ( ) C fitted,
The abutting portions of both ends of the outer periphery are fixed, and (c) the conductive molded body and the insulating coating are sequentially installed by roughly repeating the step (b) above around the insulating coating.
[発明の実施例1
以下本発明の訂細を図面に示す一実施例について説明す
る。[Embodiment 1 of the Invention] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
くイ)第1図および第2図において、銅またはアルミニ
ウムからなる帯状導体1は、まず整直ロール2を通り、
次いで脱脂等の表面処理槽3を通っC表面処理が施され
た後、その上側および下側にこれどほぼ平行に送り出さ
れl〔一対の絶縁テープ4が縦添えされ、加熱1]−ル
5を通ることにJ、り絶縁テープ4が溶着される。B) In FIGS. 1 and 2, a strip conductor 1 made of copper or aluminum first passes through a straightening roll 2,
Next, after passing through a surface treatment tank 3 for degreasing, etc., and subjected to C surface treatment, the tape is sent out almost parallel to the upper and lower sides of the tank 3. The insulating tape 4 is welded to the area where it passes through.
(ロ)次にこうして製造され、連続的に走行する帯状の
絶縁被覆導体6の周囲に、これどほぼ平行に供給された
導電金属帯板7を断面コの字状に成形し、この両端を外
側に突出させてなる一対の導電成形体8ノ〕り被けられ
る。なおう9電成形体8の供給は、連続的に送り出され
る導電金属帯板7を成形加工装置9および脱脂等の表面
処理槽10を順に通すことにより行なわれる。(b) Next, around the band-shaped insulated coated conductor 6 manufactured in this way and running continuously, a conductive metal band plate 7, which is supplied almost in parallel, is formed into a U-shaped cross section. A pair of electrically conductive molded bodies 8 protruding outwards are covered. The electroformed body 8 is supplied by passing the continuously fed conductive metal strip 7 through a forming device 9 and a surface treatment bath 10 such as degreasing.
次いで圧着ロール11を通って導電成形体8の両端型な
り部が冷間圧接された後、さらにこの導電成形体8の表
面に上記と同様の方法で絶縁被覆4′が施される。Next, after the molded portions at both ends of the conductive molded body 8 are cold-pressed through a pressure bonding roll 11, an insulating coating 4' is applied to the surface of the conductive molded body 8 in the same manner as described above.
(ハ)ざらに、この絶縁被覆4′の周りに前記(D)の
工程が繰り返して行なわれ、シ9電金属帯板7と絶縁被
覆4′が複数の層をなして同心状に形成され巻取装置R
に巻取られる。(c) Roughly, the step (D) above is repeated around this insulating coating 4', and the electric metal strip 7 and the insulating coating 4' are formed concentrically in multiple layers. Winding device R
It is wound up.
第3図はこうして得られる導電金属帯板7ど絶縁被覆4
′が各2層で構成された低インピータンスI+11Q
12の横断面図を示している。Figure 3 shows the insulating coating 4 of the conductive metal strip 7 obtained in this way.
' is a low impedance I+11Q composed of two layers each.
12 shows a cross-sectional view of 12.
で〕なわち、この実施例においては、連続的に供給され
るt!4:)、たはアルミニウムからなる帯状導体1の
周囲に、絶縁テープ4ど導電金属帯板7を連続的に送り
出しながら装着していくので、長尺で口I撓竹の高い低
インピーダンス母線12を連続的に9.0時間C製造す
ることができる。さらに導電金属帯板7が同心状に配置
されているため、リアクタンスが小さくなるという利点
が生じ、また相聞電圧の不平衡も解消されるという利点
が生じる。In other words, in this embodiment, t! is continuously supplied. Since the insulating tape 4 and the conductive metal strip 7 are continuously fed out and attached around the strip-shaped conductor 1 made of aluminum or aluminum, the low-impedance bus bar 12 is long and has a high opening. can be produced continuously for 9.0 hours. Furthermore, since the conductive metal strips 7 are arranged concentrically, there is an advantage that the reactance is reduced, and the unbalance of phase voltage is also eliminated.
ひらにまた、導電金属帯板7の幅および厚さを変λるこ
とにより、電流容量を容易に増加させることができる。Furthermore, by changing the width and thickness of the conductive metal strip 7, the current capacity can be easily increased.
なお第4図は本発明の他の実施例を示した図である。こ
の実施例では同図に示したように、上記一実施例にお【
プる導電金属帯板7よりなる導電成形体8の両端型なり
部の固着を溶接により行ない、絶縁テープ4による被覆
をプラスチックの押出被覆により行なった例であり、符
@13は溶接部、14はシラスデック被覆を示している
。Note that FIG. 4 is a diagram showing another embodiment of the present invention. In this embodiment, as shown in the figure,
This is an example in which the molded portions at both ends of a conductive molded body 8 made of a conductive metal strip 7 are fixed by welding, and the insulating tape 4 is covered by extruded plastic coating. indicates white deck coating.
[発明の効果コ
以上の記載から明らかなように本発明方法によれば、長
尺で可撓性の高い低インピーダンス母線を連続的に、か
つ安価に!!1造することかでさ、冑られる本発明の低
インピーダンス母線は導電金属帯板が同心状に配置され
ているので、リアクタンスが小さく相11fl電圧の不
平衡が解消された低インピーダンス母線を得ることが可
能である。[Effects of the Invention] As is clear from the above description, according to the method of the present invention, a long, highly flexible, low impedance bus bar can be produced continuously and at low cost! ! Since the low impedance bus of the present invention has conductive metal strips arranged concentrically, it is possible to obtain a low impedance bus that has a small reactance and eliminates the unbalance of the phase 11fl voltage. is possible.
第1図および第2図は本発明方法の一実施例の説明図、
第3図は実施例で得られる低インピーダンス母線の横断
面図、第4図は他の実施例により得られる低インピーダ
ンス11線である。
1・・・・・・・・・・・・帯状導体
2・・・・・・・・・・・・整直ロール4・・・・・・
・・・・・・絶縁テープ5・・・・・・・・・・・・加
熱ロール6・・・・・・・・・・・・絶縁被覆導体7・
・・・・・・・・・・・導電金属帯板8・・・・・・・
・・・・・導電成形体12・・・・・・・・・・・・低
インピーダンス母線代理人弁即士 須 山 佐 −
(ほか1名〉
第1図
第2図1 and 2 are explanatory diagrams of an embodiment of the method of the present invention,
FIG. 3 is a cross-sectional view of a low impedance bus line obtained in the example, and FIG. 4 is a low impedance 11 line obtained in another example. 1...Band-shaped conductor 2...Straightening roll 4...
......Insulating tape 5...Heating roll 6...Insulating coated conductor 7.
......Conductive metal strip plate 8...
... Conductive molded body 12 ...... Low impedance busbar agent valve engineer Sa Suyama - (1 other person) Fig. 1 Fig. 2
Claims (1)
絶縁被覆を施こし、(ロ)続いてこの絶縁被覆の周りに
導電金属帯板を断面コの字状に成形してなる一対の導電
成形体を各々の四部を内側に向1ノで被嵌し、その外周
の両端突合せ部を固着し、(ハ)さらにこの絶縁被覆の
周りに前記(口〉の工程を繰り返すことにより導電成形
体および絶縁被覆を順に設けることを特徴とする低イン
ピーダンス母線の製造方法。(1) A pair of metal strips formed by (a) applying an insulating coating to the outer periphery of a continuously fed metal strip, and (b) subsequently forming a conductive metal strip into a U-shaped cross section around this insulating coating. The conductive molded body is fitted with each of the four parts facing inward, and the abutting portions of both ends of the outer periphery are fixed. A method for manufacturing a low impedance bus bar, comprising sequentially providing a molded body and an insulating coating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15591783A JPS6047306A (en) | 1983-08-26 | 1983-08-26 | Method of producing low impedance bus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15591783A JPS6047306A (en) | 1983-08-26 | 1983-08-26 | Method of producing low impedance bus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6047306A true JPS6047306A (en) | 1985-03-14 |
Family
ID=15616332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15591783A Pending JPS6047306A (en) | 1983-08-26 | 1983-08-26 | Method of producing low impedance bus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6047306A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7102256B2 (en) | 2001-11-09 | 2006-09-05 | Nissan Motor Co., Ltd. | Distribution line structure for electric power supply |
WO2012043581A1 (en) * | 2010-09-28 | 2012-04-05 | 株式会社神戸製鋼所 | Bus bar, method of manufacturing bus bar, and busbar-connector |
JP2017084773A (en) * | 2015-10-13 | 2017-05-18 | リテルヒューズ・インク | Method for manufacturing insulated bus bar |
-
1983
- 1983-08-26 JP JP15591783A patent/JPS6047306A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7102256B2 (en) | 2001-11-09 | 2006-09-05 | Nissan Motor Co., Ltd. | Distribution line structure for electric power supply |
WO2012043581A1 (en) * | 2010-09-28 | 2012-04-05 | 株式会社神戸製鋼所 | Bus bar, method of manufacturing bus bar, and busbar-connector |
JP2012075214A (en) * | 2010-09-28 | 2012-04-12 | Kobe Steel Ltd | Bus bar, manufacturing method of bus bar, and bus bar and connector |
CN103004044A (en) * | 2010-09-28 | 2013-03-27 | 株式会社神户制钢所 | Bus bar, method of manufacturing bus bar, and busbar-connector |
JP2017084773A (en) * | 2015-10-13 | 2017-05-18 | リテルヒューズ・インク | Method for manufacturing insulated bus bar |
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