JPS6046043A - Signal repeating plate - Google Patents

Abstract

PURPOSE:To enable to sufficiently correct the displacements of rotations of a probe pointer and a probe card by forming a plurality of conductor patterns having a direction of the prescribed angle to a normal line on a circumference of the surface of a signal repeating plate used for testing an integrated circuit. CONSTITUTION:A conductor pattern 11 is formed at an angle (alpha) to a line segment AB from the point B on the circumference having the center A of a signal repeating plate 10 as a center. A test signal from a test station is connected from signal connecting pins 12 to the pattern 11, led from the signal connecting pins 16 through the conductor pattern 18 of a probe card mounting plate 17 and pins 20 of a connector 19 to a probe card 21, and connected to a probe pointer 22. A signal connecting pin holding unit 26 is engaged with a slide 23 of a slip plate 24, and when a rotary mechanism 15 is rotated, the pins 16 move on the pattern 11. The pattern 11 has much larger correctable angle theta2 as compared with the correctable angle theta1 of the conventional sector-shaped conductor pattern 8'.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a signal relay board used for testing integrated circuits.

A wafer inspection process is one of the integrated circuit (hereinafter referred to as IC) manufacturing processes. When a large number of IC chips are present on a single semiconductor wafer, test signals from an integrated circuit testing device (hereinafter referred to as a tester) are set on a wafer probing device (hereinafter referred to as a prober) to be measured. A signal is applied to a signal pad on each IC chip on a wafer using a probe needle to test the IC chip. In general, the mechanical connection line between the tester and the prober, and the test station where the test signals of the test equipment are generated are mounted on a blower. Since the positional relationship is fixed, it is difficult to slightly change the positional relationship. FIG. 1 shows a cross section of a part of a conventional prober. In the figure, a measurement signal from a test stage is electrically connected via a signal relay board 1 to which a load circuit for IC measurement and the like is attached to a probe card 3 on which a probe needle 2 is installed by a connector 4. The prover accurately positions the X-Y direction of the wafer to be measured in the X-Y direction of the prober itself, and places the chip to be measured at the center position determined on the prober side under the probe card where the probe needles are planted. Set to .

The center position is common among the probe, blower, probe card relay plate, and test station by an accurate positioning mechanism. The glove card is attached to the prober, and the probe needle is planted so that when the chip to be measured is accurately aligned and set under the probe card, the probe needle will connect to the signal pad on the chip. has been done.

However, it is very difficult to accurately position the probe needle and plant it on the probe guard, so depending on the probe card, the X-Y of the probe card itself and the X-Y of the probe needle itself may be slightly different from each other around a common center point. It also affects what is rotating.

t (D) The mechanism for attaching the glove card to the blower 2 involves rotating the probe card around the center point as shown in Figure 1, and aligning the X-Y direction of the probe needle with the X-Y direction of the pusher bar.
- An adjustment mechanism 5 for adjustment in the Y direction is provided.

The signal relay board 1 is positioned and fixed to the test station 6. Further, a signal connection pin 7 from a prober comes into contact with the signal relay board 1, and a conductor pattern for transmitting a test signal from the test station 6 is formed.

Since the signal connection pin 7 rotates together with the rotation mechanism 5, the conductor pattern has fan-shaped conductor patterns 8 arranged on the circumference as shown in FIG. In this case, the rotational deviation of the globe needle globe card in the X-Y direction, which can be corrected by the rotation mechanism 5, is limited by the angle θ9 of the sector-shaped conductor bar 8.

Generally, in a tester that measures multiple bins of ICs and multiple steps at the same time, it is difficult to increase the angle θ9 of the sector-shaped conductor turn 8 because the number of signal pins of the test station increases.

For this reason, it becomes impossible to sufficiently correct the rotational deviation between the probe needle and the probe card in the X-Y direction.

The present invention is intended to eliminate such problems.

Characteristic values of the present invention, in a signal relay board for relaying test signals from an integrated circuit testing device to an integrated circuit probing device, a direction that deviates from a certain angle with the normal to the circumference of the surface of the signal relay board. A signal relay board has multiple conductor patterns with .

Hereinafter, the present invention will be explained in detail using an example.

FIG. 3 shows an example of the conductor pattern of the signal relay board according to the present invention. A circular hole υ is cut out at the center of the signal relay board 10, and a conductor is connected at an angle α to the line segment AB from a point B on the circumference centered on the center point A of the signal relay board 10. A pattern is formed on the circumference.

FIG. 4 is a radial view of a part of the annular signal relay plate of a prober using the signal relay plate according to the present invention. The test signal from the test station is connected to the conductor pattern 13 on the top surface of the multi-relay board 10 through the signal connection pin 12, and is further connected to the conductor pattern 13 on the top surface of the multi-relay board IO.
1 through a through hole 14. Furthermore, the signal connection pin 16 of the rotation mechanism 15 is connected to the conductor pattern 18 of the multiple probe card mounting plate 17. The conductor pattern 18 is connected to the pin 20 of the connector 19 by a conductor pattern, and the measurement signal is often transmitted to the probe card 21.
and further connected to the glove needle 21. The rotation mechanism 15 includes a slit plate 2 having slits 23 as shown in FIG.
4 is set on the upper surface, and the slit plate is fixed to the blower body 25.

Further, the rotation mechanism 15 has a built-in signal connection pin holding unit 26 that can smoothly move within a limited range in the radial direction of the annular rotation mechanism. Further, the conductor pattern 18 of the probe card mounting plate 17 is formed in the radial direction as shown in FIG. There is a good connection.

Here, the guide portion 27 of the signal connection pin holding unit 26 is fitted into the slit 23 of the slit plate 24 and moves smoothly along the slit 23 of the slit plate 24 as the multi-rotation mechanism 15 rotates. It has become.

When the rotation mechanism rotates, the multi-pin signal connection pin 16 moves on the conductor surface (turn 11) of the signal relay plate 10.

As mentioned above, in FIG. 3, the conventional fan-shaped conductor pattern 29
The conductor pattern 11 according to the present invention has a much larger correctable angle θ! than the correctable angle θ1 in . Sufficient rotation correction can be performed even when performing a wafer test using a test station with a large number of pins.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a conventional prober cut at a part of the ring, FIG. 2 is a partial plan view of a conventional signal relay board, and FIG. 3 is a partial plan view of a signal center board according to an embodiment of the present invention. , Fig. 4 shows an embodiment of the present invention, a cross section of a prober using a signal relay board cut at a part of the ring, Fig. 5 is a partial plan view of the slit plate, and Fig. 6 shows the probe card mounting plate. 7 is a partial plan view of the embodiment shown in FIG. 4 taken along line A-. In the diagram, 1...signal relay board, 2...
... Probe needle, 3 ... Probe card, 4
... Connector, 5... Rotation adjustment mechanism, 6...
...Test stage, 7...Signal connection bin, 8...Conductor pattern, 8'...
Example of conventional sector-shaped conductor pattern, 9... Angle θ of sector-shaped conductor pattern 8, 1o... Curved signal relay board, 11...
...Conductor pattern, 11'...Four conductor patterns according to the present invention, 12...Curved test head, 13...Groove body pattern, 14...Curved through hole, 15...Four rotation mechanism, 16... ...Signal connection bin, 17.Curved probe card mounting plate, 18.Conductor pattern, 19.
...Connector, 20, River...Bin, 21...
...probe card, 22...probe needle,
23...Slit, 24...Slit plate, 25...Proper body, 26...-...
Connection signal bin holding unit, 27... curve guide section, 28
. . . Contact ball, 29. Probe card receiving plate, 30 . . . - Conductor pattern. Figure 4 Figure 7

Claims (1)

[Claims] In a signal relay board that relays test signals from an integrated circuit testing device to an integrated circuit probing device, a plurality of conductor patterns exist on the circumference of the surface of the signal relay board, each having a direction that makes a certain angle with the normal line. A signal relay board characterized by: