JPS6045431U - ワイヤ−ボンデイングキヤピラリ−のアダプタ− - Google Patents

ワイヤ−ボンデイングキヤピラリ−のアダプタ−

Info

Publication number
JPS6045431U
JPS6045431U JP1983136667U JP13666783U JPS6045431U JP S6045431 U JPS6045431 U JP S6045431U JP 1983136667 U JP1983136667 U JP 1983136667U JP 13666783 U JP13666783 U JP 13666783U JP S6045431 U JPS6045431 U JP S6045431U
Authority
JP
Japan
Prior art keywords
locking
edge
adapter
capillary
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983136667U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0142348Y2 (enrdf_load_stackoverflow
Inventor
嘉博 小倉
実 小島
川野　惠一郎
八島　安信
Original Assignee
オグラ宝石精機工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オグラ宝石精機工業株式会社 filed Critical オグラ宝石精機工業株式会社
Priority to JP1983136667U priority Critical patent/JPS6045431U/ja
Publication of JPS6045431U publication Critical patent/JPS6045431U/ja
Application granted granted Critical
Publication of JPH0142348Y2 publication Critical patent/JPH0142348Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78308—Removable capillary

Landscapes

  • Wire Bonding (AREA)
JP1983136667U 1983-09-05 1983-09-05 ワイヤ−ボンデイングキヤピラリ−のアダプタ− Granted JPS6045431U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983136667U JPS6045431U (ja) 1983-09-05 1983-09-05 ワイヤ−ボンデイングキヤピラリ−のアダプタ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983136667U JPS6045431U (ja) 1983-09-05 1983-09-05 ワイヤ−ボンデイングキヤピラリ−のアダプタ−

Publications (2)

Publication Number Publication Date
JPS6045431U true JPS6045431U (ja) 1985-03-30
JPH0142348Y2 JPH0142348Y2 (enrdf_load_stackoverflow) 1989-12-12

Family

ID=30307216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983136667U Granted JPS6045431U (ja) 1983-09-05 1983-09-05 ワイヤ−ボンデイングキヤピラリ−のアダプタ−

Country Status (1)

Country Link
JP (1) JPS6045431U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0142348Y2 (enrdf_load_stackoverflow) 1989-12-12

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