JPS6040585Y2 - Matsufuru device for cooling high temperature objects - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a Matsufuru device for cooling objects at high temperatures.

For example, in a conveyor belt furnace that heat-treats the workpiece, the workpiece is placed on the conveyor belt and continuously transferred through the heating furnace and the cooling Matsufuru device to bring the workpiece to a predetermined temperature. It is done by heating and then cooling.

In this case, the object to be processed needs to be uniformly heated and cooled, as well as rapidly cooled.

For this purpose, for example, as shown in FIG. 1, a water-cooled mattful device 3 surrounding the belt 1a is provided on the exit side of the heating furnace 2 through which the belt 1a of the belt conveyor 1 passes, and the material to be processed is placed on the belt 1a. A device is used which carries out the required heating and cooling by placing the material on a heating furnace 2 and transferring it through the water-cooled matsufuru device 3.

For example, as shown in FIG. 2, the water-cooled Matsufuru device 3 has a jacket structure in which a metal Matsufuru 4 is covered with a mantle 5, and cooling water is supplied from a water inlet 5a and drained from a drain port 5b. Or, as shown in Fig. 3, is the cooling water passage copper pipe 6 made of an aluminum plate? a and 7b and attached to the outer wall of the metal Matsufuru 4, or as shown in FIG. There is one in which a thermally conductive filler 7 is filled so as to fill the gap between the two.

However, with the configuration shown in Figure 2, (1)
(2) It cannot be used when the external pressure on the drain side, that is, the back pressure is high, (3)
There were drawbacks such as difficulty in allowing the cooling water to flow evenly around the Matsufuru 4, resulting in uneven cooling effect, and (4) making manufacturing difficult and expensive.

In addition, the configuration shown in Figure 3 or Figure 4 is
(1) The contact thermal resistance of the parts where different parts come into contact with each other and the thermal resistance of the Matsufuru are high, resulting in poor cooling efficiency and rapid cooling is not possible. (2) Therefore, the length of the Matsufuru must be increased, and the The disadvantages are that it takes up a larger area and is more expensive.

The present invention provides a matsufuru device for cooling high-temperature objects that improves the above-mentioned drawbacks by easily performing efficient cooling and uniform cooling.

In the cooling Matsufuru device according to the present invention, the cooling pipe is molded and disposed inside the Matsufuru main body with a metal body having good thermal conductivity, and the cooling pipe is disposed inside the molded metal body on the surface facing the object to be cooled. It is characterized by being coated with an infrared absorber.

Next, embodiments of the present invention will be described in detail with reference to the drawings.

In FIGS. 5 and 6, 4 is a matsufuru body made of a metal material, and 6 is a water-flowing steel pipe as a cooling pipe, which is molded with a metal body 8 having good thermal conductivity inside this matsufuru body. It is.

As the molded metal body 8, for example, aluminum or aluminum alloy, which has a low melting point and good thermal conductivity, is used.

In order to mold the above-mentioned water-conducting copper pipe 6, for example, melt aluminum and pour it into the bottom side of the Matsufuru main body 4 shown in FIG. Then, mold the copper tube 6 on the other side in the same manner as above.

Reference numeral 9 denotes an infrared absorber coated on the inner surface of the molded metal body 8 facing the object to be cooled.

As this infrared absorbing agent, for example, red iron (Fe20
3) mixed with water glass is used.

Reference numeral 10 denotes a mounting flange provided on one end side of the Matsuful main body 4.

In the Matsufuru device configured as described above, the heat dissipated from the object to be cooled inserted into the device is efficiently absorbed by the infrared absorber 9, and the absorbed thermal energy is transferred to the infrared absorber 9. It is well communicated to the cooling water in the body 8 and the copper tube 6 which is closely connected to this metal body.

Therefore, cooling efficiency is extremely high, uniform cooling is performed, and rapid cooling is also possible.

This makes it possible to reduce the length of the cooling device to about 1n compared to the conventional cooling device shown in FIGS. 3 and 4.

In addition to the configuration of the embodiment shown in FIG.
It is also effective to attach plates made of a metal with good thermal conductivity to the inner walls of both side walls 4a, and to embed both ends of the plates in the upper and lower mold parts, respectively.

As described above, in the cooling matsufuru device of the present invention, the cooling pipe is molded and disposed inside the matsufuru body with a metal body having good thermal conductivity, and the cooling pipe is disposed inside the molded metal body to face the object to be cooled. Since the surface is coated with an infrared absorber,
The object to be cooled can be uniformly cooled with extremely high cooling efficiency, and rapid cooling can be performed.

Therefore, even when used in a device that cools an object while transferring it, the length of the matsufuru can be made relatively shorter than that of conventional devices, reducing the area occupied by the device and reducing the cost. I can do it.

[Brief explanation of the drawing]

Figure 1 is an explanatory diagram showing the outline of a conveyor belt furnace equipped with a cooling Matsufuru device, Figures 2A, B to 4A,
B is a drawing showing three different examples of conventional cooling manifold devices, where A in each figure is a longitudinal sectional view, and B is a sectional view taken along the line AA' of A. 5A and 5B are drawings showing an embodiment of the present invention, in which A is a longitudinal sectional view, B is a sectional view taken along the line AA' of A, and FIG. 6 is a needle perspective view of the embodiment. 4... Matsuful main body, 6... Water passing copper pipe as a cooling pipe, 8... Aluminum as a metal body with good thermal conductivity, 9... ...A kneading agent of red iron oxide and water glass as an infrared absorber.

Claims (1)

[Scope of utility model registration request] A cooling pipe is disposed inside the Matsuful body by being molded with a metal body with good thermal conductivity, and an infrared absorber is coated on the surface facing the object to be cooled inside the molded metal body. Matsufuru device for cooling high-temperature objects.