JPS604514A - Polymerizable resin composition - Google Patents

Abstract

PURPOSE:The titled resin composition having improved heat resistance, and organic solvent resistance, containing a thermoplastic heat-resistance resin, a specific ratio of N-vinylpyrrolidone, and a polymerization initiator. CONSTITUTION:(A) 100pts.wt. thermoplastic heat-resistant resin (e.g., polyarylate, polysulfone, poether sulfone, polyether imide, etc.), (B) 5-50pts.wt., preferably 10-30pts.wt. N-vinylpyrrolidone [preferably <=20pts.wt. another polymerizable monomer (e.g., benzyl acrylate, etc.) based on 100pts.wt. component B may be used in case of necessity], and (C) 0.1-2pts.wt. polymerization initiator [preferably, aromatic ketone (e.g., 2-methylpropiophenone, etc.)] based on 100pts.wt. component B, and, if necessary, a thermosetting resin, are molded to give the desired resin composition.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polymerizable resin composition, and more particularly, to a polymerizable resin composition that provides a molded article having excellent not only heat resistance but also organic solvent resistance.

Various thermoplastic heat-resistant resins such as polyarylates, polysulfones, polyethersulfones, polyetherimides, etc. have been known.

They are easy to mold and have excellent heat resistance, so they are used in many fields such as films, sheets, and wire coatings. However, the molded products have low resistance to organic solvents. In particular, its use is still limited because its surface hardness decreases under conditions of contact with organic solvents, and it also has the drawbacks of easily crazing and cracking.

The present invention has been made in order to solve the above-mentioned problems in molded products obtained from thermoplastic heat-resistant resins, and is an object of the present invention, in which heat or active energy ray polymerization provides heat-resistant resin molded products with excellent resistance to organic solvents. The purpose of the present invention is to provide a resin composition with a high level of properties.

The curable resin composition according to the present invention is characterized in that it contains 5 to 50 parts by weight of N-vinylpyrrolidone and a polymerization initiator per 100 parts by weight of the heat-resistant resin.

The heat-resistant resin used in the present invention includes thermoplastic polyarylate, polysulfone, polyethersulfone,
Containing polyetherimide, etc., more specifically, "U polymer" (Unitika @) having a repeating unit represented as a polyarylate, and having a repeating unit represented as a polyether sulfone [ν1ctrex J 100P, 2
00P and 300P (1,C,1, Inc.), rUltem J 1 with repeating units expressed as polyetherimide
000 (G, E, Company), etc.

The polymerizable 414 resin composition according to the present invention contains 5 to 50 parts by weight, preferably 10 to 30 parts by weight, of N-vinylpyrrolidone as a polymerizable monomer for 100 parts by weight of the thermoplastic heat-resistant resin as described in "2". Weigh parts.

This polymerization! Q! Since the polymer has a high solubility in the heat-resistant resin, it forms a uniform composition with the heat-resistant resin, and in the presence of a polymerization initiator described below, heat or active energy such as ultraviolet rays or electron beams are applied. It polymerizes within the matrix of the heat-resistant resin by irradiation with radiation, thereby imparting the desired organic solvent resistance to the heat-resistant resin.

However, when the amount in the composition is less than 5 parts by weight per 100 parts by weight of the heat-resistant resin, the effect of improving organic solvent resistance is poor, while when it exceeds 50 parts by weight, the resin composition This is not preferable because the amount of heat-resistant resin in the product becomes relatively small, and the molded product that is thicker becomes inferior to its original heat resistance.

In the polymerizable 4M fat composition of the present invention, the above-mentioned N-
Other polymerizable monomers can be used in amounts of up to 20 parts by weight per 100 parts by weight of vinylpyrrolidone. Examples of the darkening polymerizable monomer include acrylate it forms such as hensyl acrylate, carpitol acrylate-1., and cyclohexyl acrylate-1., and tetrahydrofurfuryl alcohol. These polymerizable monomers are used because N-vinylpyrrolidone is not as good in meltability of the thermal polymer as N-vinylpyrrolidone.
It is not preferable to use a large amount exceeding 20 parts by weight per 00 parts by weight.

The polymerizable resin composition according to the present invention contains an appropriate amount of a polymerization initiator. The polymerization initiator may be arbitrarily selected from those conventionally used for thermal polymerization and active energy ray polymerization of vinyl monomers, and aromatic ketone initiators are particularly preferred. As such a polymerization initiator, for example, 2
-methylpropiophenone, 4-isopropyl-2-hydroxy-2-methylpropiophenone, and the like. Further, the amount thereof is not particularly limited, but is usually 0.1 to 2 parts by weight per 10 parts by weight of N-vinylpyrrolidone.

Furthermore, in the present invention, as a resin component, in addition to the thermoplastic heat-resistant resin, if necessary, a thermosetting resin such as epoxy resin, polyester resin, polyesterimide resin, etc. is added at 50 weight parts per 100 weight parts of the heat-resistant resin. It may be included in the resin composition in a range of 100% or less. This is because if the content exceeds 50 parts by weight, the molded resin product will lack flexibility, which may be undesirable depending on the application.

The polymerizable resin composition according to the present invention is usually obtained by adding N-vinylpyrrolidone and a polymerization initiator to heat-resistant resin powder, and uniformly mixing the mixture under heating if necessary. Its properties depend on the amount of N-vinylpyrrolidone used, but when it is in a large amount, the heat-resistant resin melts and becomes a viscous solution or a rubbery semisolid, and when it is in a small amount, it becomes a powder.

Further, the molding method is not limited at all, and any molding method normally applied to the thermoplastic heat-resistant resin used in the present invention, such as extrusion molding and injection molding, can be used.

As described above, the polymerizable resin composition according to the present invention is a heat-resistant resin, a polymerizable l! Since it contains N-vinylpyrrolidone as a polymer and a polymerization initiator, it can be easily molded into a molded product of any shape. By irradiating with active energy rays, N-vinylpyrrolidone polymerizes within the matrix of the heat-resistant resin, giving the heat-resistant resin a three-dimensional structure similar to a crosslinked structure, so while maintaining its desired heat resistance, Organic solvent resistance can be improved.

The present invention will be explained below with reference to Examples, but the present invention is not limited to these Examples in any way. In addition, in the following, parts mean parts by weight, and ultraviolet rays are 80
lQc with W/cm metal hydride lamp
It was irradiated from a distance of m.

Example 1 Polyetherimide Ultem 100OJ 10
0 parts, 91,710 parts of N-vinylpyro and 2 parts of 2-human-roxy-2-methylpropiophenone were uniformly mixed to obtain a resin composition of the present invention. This composition was formed into a film with a thickness of 30 μm, and then irradiated with ultraviolet rays.

Example 2 Polyethersulfone r200 PJ 100 parts NiN-
15 parts of vinylpyrrolidone and 2 parts of 2-hydroxy-2-methylpropiophenone were uniformly mixed to obtain a resin composition of the present invention. This composition was formed into a film with a thickness of 30 μm, and then irradiated with ultraviolet rays.

Example 3 The same polyether imyl as in Example 1 = ' N in 100 parts
- 10 parts of vinylpyrrolidone and 2 parts of 4-isopropyl-2-hydroxy-2-methylpropiophenone were mixed uniformly, and then epoxy resin "Epicoat 1004J 20
The components were uniformly mixed to obtain a resin composition of the present invention. This composition was formed into a film with a thickness of 30 μm, irradiated with ultraviolet rays, and then heated at a temperature of 180° C. for 30 minutes.

Example 4 50 parts of N-vinylpyrrolidone and 4 parts of 4-isopropyl-2-hydroxy-2-methylpropiophenone were uniformly mixed with 100 parts of the same polyetherimide as in Example 1.
A resin composition of the present invention was obtained.

This composition was applied to a thickness of 30 μm on a copper plate and then irradiated with ultraviolet rays.

The surface hardness of each film obtained above was measured, and the film was immersed in each organic solvent shown in the table at room temperature for 24 hours.
The pencil hardness was measured and the surface condition was observed. The results are shown in the table. For comparison, the same polyetherimide as in Example 1 and the same polyether sulfone as in Example 2 were formed into films with a thickness of 30μ, and the surface hardness and organic solvent resistance were evaluated in the same manner as above. are also shown in the table as Comparative Examples 1 and 2, respectively.

The surface hardness of the resin molded product according to the comparative example decreased significantly and cracks appeared on the surface after immersion in an organic solvent, whereas the molded product made from the resin composition according to the present invention showed a remarkable decrease in surface hardness after immersion in an organic solvent. It is clear that the material also maintains good surface hardness and surface condition, and has excellent resistance to organic solvents.

Claims (1)

[Claims] (1) A polymerizable resin composition containing 5 to 50 parts by weight of N-vinylpyrrolidone and a polymerization initiator per 100 parts by weight of a thermoplastic heat-resistant resin.