JPS6039224B2 - Manufacturing method for circuit pattern punching mold - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a mold for punching and press-molding a desired circuit pattern on a circuit board, and in particular, a method for manufacturing a mold for punching a circuit pattern using a photo-etching method. Regarding.

Epoxy resin or the like is uniformly filled into the escape groove of the punched metal foil in the flat mold formed in advance, and then a two-step photoresist process is performed to form a blade on the outer edge of the flat mold. The conventional manufacturing method of this kind of mold is complicated and requires considerable effort and skill in the resin filling process and photoresist process, etc. It has the disadvantage that the filled resin must be removed at the stage, and
In view of the fact that it is extremely difficult to mass-produce molds of the required quality compared to the number of complicated work steps described above, the applicant of the present application previously filed Japanese Patent Application No. 51-116843 (see Japanese Patent Publication No. 1983-41769), the inventors have provided a means for suitably solving the problems of the above-mentioned conventional methods and easily manufacturing molds of constant high quality with a simple process.

The present invention aims to improve the method disclosed in Tokuma Sho 51-116843 and provide a new means for manufacturing molds of even better quality, and its features are as follows: Starting from forming a first coating layer with a positive photoresist coat or the like so as to leave the outline or edge of the desired circuit pattern on the surface of the pre-finished mold material,
Next, a second coating layer is formed on the outline of the circuit pattern or the blank area as a twill portion left on this first coating layer by means of plating or the like, which has considerably stronger properties than the first coating layer. Then, a part of the first coating layer, which should be able to take a uniformly larger shape than the shape formed by the second coating layer, is appropriately removed by exposure/developing means, and the metal of the mold material exposed by such peeling is removed. After etching away the portion to form a sufficient clearance groove in the punched metal foil, peeling off all remaining portions of the first coating layer to remove the exposed metal portion surrounded by the second coating layer; Finally, the second coating layer is peeled off to finish the green portion or the portion corresponding to the outline of the circuit pattern into a knife-like shape. In this series of processes, the first coating layer directly serves as a protective film when forming the relief grooves of the punched metal foil, and this is coupled with the fact that the second coating layer has extremely high resistance. Since the relief groove can be formed quickly and accurately, it is possible to obtain an excellent mold that can manufacture even minute circuit patterns while making the entire process very efficient and simple. The present invention also provides the first and second coating layers before proceeding to the step of peeling off a part of the first coating layer so as to form a shape uniformly larger than the shape of the second coating layer. It is an object of the present invention to simultaneously provide another method in which the above-mentioned peeling treatment is performed in a state where a third coating layer having the same quality as the first coating layer is formed on both second coating layers. In this case, the etching process for forming the escape groove for the subsequent punched metal foil can be accomplished more quickly and reliably.

The accompanying drawings illustrate preferred embodiments of the method of the invention as described above, with FIGS. 1-8 showing one process of the invention.

First, the hardness of the female 000 in Figure 1 is increased appropriately by quenching heat treatment in advance, and the obtained surface is 0.2 to 0.3 hard.
The surface of the mold material 1 to be used has been mechanically polished to a surface level, then deoxidized with steam trichloride, etc., and then subjected to appropriate chemical surface treatment such as pickling with phosphoric acid, etc. A positive photoresist film 2 made of diazo or the like as a first coating layer is quickly applied to the surface finished as described above before it is oxidized. As shown in FIG. 2, this positive photoresist film 2 has a closed blank part 2A that fully occupies the green part of the required circuit pattern, that is, the outline, as shown in FIG. 3 figure 1
The resist film 2 located in the blank area 2A is peeled off by exposure and development using a positive photoresist film. In the next step, the blank space 2A is filled with plating 3 using solder or a metal material such as lead or gold, as shown in FIG.
This portion of the plating 3 corresponds to a second coating layer which has characteristics that are extremely resistant compared to that of the resist film 2 as the first coating layer. In the case of the present invention, in preparation for forming escape grooves in the punched metal foil in a later process, a positive photoresist film as shown in FIG. 3, which will be described later, is used as shown in FIG. , the above closing 3
In order for the resist film 2 to have a shape that is appropriately larger than the shape formed by the resist film 2, the outer adjacent portion 2B of the film 2 where the plating 3 is located is immediately peeled off and removed using an exposing/developing means. Thereafter, as shown in FIGS. 1 and 5, the metal portion IA of the mold material 1 exposed in the adjacent portion 2B, indicated by diagonal lines, is etched away to a required depth and bites into the back surface of the resist film 2. Then, an escape groove 4 for the punched metal foil with a slight overhang 4A is formed there. Here, the etching solution is usually about 50 qo.
A ferric chloride solution heated to around 37oBe can be used, and in this case, sufficient etching can be performed without causing any trouble to not only the plating 3 but also the resist film 2. Ru. As mentioned above, the plating 3 portion has much stronger resistance than the resist film 2, so after the above etching process, the resist film 2 is removed.
Either expose the entire surface to light and remove this grain 2 using a developer, or, for example,
Using a stripping solution such as Zm, the film can be directly stripped and removed without performing the above-mentioned full-surface exposure operation (FIG. 1, 6). The overhang portion 4A is appropriately removed at this stage, so that this portion has a substantially vertical wall shape. In this way, the exposed metal part of the mold material surrounded only by the plating 3 is removed by appropriate etching to a required depth, as shown in FIG. 5 will be formed. The recessed part 5 has a slight overhang part 5A on its periphery, but as shown in FIG. The blade portion 6 is formed to match the outline of the required circuit pattern. Note that overhangs as described above can be removed without adversely affecting other parts because the chemical reaction occurs quickly, but one way to minimize such overhangs is to use an etching solution. For example, it is very effective to add a side etch inhibitor as appropriate. This forms a chelate compound with the metal wall surface of the mold, so that the etching speed of the wall surface portion where the spray pressure of the etching solution is low is slower than that of the bottom portion where the spray pressure is high. The mold shown in FIG. 1 and 8 obtained as described above can be put to practical use as is. FIGS. 2 1 to 9 show an embodiment according to another method of the present invention, and as is clear from the figures, the steps of FIGS. The steps shown in FIGS. 1 to 3 and 7 to 9 are also carried out as they are.

When using this method, the edges of the desired circuit pattern, that is, the portion corresponding to the outline, are removed from the positive photoresist film 2 to create a blank space, and the above-mentioned plating 3 is applied thereto. As shown in FIG. 2, a material of the same quality as the film 2 is further overlaid with another positive photo film to reinforce the resist film 2 as the first coating layer. A resist film 7 is formed. Next, as shown in FIG. 5, the outer adjacent portions 2B and 7B of the plating 3 on both films 2 and 7 are removed by exposure and development means in the same manner as in FIG. The surface is exposed and then subjected to a similar etching process to form escape grooves 4 for the punched metal foil (FIG. 2, 6). 4B is an overhang portion that occurs at that time.

According to this method, the resist film 2 is substantially reinforced by the other resist film 7, and as a result, the etching process for the escape groove 4 can be performed strongly and quickly, so that thick circuit patterns can be formed. It is most suitable for use when trying to obtain a mold with a large depth of the groove 4 for punching, or for applications such as forming a finer circuit pattern. In both of the above inventions, the pattern of the blank area 2A to be plated 3 and FIG. 1 4 and FIG. 2 5
In order to form a pattern of the resist film 27 as shown in FIG.
As shown in the figure, the positive and negative films 10 and 11 for making the positive film 12 corresponding to the pattern of the blank area 2A are prepared, and the positive film 13 corresponding to the pattern of the resist film 27 described above is prepared in advance. Make one each.

As shown in FIG. 3 1 and FIGS. 4 1 and 2, the positive film 12 has a line drawing pattern N extending from the side edges of the required circuit pattern ○ shown by broken lines, that is, from the contour line 1 to both sides, respectively.
while the other positive film 13 has a third
As shown in FIGS. 2 and 4, the line drawing pattern P is formed by uniformly expanding the Y side from the contour line 1. The values of × and Y are as conceptually shown in FIG.
It can be determined depending on the size of the mold to be manufactured, and can be defined, for example, by the following formula. X = Umami 10 Y = Heat + Art However, the above formula is subject to the following conditions.

Preciously Each of the negative and positive films 10 to 13 is
This can be easily obtained by appropriately manipulating the exposure conditions when reversing the corresponding master films.

FIGS. 5 and 6 show one method,
When a transparent polyester film 14 having an appropriate thickness is interposed between the master film 15 and the unexposed film 16 to integrate them into a sandwich shape and then exposed, the adjustment of each line drawing pattern N or P is extremely easy. It becomes easier. Such line width adjustment can be achieved by appropriately changing the thickness of the intervening polyester film 14. For example, when using a polyester film 14 with a thickness of 100 mm, the resulting line width is 110 mm. It is possible to get thinner or fatter. In addition,
By controlling the exposure amount, it is also possible to adjust the line width to a fine level of about 30 degrees or less. The film whose bran width has been adjusted by the above method is made by combining a positive film 10 which is made thinner on the X side than the required circuit pattern width and a negative film 11 which is made thicker on the X side as shown in FIG. 6 to make a positive film 12. By preparing these two types of films and exposing them with their pus surfaces aligned as shown in the figure, a positive film 1 is created.
0 and the negative film 11 is formed on the upper middle of the unexposed film 12A as a pattern with a line width that is centered on the outline 1 of the desired circuit pattern. A film 12 can be obtained.

Next, a positive film 13 made thicker on the X side than the required circuit pattern is made in the same manner.

Then, a positive photoresist film 2 is applied onto the mold material using a bonding method, a spinner, spraying, etc.
After applying about 4 to 5 layers of , pre-baking, exposing the line pattern on the line width side with the outline 1 of the required circuit pattern as the center using the positive film 12, and developing it with the specified developer. 2 or 2 can be obtained. Hereafter, when plating 3 is applied to the blank area 2A (the above is the line drawing pattern with the line width of Toru) formed by the above operation,
Using the other positive film 13, align the film 13 on the line drawing pattern formed by the positive photoresist film 2, expose it to light, and develop it using a designated developer. , Figure 1 4 or Figure 2 5
Adjacent portion 2B of resist film 2 or 2 and 7 shown in
and 7B can be peeled off and removed. According to the method for manufacturing a die for punching circuit patterns according to the present invention, there is a step of forming a first coating layer made of a resist film or the like so as to leave the edges, that is, the contours, of a desired circuit pattern, and While it is possible to more easily and quickly complete the process of peeling off a part of the first coating layer so that the shape is uniformly larger than the shape of the second coating layer obtained by plating or the like on the blank area, Since the second coating layer is formed to have extremely high resistance compared to the first coating layer, it is possible to easily and accurately form relief grooves for the punched metal foil to be performed in the subsequent process. Optimal grooves can be constructed in the thick film of metal foil with the desired circuit pattern.

Further, related to this feature, the present invention provides a mold for punching finer circuit patterns by forming a third coating layer that substantially reinforces the thickness of the first coating layer. It is possible to manufacture molds with high precision, and combined with the simplicity of the entire process, it is possible to provide high quality molds at low cost.

[Brief explanation of the drawing]

1 to 8 are conceptual process explanatory diagrams showing an embodiment according to one method of the present invention, and FIGS. 2 1 to 9 are similar concept to FIG. 1 showing an embodiment according to another method of the present invention. Figures 1 and 2 are conceptual diagrams of the exposure film used in each process of Figures 1 and 4 and Figures 2 and 5. Figures 4 and 4 are Figures 3 and 1. , 2 are explanatory views of the films shown in FIG. 2, FIGS. 5 and 6 are views showing an example of manufacturing each film shown in FIG. 3, and FIG. 7 is a conceptual partial enlarged view of a completed mold. 1... Mold material, 2... Positive photoresist film, 2
A...Blank area, 3...Plating, 4...
・Escape groove of punched metal foil, 5... recessed part, 6...
...Blade part, 7...Other resist film. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7

Claims (1)

[Scope of Claims] 1. A method for manufacturing a mold for punching and forming a circuit pattern from metal foil, in which the edges of the desired circuit pattern are left on the hardened and smoothed surface of the mold material. One coating layer is formed, and then a second coating layer having higher resistance than this coating layer is formed in the blank area left in the first coating layer, and the shape is more uniform than that of the second coating layer. After peeling off a part of the first coating layer so as to form a large shape and removing the exposed metal part on the surface of the mold material to form an escape groove for the punched metal foil, A circuit pattern punching die characterized in that all of the first coating layer is peeled off, the exposed metal portion surrounded by the second coating layer is removed, and finally the second coating layer is peeled off. Production method. 2. In a method for manufacturing a mold for punching and molding a circuit pattern from metal foil, a first coating layer is formed on the hardened and smoothed surface of the mold material so as to leave the edges of the required circuit pattern. Then, a second coating layer having higher resistance than this coating layer is formed in the blank area left in the first coating layer, and then the first coating layer is layered on top of both the first and second coating layers. A third coating layer having the same quality as the coating layer is formed, and a portion of both the first and third coating layers is peeled off so as to form a shape uniformly larger than the shape of the second coating layer. ,
After removing the exposed metal part on the surface of the mold material and forming an escape groove for the punched metal foil, all of the first and third coating layers are peeled off and the second coating layer is removed. A method for producing a die for punching a circuit pattern, the method comprising: removing the exposed metal portion surrounded by the second coating layer, and finally peeling off the second coating layer.