JPS6040003B2 - optical coupling device - Google Patents

optical coupling device

Info

Publication number
JPS6040003B2
JPS6040003B2 JP15534080A JP15534080A JPS6040003B2 JP S6040003 B2 JPS6040003 B2 JP S6040003B2 JP 15534080 A JP15534080 A JP 15534080A JP 15534080 A JP15534080 A JP 15534080A JP S6040003 B2 JPS6040003 B2 JP S6040003B2
Authority
JP
Japan
Prior art keywords
fiber
lens
laser
optical
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15534080A
Other languages
Japanese (ja)
Other versions
JPS5778511A (en
Inventor
康伸 大島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP15534080A priority Critical patent/JPS6040003B2/en
Publication of JPS5778511A publication Critical patent/JPS5778511A/en
Publication of JPS6040003B2 publication Critical patent/JPS6040003B2/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Description

【発明の詳細な説明】 本発明は半導体レーザーと光ファィバ−との光結合装置
において各アセンブリを、精度良く固定する構成に関す
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a configuration for accurately fixing each assembly in an optical coupling device for a semiconductor laser and an optical fiber.

従来ファイバーとしーザ−を結合する構成は、種々考案
されているが一番一般的な構成は微小レンズを用いて発
散したレーザー光を光ファイバーのコア隆内に紋り込む
構成である。
Conventionally, various configurations for coupling a fiber and a laser have been devised, but the most common configuration is one in which a microlens is used to penetrate the diverging laser beam into the core ridge of the optical fiber.

効率の良い結合を得る為にはしーザーチップ、レンズ、
ファイバー等の各部品が正確に位置調整されてねばなら
ず、又その固定方法は、装置の信頼性上からも確実なも
のでなければならない。一般的にはまずレーザー素子と
しンズを無調整に組み、その後ファイバーを光学調整し
た後固定するものと、それとは逆にレンズ、ファイバー
を無調整に組みレーザー素子を光学調整し、最適出力位
置で固定する二構成に大別されるが、前者の場合、レー
ザー素子としンズの位置の誤差がレンズで拡大されファ
イバーの調整余裕をそれだけ大きく取らないといけない
のでまずレンズとフアィバ−を組み、その後レーザー素
子を固定するものが良い。半導体レーザーと光ファイバ
ーの光結合装置組む場合、まずレーザーレンズ、ファイ
バー及び各々のアダプターの製作精度誤差、機械的な組
合わせ精度誤差を最終的な光学調整の糸裕しろを取って
補耳しなければならない。
In order to obtain efficient coupling, Caesar chips, lenses,
Each component such as a fiber must be accurately positioned, and the method of fixing must be reliable from the viewpoint of the reliability of the device. Generally speaking, the laser element and lens are first assembled without any adjustment, and then the fiber is optically adjusted and then fixed.In contrast, the lens and fiber are assembled without adjustment, the laser element is optically adjusted, and then the fiber is optically adjusted and fixed. In the former case, the error in the position of the laser element and lens is magnified by the lens, and it is necessary to take a large adjustment margin for the fiber. Therefore, the lens and fiber are assembled first, and then the laser is fixed. Something that fixes the element is good. When assembling an optical coupling device between a semiconductor laser and an optical fiber, it is necessary to compensate for errors in the manufacturing accuracy of the laser lens, fiber, and each adapter, as well as errors in mechanical combination accuracy by taking allowances for the final optical adjustment. It won't happen.

各々の部村の組立で、レーザーチップのマウントにはハ
ンダ、スズ等の低融点金属が使われるがレンズ、ファイ
バー等の光学部品の組込みには、ェポキシ等の高分子樹
脂が使われる。ただし、最終的な位置調整後の固定は、
接着に要する時間の関係から一般にハンダが使われる事
が多い。その場合、ハンダを溶かした時のフラックスの
廻り込みによる光学面のクモリ、ハンダを溶かす時の熱
による他の接着面の損傷、ハンダの冷却時の収縮変形に
よる光軸レンズ等の問題があり、又最初の各部材の製作
精度が悪いと、後の最終調整時、調整の自由度が少ない
と調整しきれず、自由度を大きく取るとハンダ使用時の
種々の問題点が拡大される。本発明の目的は、上記ハン
ダ溶接のメリットを生かしつつ、なおその欠点をさげる
事のできる光結合装置を提供することにある。
In the assembly of each section, low melting point metals such as solder and tin are used to mount the laser chip, while polymeric resins such as epoxy are used to incorporate optical components such as lenses and fibers. However, fixation after final position adjustment is
Solder is generally used because of the time required for bonding. In that case, there are problems such as clouding of the optical surface due to the flux going around when the solder is melted, damage to other adhesive surfaces due to the heat when melting the solder, and optical axis lenses due to shrinkage and deformation when the solder is cooled. In addition, if the initial manufacturing precision of each member is poor, the final adjustment cannot be completed if the degree of freedom of adjustment is small, and if the degree of freedom is increased, various problems when using solder will be magnified. An object of the present invention is to provide an optical coupling device that can take advantage of the advantages of solder welding while reducing its disadvantages.

本発明によれば、半導体レーザーのレーザー光をレンズ
で収束して光ファイバーに結合する装置において、ファ
イバー、レンズが一体となったファイバーアセンブリと
半導体レーザーパッケージに接着されたアダプターが両
面をハンダでサンドイッチ状にはさまれた接続用補助リ
ングを使ってその相方が光学的に調整された状態で接続
固定されている事を特徴とする光結合装置が得られる。
According to the present invention, in a device that converges laser light from a semiconductor laser with a lens and couples it to an optical fiber, a fiber assembly in which a fiber and a lens are integrated and an adapter bonded to a semiconductor laser package are sandwiched with solder on both sides. An optical coupling device is obtained in which the partner is connected and fixed in an optically adjusted state using the auxiliary connection ring sandwiched between the two.

本発明によれば、最終調整時に各部材間のすき間を小さ
くしたままで、調整の自由度が大きく取れる為、ハンダ
フラツクスの廻り込みや、ハンダ収縮時の光軸ズレをさ
け、又各部材固定上の信頼度を上げる事が出釆る。次に
、本発明の一実施例について第1図を参照しながら説明
する。
According to the present invention, the degree of freedom in adjustment can be increased while keeping the gaps between each member small during the final adjustment. This prevents solder flux from going around and misalignment of the optical axis when solder shrinks. It is possible to increase the fixed reliability. Next, an embodiment of the present invention will be described with reference to FIG.

レーザ−チップ1を中心においた軸対称のパッケージ2
のキャップ3に円筒形のレーザーアダプター4が無調整
ではまりェポキシで接着される。
Axisymmetric package 2 with laser chip 1 in the center
A cylindrical laser adapter 4 is bonded to the cap 3 with epoxy without adjustment.

レンズ5は円柱型のレンズ(例、径1.5脚、長さ3.
8肌)であり、微小凸レンズの作用をして半導体レーザ
ーからの放射角の大きいレーザー光を吸東する。光ファ
イバー7の先端部はナイロン被覆8が除去されガラス管
を通っている。
The lens 5 is a cylindrical lens (eg, diameter 1.5 mm, length 3.5 mm).
8 skin), and acts as a micro-convex lens to absorb laser light with a large radiation angle from a semiconductor laser. The tip of the optical fiber 7 has the nylon coating 8 removed and passes through a glass tube.

更にガラス管9と光ファイバーのナイロン被覆8を内側
に通した金属管10がある。これらはいずれもヱポキシ
等の接着剤で相互に固定され、一体化された状態で光フ
ァイバーの入射端面は光学研序されている。この研序面
にはさらに両面光学研序された厚さ1柵のガラス板11
がェポキシ等の屈折率がほぼ同じ接着剤で界面がうまる
様に固定されている。このガラス板は、レーザー光が光
ファイバー端面で反射し、元のレーザーチップ側へ帰る
のを防ぐ役目をする。上記光ファイバー7としンズ5は
一定の距離を保持する為のスベーサー12を界してファ
イバーレンズアダプター13に無調整にはめ込まれた定
位層にェポキシ等の接着剤で固定されている。
Furthermore, there is a glass tube 9 and a metal tube 10 with an optical fiber nylon coating 8 passed inside. These are all fixed to each other with an adhesive such as epoxy, and the input end face of the optical fiber is optically polished in an integrated state. This grinding surface further includes a glass plate 11 with a thickness of 1 bar, which is optically grinded on both sides.
The two are fixed with an adhesive such as epoxy with approximately the same refractive index so that the interface is filled. This glass plate serves to prevent the laser beam from being reflected at the end face of the optical fiber and returning to the original laser chip side. The optical fiber 7 and lenses 5 are fixed to a stereotactic layer fitted into a fiber lens adapter 13 without adjustment with an adhesive such as epoxy, with a spacer 12 for maintaining a constant distance between them.

このファイバーレンズアダプター13としーザーアダプ
ター4を光学的な位置調整をした後、接続用補助リング
14を界して固定する。この補助リング14はコバー製
で表面に銀〆ッキをほどこし、両面をサンドイッチ状に
ハンダ15ではさんだ厚さ1肌のもので、最初ファイバ
ー、レンズアダプター13にはめ込んだ状態でレーザー
出力が最適値になる様光学調整の後、このリングを高周
波加熱しファイバーレンズアダプターとしーザーアダプ
ターが固定される。本構成によれば各部品間のすき間を
小さくしたままで光学調整の自由度が大きく取れ、又ハ
ンダフラックスの廻り込みや、ハンダ収縮時の光軸ズレ
をさげる事ができる上に、各部材固定の信頼度を上げる
事が出釆る。
After optically adjusting the positions of the fiber lens adapter 13 and the laser adapter 4, the auxiliary connection ring 14 is connected and fixed. This auxiliary ring 14 is made of Kobar, has a silver plated surface, and is sandwiched between both sides with solder 15 to a thickness of 1 skin.When it is first fitted into the fiber and lens adapter 13, the laser output is set to the optimum value. After optical adjustment to achieve this, the ring is heated with high frequency to fix the fiber lens adapter and the laser adapter. With this configuration, the degree of freedom in optical adjustment can be increased while keeping the gaps between each component small, and in addition, it is possible to reduce the turning of solder flux and optical axis misalignment when solder shrinks, and it is possible to fix each component. It is possible to increase the reliability of

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す断面図。 1・・・…レ−ザーチツブ、2……レーザーパッケージ
、3……キャップ、4……レーザーアダプター、5……
レンズ、6……キャップガラス面、7・・・・・・光フ
ァイバー、8…・・・ナイロン被覆、9・・・・・・ガ
ラス管、10・・・・・・金属管、11・・・・・・ガ
ラス板、12……フアイバーレンズスベーサー、13…
…ファイバーレンズアダプター、14・・・・・・接続
用補助リング、15……ハンダリング。 多′図
FIG. 1 is a sectional view showing one embodiment of the present invention. 1... Laser chip, 2... Laser package, 3... Cap, 4... Laser adapter, 5...
Lens, 6... Cap glass surface, 7... Optical fiber, 8... Nylon coating, 9... Glass tube, 10... Metal tube, 11... ...Glass plate, 12...Fiber lens baser, 13...
...Fiber lens adapter, 14...Auxiliary ring for connection, 15...Soldering. polygraph

Claims (1)

【特許請求の範囲】[Claims] 1 半導体レーザーのレーザー光をレンズで収束して光
フアイバーに結合する装置において、フアイバーとレン
ズとが一体となつたフアイバーアセンブリと、半導体レ
ーザーパツケージに接着されたアダプターが両面をハン
ダでサンドイツチ状にはさまれた接続用補助リングを使
つてその相方が光学的に調整された状態で接続固定され
ている事を特徴とする光結合装置。
1 In a device that converges laser light from a semiconductor laser with a lens and couples it to an optical fiber, a fiber assembly in which the fiber and lens are integrated, and an adapter glued to the semiconductor laser package are soldered on both sides to form a sandwich-like structure. An optical coupling device characterized in that its partner is connected and fixed in an optically adjusted state using a sandwiched auxiliary connection ring.
JP15534080A 1980-11-05 1980-11-05 optical coupling device Expired JPS6040003B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15534080A JPS6040003B2 (en) 1980-11-05 1980-11-05 optical coupling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15534080A JPS6040003B2 (en) 1980-11-05 1980-11-05 optical coupling device

Publications (2)

Publication Number Publication Date
JPS5778511A JPS5778511A (en) 1982-05-17
JPS6040003B2 true JPS6040003B2 (en) 1985-09-09

Family

ID=15603745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15534080A Expired JPS6040003B2 (en) 1980-11-05 1980-11-05 optical coupling device

Country Status (1)

Country Link
JP (1) JPS6040003B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118212A (en) * 1981-01-14 1982-07-23 Nec Corp Optical semiconductor receptacle
JPS60172108U (en) * 1984-04-23 1985-11-14 沖電気工業株式会社 Optical semiconductor coupler
JPH0316367U (en) * 1989-06-29 1991-02-19

Also Published As

Publication number Publication date
JPS5778511A (en) 1982-05-17

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