JPS6040595Y2 - Melting plating tank - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to an improvement of a hot-dip plating tank, and in particular, it makes it possible to reduce the installation area, save on heat source costs, and facilitate maintenance during operation.

In general, hot-dip plating is widely used for galvanizing steel, tin plating copper and copper alloys, and solder plating, and materials made by hot-dipping metal wires, strips, pipes, etc. with low melting point metals are widely used in industry. There is.

For example, a material obtained by hot-dipping solder on a copper wire to a thickness of 5 to 10 microns is used for electronic components and communication conductors.

In such hot-dip plating, in order to increase the thickness, it is necessary to lower the bath temperature and increase the viscosity of the molten bath.

However, if the bath temperature is lowered, wettability with the material to be plated will be insufficient, causing pinholes and unplated areas.

It is well known that wettability occurs when the material to be plated and the plating metal, such as tin plating of copper, react with copper to form a type of alloy, and that wettability progresses exponentially more easily in a high-temperature bath. It is.

For this reason, even in hot-dip plating, two hot-dip plating tanks 1 and 1' are arranged in series as shown in Fig. 1, and the front plating tank 1 is used as the high-temperature bath 2 for melting the plated metal, and the rear plating tank 1'
is a low-temperature bath 2' for melting plating metal, and the material to be plated is passed through the high-temperature bath 2 by a guide roll 3 provided in the front plating tank 1 and a guide roll 4 provided above the plating tank 1, and then A drawing die 5 placed between both rolls 3 and 4
After thinly plating the plating metal through the plating tank 1', the plated metal is passed through the low temperature bath 2' by a guide roll 3' installed in the rear plating tank 1' and a guide roll 4' installed above the plating tank 1'. The plating metal is thickly plated through a drawing die 5' placed between the rolls 3' and 4'.

According to such hot-dip plating, a high-quality hot-dip plating material can be obtained compared to hot-dip plating using a single tank.

However, compared to a single tank, it requires twice as much equipment, doubles the installation area and heat source costs, requires twice as much input for maintenance during operation, and requires more expensive plated metal and
For example, not only does it require a large amount of solder, but it also suffers from losses due to oxidation, which cannot be ignored.

In order to solve the above-mentioned problems, the present invention was developed after various studies.
We have developed a hot-dip plating tank that reduces the installation area and heat costs by half, has little loss due to oxidation, and is easy to maintain during operation.The tank holds a molten bath of plated metal, and the plated metal is placed in the bath. In a hot-dip plating tank in which plating is performed by passing material continuously, the inside of the tank is divided into at least two parts, an insertion chamber and a withdrawal chamber for the material to be plated, by a partition wall having a passage port for the material to be plated, and the bath temperature in the insertion chamber is The temperature of the bath is maintained at a higher temperature than the bath temperature in the drawer chamber.

This will be explained in detail using the drawings.

Figure 2 shows an embodiment of the hot-dip plating tank of the present invention.
In the figure, a indicates a material to be plated, 1 indicates a hot-dip plating tank, and 6 indicates a partition wall.In the plating tank 1, the partition wall 6 having a lower passage through which the material to be plated a passes is installed.
The chamber is divided into two chambers, one of which is an insertion chamber 1a for plating material a, and the other is a drawer chamber 1b for plated material a. Let's call it hot bath 2b.

A guide roll 3a13b is provided in the insertion chamber 1a and the drawer chamber 1b facing the passing lower part of the partition wall 6, and a guide roll 4 is provided above the drawer chamber 1b. A drawing die 5 is arranged.

The partition wall 6 is made of a refractory material that does not react with the molten bath of the plating metal, such as refractory brick or asbestos, and divides the inside of the plating tank 1 into two chambers, an insertion chamber 1a and a drawer chamber 1b, and a lower passage through which the material to be plated a passes. It is provided.

The insertion chamber 1a and the drawer chamber 1b are each provided with, for example, a fuel burner or an electric heating element as heat sources 8a and 8b.
The molten bath of plated metal in the drawer chamber 1b can be kept in a high temperature bath 2a, which is higher in temperature than the molten bath of plated metal in the drawer chamber 1b, and the bath in the drawer chamber 1b can be kept in a low temperature bath 2b.

For example, in the case of solder-plated copper wire, the high temperature bath 2a is heated to 300°C.
The low temperature bath 2b is maintained at a temperature of about 200 to 250°C.

The material to be plated a is transferred from the insertion chamber 1a of the plating bath 1 to the high temperature bath 2a.
After entering the interior, the surface is thinly plated using a high-temperature bath 2a, and then passed through a passage lower formed in the partition wall 6 by a guide roll 3a provided in the insertion chamber 1a and a guide roll 3b provided in the drawer chamber 1b. , enters the low-temperature bath 2b in the drawer chamber 1b, and thick plating is performed in the low-temperature bath 2b.

This is pulled out through a drawing die 5 using a guide roll 4.

The plating bath of the present invention has the above-mentioned configuration, and the heat source consumption of the high temperature bath and low temperature bath is mostly due to the heat source of the high temperature bath, and the heat source of the low temperature bath should take into consideration the heat radiation characteristics to the partition walls, passage ports, and surroundings. This can be minimized.

It is also possible to limit the amount to a level for temperature control.

Therefore, in the conventional two-bath system, when the material plated in the first tank is cooled and solidified before being introduced into the second tank, and the heat dissipation area of the two tanks is considered, the heat source consumption is halved in the plating tank of the present invention.

Also, compared to the two-tank system, oxidation and slag generation are reduced by half.

Furthermore, by supplying plating metal, such as solder, consumed by plating into the drawer chamber, the low temperature bath section in the drawer chamber can be kept clean at all times, contributing to quality improvement.

Furthermore, since the use of drawing dies and guide rolls can be halved, maintenance and repair thereof can be significantly reduced, which is a remarkable effect.

Although an example has been described above in which the material to be plated is pulled up in the vertical direction, the present invention is not limited to this, and can be carried out in exactly the same manner even when pulled out in the horizontal direction.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing an example of a conventional hot-dip plating tank, and FIG. 2 is a side sectional view showing an example of the hot-dip plating tank of the present invention. a... Material to be plated, 1, 1'... Hot dip plating tank, 1a... Insertion chamber, 1b...
Drawer room, 2, 2a... High temperature bath, 2, 2b...
...low temperature bath, 3,3', 3at 3bt 4t
4'-----Guide roll, 5. 5'-...
...Drawing die, 6...Partition wall, 7...
Passage gate.

Claims (1)

[Scope of utility model registration request] In a hot-dip plating tank in which a molten bath of plating metal is held in the tank and a material to be plated is continuously passed through the bath for plating, a partition wall having a passage port for the material to be plated is provided in the tank. A hot-dip plating tank characterized in that it is divided into two parts: an insertion chamber for plating material and a pull-out chamber, and the bath temperature in the insertion chamber is maintained at a higher temperature than the bath temperature in the pull-out chamber.