JPS6046091A - Printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board on which various electronic components are mounted to form a predetermined electric circuit, and particularly to improvements in the component mounting portion thereof.

[Background technology and its problems]

Conventionally, when mounting electronic components for circuit configuration on a printed wiring board, a through hole is drilled in advance at a predetermined position on the printed wiring board, and the surface side of the board is inserted into the through hole. A common method is to insert the lead terminals of the electronic component from above and solder them to the back surface of the board to establish electrical connection.

However, the conventional method described above has various problems in terms of workability in the assembly process, manufacturing cost, and the like. For example, since the inner diameter of the through ball and the diameter of the lead terminal are approximately the same, high precision is required in the insertion work of the lead terminal, and if the lead terminal is bent, the insertion work may be difficult. You need to be careful when handling the parts as they may become damaged. Therefore, the above-mentioned insertion work has to be done manually, which takes a lot of time and greatly reduces production efficiency. In addition, the 1) -1" terminal of the above electric component has a small contact area with the board, and not only is it difficult to establish a reliable electrical connection, but also the When soldering is applied, there is a risk that so-called solder bridges may occur between each lead terminal, resulting in an inadvertent short circuit, which significantly reduces reliability. When using a board with electrical components mounted on it, it is necessary to perform a continuity test by pressing an inspection pin against the board, for example, in order to check the operation of the circuit or adjust variable components. Since the printed wiring surface has an uneven surface due to protruding lead terminals of electronic components and adhesion of solder, a test pin that can be elastically brought into contact with the board by a spring is used as the test pin. It is necessary to deal with the uneven surface. Therefore, the structure of the above-mentioned inspection pin becomes complicated and the apparatus becomes expensive.

On the other hand, in the conventional printed wiring board as described above, when wiring patterns are formed on both sides of the board in order to achieve high density, making it a double-sided printed wiring board, the wiring pattern on both sides is It is necessary to perform through-hole plating on the through-holes in order to establish electrical connection between them, which complicates the process and increases manufacturing costs.

Furthermore, conventionally so-called chip parts without lead terminals have been used, but when mounting this type of part on the above-mentioned printed wiring board, it is necessary to simply mount it on a predetermined land portion on which IJ-M Ushida is printed. Since it is mounted and fixed by solder reflow, it is easy for positional deviation to occur during this solder reflow process, reducing reliability.

[Purpose of the invention]

SUMMARY OF THE INVENTION The present invention has been proposed in order to eliminate the drawbacks of the conventional printed wiring boards described above, and aims to simplify and streamline the mounting work of electronic components. An object of the present invention is to provide a printed wiring board that can reliably regulate the position of the substrate, thereby automating the process, improving production efficiency, and reducing manufacturing costs.

Further, it is an object of the present invention to provide a printed wiring board that facilitates inspection processes such as circuit continuity tests, and allows equipment used for inspection to be simplified and made inexpensive.

Furthermore, it is an object of the present invention to provide a printed wiring board that can easily and inexpensively establish connection between each wiring pattern even in the case of a double-sided printed wiring board or a multilayer printed wiring board. .

[Summary of the invention]

That is, in order to achieve the above-mentioned objects, the present invention has the following features:
A through terminal is planted on a base on which a wiring pattern has been formed in advance, one end of the through terminal protrudes from the base to form a component attachment part, and the other end surface is substantially flush with the base. It is something.

〔Example〕

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

As shown in FIG. 1, the printed wiring board constructed according to the present invention is made up of a base 1 such as a paper phenol resin laminate or the like with through terminals 2 made of a conductive metal such as copper.

As shown in FIG. 2, the through terminal 2 is connected to a component mounting surface 1 on the base 1 on which electronic components to be described later are mounted.
On side a, one end side protrudes to form a component attachment portion 2a.

On the other hand, the other end of the through terminal 2 exposed on the printed wiring surface 1b side on which a wiring pattern is formed of copper foil or the like in the base 1 is crushed by caulking and exposed to be substantially flush with the printed wiring surface 1b. A surface 2b is formed. Note that, as shown in FIG.
Connection and conduction may be achieved by pressure contact by caulking with a predetermined portion provided around the through terminal 2, such as the connection land portion of the wiring pattern 3 provided in b, or as shown in FIG. A solder tip may be provided to adhere the solder 4 to make the above-mentioned connection and conduction more reliable.

Further, the cross-sectional shape of the through terminal 2 may be any shape such as circular or square, and can be changed as appropriate depending on the shape of the component to be attached.

Furthermore, using the above-mentioned through-hole terminals 2, wiring patterns 3a are formed on both sides of the base body 1 as shown in FIG.

The wiring patterns 3a and 3b of the double-sided printed wiring board on which the wiring pattern 31) is formed may be interconnected and electrically connected by caulking both ends of the through terminals 2. In addition,
In this case, as shown in FIG. 6, solder 4 may be applied to ensure connection and continuity. Further, as shown in FIG. 7, each wiring pattern 3a, 3b and the through terminal 2 are connected to each other by applying solder 4 to each other, and one end of the through terminal 2 is projected to one side of the base 1. The component mounting portion 2a may be formed by doing so.

By the way, in order to manufacture the above-mentioned printed wiring board, the following manufacturing method may be used.

FIGS. 8(5) to 8(D) show an example of the method for manufacturing the printed wiring board according to the process order.

In this manufacturing method, first, as shown in FIG. 8(5), the first guide member 5 having a through hole 5a in advance and the second guide member 6 having a through hole 6a in the same manner as described above are connected. The through holes 5a and 6a are arranged one on top of the other so as to correspond to each other, and a wire 7 made of a conductive metal such as copper is inserted into the through holes 5a and 6a. This wire 7 has an insertion tip 7
The insertion amount is adjusted so that a protrudes from the second guide portion 6 at least slightly more than the thickness of the base body, which will be described later.

In addition, in the through-hole 5a provided in the first guide portion 5, the opening end side 5b, which serves as the insertion opening for the wire rod 7, is opened in the shape of a dome (an inclined surface), and the insertion operation of the wire rod 7 is It may be made easy.

Next, as shown in FIG. 8 CB), a cag 8 is inserted into the gap 8a between the first kite part 5 and the second guide part 6, and each wire rod 7 is cut at this position to form a predetermined shape. A long through terminal 2 is obtained. Note that the wire rod 7 may be cut by shifting the first kite section 5 and the second kite section 6 while keeping them in sliding contact.

Then, as shown in FIG. 8(C), the base body 1 is placed facing the through terminal 2 protruding from the second guide portion 6, and a pressing device 9 is used as shown in FIG. 8(C). the through terminals 2 are press-fitted into the base body 1 and crimped through the base body 1. At this time, the insertion tip 7a of the through terminal 2 protruding from the base body 1 hits the press surface 9a of the press device 9 and is crushed, so that it is made substantially flush with the base body 1.

Finally, as shown in FIG. 8), the second guide portion 6 is removed so as to be separated from the base body 1, thereby completing the printed wiring board in which the through terminals 2 are erected so that one end side protrudes.

Next, a method for mounting electronic components onto the printed wiring board configured as described above will be described.

FIG. 9 shows how small chip components 10 such as resistors and capacitors are mounted. 10 such chip parts
is inserted between the pair of through terminals 2, 2 to achieve mechanical fixation and electrical connection.

FIG. 1O shows a state in which a large electronic component 11 such as a transformer component is mounted. Such large electronic components 11
When mounting a through hole 11b to be connected to a lead terminal (not shown) in the flange portion 11a formed on the periphery of this component 11, and insert the through terminal 2 into the through hole 11b.
Insert the component mounting portion 2a and insert the component mounting portion 2a.
By caulking the dovetail 12C of the above-mentioned flange portion 11a from above in the figure, it is securely fixed and electrical continuity is also achieved.

FIG. 11 shows the mounted state of the electronic component 12 having a plurality of electrodes 12a formed on the outer peripheral wall. In this case, the component 12 is fitted between the through terminals 2 planted on the base 1 so as to be arranged around the component, and each electrode 12a is brought into contact with the corresponding through terminal 2 to establish a connection.

FIG. 12 shows the mounted state of the approximately cylindrical two-terminal electronic component 13 having a pair of electrodes 13a and 13b, a concave electrode 13a and an electrode 13b on the outer peripheral wall. In this case, the component mounting portion 2a of the through terminal 2 is inserted into the recessed electrode 13a, and the component 13 is inserted so that the component mounting portion 2a of another through terminal 2 is in contact with the outer peripheral wall. All you have to do is drop it between the through terminals 2 and 2. In addition, the 13th
As shown in the apparatus, the recessed electrode 13a is filled with solder 4 in advance, and this component 13 is dropped between the through terminals 2, 2 as described above, and the solder 4 is melted in a reflow oven. As shown in FIG. 13(B), the component mounting portion 2a of the through terminal 2 and the internal electrode 13a may be soldered with solder 4 to ensure electrical connection.

It goes without saying that the present invention can also be similarly applied to electronic components provided with a plurality of concave or through-hole electrodes.

FIG. 14 shows a state in which a so-called dual in-line circuit component 14 having a large number of electrodes 14a on both sides is mounted. In this case, the component mounting portion 2a of the through terminal 2 is used as a fixing pin for the circuit component 1, and the space between each electrode 14a and the wiring pattern 3 is the solder 4 that has been applied to each electrode 14a in advance. are heated and melted in a reflow oven and connected by soldering. Therefore, in this case, the through terminal 2 does not need to be made of conductive metal, and for example, a pin made of ceramic or the like may be used.

FIG. 15 shows a case where the through terminal 2 is used as a terminal pin to be inserted into a plug 15 of a connector. In this case, the through terminal 2 is provided on the plug 15, and is installed in a straight line on the base body 1 corresponding to the fitting hole 15a, and the component mounting portion 2a is fitted into the fitting hole 15a. By fitting them together, they can be detachably attached, and these through terminals 2 can be used as terminals for connection with an external circuit.

As mentioned above, in the above embodiment, purine I.
Since each electronic component is mounted using the through terminal 2 protruding from the wiring board, this mounting work is as simple as a simple fitting operation, and each electronic component is attached to the through terminal 2. Since the position is reliably regulated by , there is no possibility of misalignment. Therefore, it is possible to perform the mounting work of the electronic components using a machine such as a robot, and it is possible to automate the process and improve production efficiency and reduce manufacturing costs. 1 Further, in the above embodiment, the through terminal 2 forms a flat surface on the printed wiring surface 1b side of the base 1, and therefore the printed wiring surface 1b is a flat plane without unevenness. Therefore, when performing a so-called continuity test by pushing and drawing test pins on a printed wiring board to input and output signals, it is sufficient to use a simple needle-shaped test pin as the test pin, and the configuration of the test equipment used can be simplified and made cheaper.

Furthermore, since the printed wiring surface 1b is flat as described above, other substrates can be easily attached to the printed wiring surface 1b, and wiring density can be easily increased by multilayering.

Furthermore, in the above embodiment, since the connection of electronic components can be achieved by caulking the through terminals 2, soldering such as a solder bridge does not cause defects and reliability can be improved. . Moreover, when applied to a double-sided printed wiring board, the wiring pattern 3a is formed on both sides.

3b can be connected by caulking the through terminals 2, thereby eliminating the need for a complicated process.

〔Effect of the invention〕

As is clear from the description of the above-mentioned embodiments, according to the present invention, it is possible to make the work of mounting parts extremely easy, and to improve the positional accuracy of the parts to be mounted, thereby increasing reliability. It is possible to improve. Therefore, it is possible to improve production efficiency and reduce manufacturing costs by automating the above-mentioned mounting work.

Further, in the printed wiring board of the present invention, it is possible to test the board using test pins with a simple structure, and therefore it is possible to reduce the cost of the equipment used for testing.

Furthermore, according to the present invention, it is possible to easily construct a double-sided printed wiring board using through terminals, and it is possible to realize a reduction in the price of the double-sided printed wiring board.

[Brief explanation of the drawing]

FIG. 1 is an external perspective view showing an example of a printed wiring board to which the present invention is applied, and FIG. 2 is an enlarged sectional view of a main part showing the state of attachment of a through-bolt I element. FIG. 3 is an enlarged cross-sectional view of the main part showing another example of how the through terminal is mounted, and FIG. 4 is an enlarged cross-sectional view of the main part showing still another example. FIGS. 5 to 7 are enlarged cross-sectional views of essential parts showing examples of connections of double-sided printed wiring boards using through terminals, respectively. FIGS. 8(A) to 8th fixation) are schematic cross-sectional views showing an example of the method for manufacturing a printed wiring board according to the present invention according to the process order. Figure 9 is a cross-sectional view showing the mounting state of chip components, 1θ
The figure is a cross-sectional view showing the state of mounting a large component, and FIG. 11 is a cross-sectional view showing the state of mounting a new product, which explains how to solder an electronic component with electrodes on the outer peripheral wall. FIG. 15 is a sectional view showing a method of connecting a connector to a plug when a through terminal is used as a terminal pin. 1...Base 2...Through terminal 3...
・・・・・・・・・Wiring Hatern Patent Applicant Sony Corporation Representative Patent Attorney Kodo Koike 1) Sakae Mura - Figure 1 Figure 2 Figure 8 (C) Figure 8 (D) Figure 8 (E) ■ Figure 9 n Figure 10 1 Figure 1I Figure 2 Figure 12 1S

Claims (1)

[Claims] A through terminal is planted on a base on which a wiring pattern has been formed in advance, one end of the through terminal protrudes from the base to form a component attachment part, and the other end is substantially flush with the base. printed wiring board.