JPS6046892A - Irradiating method of laser light - Google Patents

Irradiating method of laser light

Info

Publication number
JPS6046892A
JPS6046892A JP59148612A JP14861284A JPS6046892A JP S6046892 A JPS6046892 A JP S6046892A JP 59148612 A JP59148612 A JP 59148612A JP 14861284 A JP14861284 A JP 14861284A JP S6046892 A JPS6046892 A JP S6046892A
Authority
JP
Japan
Prior art keywords
work
spot
distribution
laser light
temp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59148612A
Other languages
Japanese (ja)
Other versions
JPS6159837B2 (en
Inventor
Katsuyuki Kakizaki
柿崎 克行
Hideo Fujita
秀夫 藤田
Tadashi Takahashi
忠 高橋
Takashi Takaoka
高岡 隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59148612A priority Critical patent/JPS6046892A/en
Publication of JPS6046892A publication Critical patent/JPS6046892A/en
Publication of JPS6159837B2 publication Critical patent/JPS6159837B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To form a satisfactory temp. distribution to a work and to improve working efficiency by compressing laser light of an annular mode in one direction to form a flat spot and irradiating such light to the work. CONSTITUTION:Laser light 1 of an annular mode oscillated by a laser oscillator 2 is condensed to a spot 4 of a slender shape by a cylindrical lens 3 having a semi-circular cylindrical shape so that the energy distribution thereof is made into a saddle shape having a peak on the outside. When such spot 4 is irradiated to a work 5, the surface temp. distribution of the work 5 has a trapezoidal shape indicating a uniform temp. distribution on account of thermal diffusion outside the irradiating area of the work 5, thereby expanding the max. tem. width. A stable heat treatment is thus accomplished.

Description

【発明の詳細な説明】 この発明はレーザ光照射方法に関する。[Detailed description of the invention] The present invention relates to a laser beam irradiation method.

例えば凸レンズを用いてレーザ光を集光して加工物に照
射した場合、加工物に照射されたスポットのエネルギ分
布はレーザ発振器から放出されたときと同様の分布にな
っている。す々わち、上記スポットのエネルギ分布はそ
の中心部が高く周辺部が低いつり鐘状になっている。こ
のようなエネルギ分布をもつレーザ光では熱処理の場合
次のような不具合がある。周知のように熱処理は加工金
属の変態点を越えた特定の温度で行うものであるが、上
記スポットの熱処理幅を広げると、上記スポットにおい
て変態点温度境界部と中心部との温度差が大きくなり、
上記中心部では溶融温度となって熱処理に不適当となる
。また、上記中心部の温度を変態点温度に近づければ、
っシ鐘状エネルギ分布の性質から有効な熱処理幅は狭く
なる。
For example, when laser light is focused using a convex lens and irradiated onto a workpiece, the energy distribution of the spot irradiated onto the workpiece is similar to that when the laser beam is emitted from a laser oscillator. In other words, the energy distribution of the spot is bell-shaped, with the center being high and the periphery being low. Laser light with such an energy distribution has the following problems in heat treatment. As is well known, heat treatment is performed at a specific temperature that exceeds the transformation point of the processed metal, but if the heat treatment width of the above spot is widened, the temperature difference between the transformation point temperature boundary part and the center part of the above spot becomes large. Become,
The central portion reaches a melting temperature, making it unsuitable for heat treatment. Also, if the temperature at the center is brought closer to the transformation point temperature,
Due to the bell-shaped nature of the energy distribution, the effective heat treatment range becomes narrow.

この発明は上記欠点を解消するため表されたもので、リ
ング状モードのレーザ光を偏平に圧縮したスポットにし
、良好なエネルギ分布に集光されたスポットを加工物に
照射し、良好な温度分布を加工物に形成して、加工効率
を向上するものである。
This invention was developed in order to solve the above-mentioned drawbacks, and the laser beam in the ring mode is made into a flat and compressed spot, and the workpiece is irradiated with the focused spot with a good energy distribution, thereby achieving a good temperature distribution. is formed on the workpiece to improve processing efficiency.

以下、この発明を実施例を参照して説明する。The present invention will be explained below with reference to Examples.

第1図はこの発明を実施するのに適した装置の構成を示
すもので1例えば不安定形共振器で得られるリング状モ
ードのレーザ光(1)を発振する発振器(2)を有し、
この発振器(1)よ)発振された上記レーザ光(1)を
集光する集光レンズ(3)よシなる。上記集光レンズ(
3)は円柱材を縦断した半円柱状のいわゆる円筒レンズ
である。
FIG. 1 shows the configuration of an apparatus suitable for carrying out the present invention. 1 It has an oscillator (2) that oscillates a ring-mode laser beam (1) obtained from an unstable resonator, for example,
This oscillator (1) also serves as a condensing lens (3) that condenses the oscillated laser beam (1). The above condensing lens (
3) is a so-called cylindrical lens having a semi-cylindrical shape formed by longitudinally cutting a cylindrical material.

上記装置でリング状モードのレーザ光(1,)は集光レ
ンズ(3)で細長い形状のスポット(4)に集光され、
そのエネルギ分布は第2図に示すような外側にピークを
もつ枝状になる。このスポット(4)を加工物(5)に
照射すると、スポット(4)の照射区域外の熱拡散のた
め、加工物(5)の表面の温度分布は第3図の実線(a
)で示される均一な温度分布を示す台状形となって、最
高温度幅が極めて拡張される。前記従来技術ではその照
射スポットは第3図の破線(b)で示される温度分布に
力っている。したがって、上記二つの温度分布において
第3図の一点鎖線(C)を加工物の変態点とすると、温
度分布(′b)は同じ<(a)に比べて熱処理加工範囲
が広くなるとともに、加工物表面の照射点中央と上記変
態点との温度差が小さいので、安定した熱処理が行える
。更にとの発明では熱処理された部分と熱処理されない
部分の境界をはっきりさせシャープな熱処理が行える。
In the above device, the ring-shaped laser beam (1,) is focused on a long and narrow spot (4) by a condensing lens (3),
The energy distribution becomes branch-like with peaks on the outside as shown in FIG. When the workpiece (5) is irradiated with this spot (4), the temperature distribution on the surface of the workpiece (5) is changed by the solid line (a) in Figure 3 due to heat diffusion outside the irradiation area of the spot (4).
) with a trapezoidal shape showing a uniform temperature distribution, and the maximum temperature range is extremely expanded. In the prior art, the irradiation spot focuses on the temperature distribution shown by the broken line (b) in FIG. Therefore, in the above two temperature distributions, if the dot-dash line (C) in Fig. 3 is taken as the transformation point of the workpiece, the temperature distribution ('b) is the same. Since the temperature difference between the center of the irradiation point on the object surface and the above transformation point is small, stable heat treatment can be performed. Furthermore, in the invention, the boundary between the heat-treated portion and the non-heat-treated portion is made clear, and sharp heat treatment can be performed.

なお上記実施例では円筒レンズを用いたが、この円筒レ
ンズと同様の機能を有する光学系又は反射鏡を用いても
上記と同様の効果を得ることができる。
Although a cylindrical lens is used in the above embodiment, the same effect as described above can be obtained by using an optical system or a reflecting mirror having the same function as the cylindrical lens.

更に、この発明は熱処理加工だけでなく、レーザ発振器
の出力を犬にすることによシ、穴あけ。
Furthermore, this invention can not only be used for heat treatment, but also for drilling by using the output of a laser oscillator.

湾切シ、切断等の加工に応用できることは言うまでもな
い。
Needless to say, it can be applied to processes such as bevel cutting and cutting.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明を笑施するに適する装置の要部概略図
、第2図は上記装置によって集光されたレーザ光のエネ
ルギ分布図、第3図は加工物表面に照射されたレーザス
ポットの温度分布図である。 (1)・・・レーザ光 (2)・・・レーザ発振器(3
)・・・円筒レンズ 代理人 弁理士 則 近 憲 佑 (ほか1名) 第1図 第2図 尤づ図
Fig. 1 is a schematic diagram of the main parts of a device suitable for carrying out the present invention, Fig. 2 is an energy distribution diagram of the laser beam focused by the above device, and Fig. 3 is a laser spot irradiated onto the surface of the workpiece. FIG. (1)... Laser light (2)... Laser oscillator (3
)...Cylindrical lens agent Patent attorney Noriyuki Chika (and 1 other person) Figure 1 Figure 2 Yuzu diagram

Claims (1)

【特許請求の範囲】[Claims] リング状モードのレーザ光を一方向に圧縮する光学系に
よって偏平スポットにして加工物に照射したことを特徴
とするレーザ光照射方法。
A laser beam irradiation method characterized by irradiating a workpiece with a ring-shaped laser beam in a flat spot using an optical system that compresses it in one direction.
JP59148612A 1984-07-19 1984-07-19 Irradiating method of laser light Granted JPS6046892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59148612A JPS6046892A (en) 1984-07-19 1984-07-19 Irradiating method of laser light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59148612A JPS6046892A (en) 1984-07-19 1984-07-19 Irradiating method of laser light

Publications (2)

Publication Number Publication Date
JPS6046892A true JPS6046892A (en) 1985-03-13
JPS6159837B2 JPS6159837B2 (en) 1986-12-18

Family

ID=15456673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59148612A Granted JPS6046892A (en) 1984-07-19 1984-07-19 Irradiating method of laser light

Country Status (1)

Country Link
JP (1) JPS6046892A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4874920A (en) * 1984-06-08 1989-10-17 Semiconductor Energy Laboratory Co., Ltd. Electronic device manufacturing methods
FR2654842A1 (en) * 1989-11-23 1991-05-24 Commissariat Energie Atomique Device for reducing the divergence of a light beam
US5609284A (en) * 1992-04-02 1997-03-11 Fonon Technology Limited Method of splitting non-metallic materials
EP0872303A3 (en) * 1997-04-14 1999-12-01 Schott Glas Process and apparatus for splitting flat pieces of brittle material, particularly of glass
US6489588B1 (en) 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
JP2005522342A (en) * 2002-04-15 2005-07-28 シーメンス アクチエンゲゼルシヤフト Method for producing single crystal structure
JP2006000888A (en) * 2004-06-17 2006-01-05 Laser Solutions Co Ltd Line machining method using laser beam, and laser beam machining device
US7794073B2 (en) * 2005-08-18 2010-09-14 Funai Electric Co., Ltd. Ink jet printer
EP3631919A4 (en) * 2016-09-29 2020-12-09 Nlight, Inc. Systems and methods for modifying beam characteristics
US11173548B2 (en) 2017-04-04 2021-11-16 Nlight, Inc. Optical fiducial generation for galvanometric scanner calibration
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
US11331756B2 (en) 2015-11-23 2022-05-17 Nlight, Inc. Fine-scale temporal control for laser material processing
US11465232B2 (en) 2014-06-05 2022-10-11 Nlight, Inc. Laser patterning skew correction
US11858842B2 (en) 2016-09-29 2024-01-02 Nlight, Inc. Optical fiber bending mechanisms

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4874920A (en) * 1984-06-08 1989-10-17 Semiconductor Energy Laboratory Co., Ltd. Electronic device manufacturing methods
FR2654842A1 (en) * 1989-11-23 1991-05-24 Commissariat Energie Atomique Device for reducing the divergence of a light beam
US5609284A (en) * 1992-04-02 1997-03-11 Fonon Technology Limited Method of splitting non-metallic materials
EP0872303A3 (en) * 1997-04-14 1999-12-01 Schott Glas Process and apparatus for splitting flat pieces of brittle material, particularly of glass
US6489588B1 (en) 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
US6660963B2 (en) 1999-11-24 2003-12-09 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials
JP2005522342A (en) * 2002-04-15 2005-07-28 シーメンス アクチエンゲゼルシヤフト Method for producing single crystal structure
JP2006000888A (en) * 2004-06-17 2006-01-05 Laser Solutions Co Ltd Line machining method using laser beam, and laser beam machining device
US7794073B2 (en) * 2005-08-18 2010-09-14 Funai Electric Co., Ltd. Ink jet printer
US11465232B2 (en) 2014-06-05 2022-10-11 Nlight, Inc. Laser patterning skew correction
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
US11331756B2 (en) 2015-11-23 2022-05-17 Nlight, Inc. Fine-scale temporal control for laser material processing
US11794282B2 (en) 2015-11-23 2023-10-24 Nlight, Inc. Fine-scale temporal control for laser material processing
EP3631919A4 (en) * 2016-09-29 2020-12-09 Nlight, Inc. Systems and methods for modifying beam characteristics
US11858842B2 (en) 2016-09-29 2024-01-02 Nlight, Inc. Optical fiber bending mechanisms
US11886052B2 (en) 2016-09-29 2024-01-30 Nlight, Inc Adjustable beam characteristics
US11173548B2 (en) 2017-04-04 2021-11-16 Nlight, Inc. Optical fiducial generation for galvanometric scanner calibration

Also Published As

Publication number Publication date
JPS6159837B2 (en) 1986-12-18

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