JPS6042295Y2 - Honeycomb plate with heat pipe - Google Patents
Honeycomb plate with heat pipeInfo
- Publication number
- JPS6042295Y2 JPS6042295Y2 JP18197380U JP18197380U JPS6042295Y2 JP S6042295 Y2 JPS6042295 Y2 JP S6042295Y2 JP 18197380 U JP18197380 U JP 18197380U JP 18197380 U JP18197380 U JP 18197380U JP S6042295 Y2 JPS6042295 Y2 JP S6042295Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- honeycomb
- honeycomb plate
- height
- skin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【考案の詳細な説明】
本考案は高伝熱ヒートパイプを備えたハニカム板に関す
るものである。[Detailed Description of the Invention] The present invention relates to a honeycomb plate equipped with a high heat transfer heat pipe.
従来のヒートパイプ埋め込みハニカム板は、第１図に示
されるように、表裏２枚のハニカムスキン２が平行にな
るよう、すなわち、ヒートパイプ１によってハニカムス
キン２が盛り上がらないように成形するため、ハニカム
スキン２とヒートパイプ１ （またはハニカムスキン２
とハニカムコア４）の間に接着剤３が厚く入り込むきら
いがあり、ハニカムスキン表裏の熱抵抗が大きくなる欠
点があった。As shown in FIG. 1, the conventional honeycomb board with embedded heat pipes is formed so that the two honeycomb skins 2 on the front and back sides are parallel, that is, so that the honeycomb skins 2 are not raised by the heat pipes 1. Skin 2 and heat pipe 1 (or honeycomb skin 2
There is a tendency for the adhesive 3 to thickly penetrate between the honeycomb core 4) and the honeycomb core 4), which has the drawback of increasing heat resistance on the front and back sides of the honeycomb skin.
本考案は、これらの欠点を解決するため、ヒートパイプ
埋め込みハニカム板の目標高さにヒートパイプの高さを
成形しておき、そのヒートパイプの高さより高いハニカ
ムコアを用いて、このハニカム板成形時にハニカムコア
をヒートパイプの高さまで押しつぶすことによりハニカ
ムスキンとハニカムコア及びヒートパイプ間の接着剤を
薄くまたは直接金属接触させるようにしたもので、ハニ
カムスキン間の熱抵抗及びハニカムスキン２とヒートパ
イプ１の熱抵抗を極端に小さくすることを特徴としたも
のである。In order to solve these drawbacks, the present invention has been developed by molding the height of the heat pipe to the target height of the heat pipe-embedded honeycomb plate, and using a honeycomb core higher than the height of the heat pipe to mold the honeycomb plate. By crushing the honeycomb core to the height of the heat pipe, the adhesive between the honeycomb skin, the honeycomb core, and the heat pipe is made into thin or direct metal contact. 1 is characterized by extremely low thermal resistance.
第２図は本考案の実施例の断面図であり、１はヒートパ
イプ、２はハニカムスキン、３は接着剤、５はつぶされ
たハニカムコアである。FIG. 2 is a cross-sectional view of an embodiment of the present invention, where 1 is a heat pipe, 2 is a honeycomb skin, 3 is an adhesive, and 5 is a crushed honeycomb core.
このような構造になっているから、ヒートパイプ１とハ
ニカムスキン２の接触面において接着剤を薄くまたは直
接接触させることができる。With such a structure, the adhesive can be applied thinly or directly to the contact surfaces between the heat pipe 1 and the honeycomb skin 2.
以上説明したように、本考案によれば、ヒートパイプと
ハニカムスキンの間の接着剤を薄く、または直接接触さ
せることができるから、その間の熱抵抗を小さくてきヒ
ートパイプよりハニカムスキンへの伝熱量を増大させる
ことができる。As explained above, according to the present invention, since the adhesive between the heat pipe and the honeycomb skin can be made thin or in direct contact with each other, the thermal resistance between them can be reduced, and the amount of heat transferred to the honeycomb skin from that of the heat pipe can be reduced. can be increased.
第１図は従来のヒートパイプ埋め込みハニカム板の断面
図、第２図は本考案の実施例の断面図である。
図において１・・・・・・ヒートパイプ、２・・・・・
・ハニカムスキン、３・・・・・・接着剤、４・・・・
・・ハニカムコア、５・・・・・・つぶされたコアであ
る。FIG. 1 is a sectional view of a conventional honeycomb plate with embedded heat pipes, and FIG. 2 is a sectional view of an embodiment of the present invention. In the figure, 1...heat pipe, 2...
・Honeycomb skin, 3...Adhesive, 4...
... Honeycomb core, 5 ... It is a crushed core.
Claims (1)
カム板にヒートパイプを埋込み、そのハニカムコアの高
さを前記ヒートパイプの高さまで押しつぶして形成され
たことを特徴とするヒートパイプ付ハニカム板。1. A honeycomb board with heat pipes, characterized in that a heat pipe is embedded in a honeycomb board having a honeycomb core higher than the height of the heat pipe, and the height of the honeycomb core is pressed down to the height of the heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18197380U JPS6042295Y2 (en) | 1980-12-18 | 1980-12-18 | Honeycomb plate with heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18197380U JPS6042295Y2 (en) | 1980-12-18 | 1980-12-18 | Honeycomb plate with heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57104179U JPS57104179U (en) | 1982-06-26 |
| JPS6042295Y2 true JPS6042295Y2 (en) | 1985-12-25 |
Family
ID=29979929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18197380U Expired JPS6042295Y2 (en) | 1980-12-18 | 1980-12-18 | Honeycomb plate with heat pipe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6042295Y2 (en) |
-
1980
- 1980-12-18 JP JP18197380U patent/JPS6042295Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57104179U (en) | 1982-06-26 |
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