JPS6038464A - Polyether-imide resin composition - Google Patents

Polyether-imide resin composition

Info

Publication number
JPS6038464A
JPS6038464A JP14779583A JP14779583A JPS6038464A JP S6038464 A JPS6038464 A JP S6038464A JP 14779583 A JP14779583 A JP 14779583A JP 14779583 A JP14779583 A JP 14779583A JP S6038464 A JPS6038464 A JP S6038464A
Authority
JP
Japan
Prior art keywords
filler
fluororesin
polyether
resin
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14779583A
Other languages
Japanese (ja)
Other versions
JPH0452301B2 (en
Inventor
Teruo Tsumato
照夫 妻藤
Haruo Hayashida
林田 晴雄
Kazuo Hinobeta
比延田 和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP14779583A priority Critical patent/JPS6038464A/en
Publication of JPS6038464A publication Critical patent/JPS6038464A/en
Publication of JPH0452301B2 publication Critical patent/JPH0452301B2/ja
Granted legal-status Critical Current

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Abstract

PURPOSE:To provide the titled compsn. having high heat resistance, rigidity and strength, low mold shrinkage factor and good mold release characteristics, by blending a reinforcing fiber or an inorg. filler with a polyether-imide resin and further adding a specified quantity of a fluororesin thereto. CONSTITUTION:The titled compsn. is obtd. by blending 10-70wt% reinforcing fiber (e.g. glass fiber or carbon fiber) or inorg. filler (e.g. talc or CaCO3) with 20-80wt% polyether-imide and further adding 0.5-20wt% fluororesin (e.g. tetrafluoroethylene resin) thereto. When the reinforcing fiber or the filler is blended with the polyether-imide, heat resistance and rigidity are improved and mold shrinkage factor is reduced depending on the quantity of the reinforcing fiber or the filler. However, a problem is caused that mold release characteristics during injection molding are deteriorated. By using the fluororesin, the mold release properties can be improved without detriment to the above characteristics.

Description

【発明の詳細な説明】 本発明は、高い耐熱性とすぐれた機械的性質および低い
成形ルC縮率と良離型性を刊するポリエーテルイミド樹
脂組成物に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a polyetherimide resin composition that exhibits high heat resistance, excellent mechanical properties, low mold shrinkage and good mold release properties.

ポリエーテルイミドは耐熱性、強度、剛性、難燃性、耐
薬品性などのすぐれたエンジニアリンクプラスチックと
して、とくに電気部品や自動車部品などの用途において
注目されている。
Polyetherimide is attracting attention as an engineering plastic with excellent heat resistance, strength, rigidity, flame retardance, and chemical resistance, especially in applications such as electrical parts and automobile parts.

しかし、該用途におい−(該樹脂の特徴である枠燃性、
耐薬品性、電気的性質などを維持しながら、さらに高い
耐熱性、剛性度、寸法精度(低成形収縮率)を有する材
料が該分野における技術進歩とあいまって要求されてい
る。
However, in this application (frame flammability, which is a characteristic of the resin),
Along with the technological progress in this field, there is a demand for materials that have even higher heat resistance, rigidity, and dimensional accuracy (low mold shrinkage) while maintaining chemical resistance, electrical properties, and the like.

一般に、樹脂にガラスII4維や炭素網給等の繊維状強
化材、談だ、タルク、炭酸カルシウム、炭酸マグネシウ
ム、亜硫酸カルシウム、水酸化アルミニウム、マイカ、
二他、化モリブデン、ウオラストナイト、グラフ1イト
、チタン白、ガラスピーズなどの粉末状、針状もしくは
薄片状の無機充填材等を配合することにより、耐熱性、
剛性、成形収縮率が改良されることが知られている。
Generally, fibrous reinforcing materials such as glass II4 fibers and carbon fibers, silica, talc, calcium carbonate, magnesium carbonate, calcium sulfite, aluminum hydroxide, mica, etc.
In addition, heat resistance, heat resistance,
It is known that rigidity and molding shrinkage rate are improved.

ポリエーテルイミド樹脂においても、上記強化材や充填
材を配合した場合、その配を険に応じて耐熱性、剛性の
向上と成形収縮率の低下が紹められる。成形収縮率は該
強化材や充填材の配合量が多いほど低下し、射出成形等
における型忠実度は良好となるが、成形収縮率が低くな
るに従い、射出成形時の離型性が低士し、成形品の金型
からの取り出しが著しく困難となる。
Even in polyetherimide resin, when the above-mentioned reinforcing materials and fillers are blended, heat resistance and rigidity can be improved and molding shrinkage rate can be reduced depending on the strength of the reinforcement. The molding shrinkage rate decreases as the amount of the reinforcing material or filler increases, and the mold fidelity in injection molding becomes better, but as the molding shrinkage rate decreases, the mold releasability during injection molding becomes poorer. However, it becomes extremely difficult to remove the molded product from the mold.

そのため、成形品突き出し時に過大な応力が負荷され、
成形品中に歪が残留し、ストレスクラックが発生したり
、また突き出し時に変形し、さらには破断を引き起すな
どのトラブルが発生する。
Therefore, excessive stress is applied when ejecting the molded product, and
Distortion remains in the molded product, causing problems such as stress cracks, deformation during ejection, and even breakage.

したがって、通常は、成形収縮率を下げ、屋麿実度が良
好で寸法精度のいい樹脂組成物が大いに必要とされてい
るにもかかわらず、金型からのmu性に問題の起らない
程度の成形収縮率とするため、強化材、充填材の配合量
が制限されているのが実状である。
Therefore, although there is a great need for a resin composition with low molding shrinkage, good moldability, and good dimensional accuracy, it is usually used to the extent that no problem occurs in the mu properties from the mold. The actual situation is that the amount of reinforcing material and filler added is limited in order to achieve a molding shrinkage rate of .

本発明者は上記の状況に鑑み、鋭意研究した結果、ポリ
エーテルイミド樹脂に樹脂状強化材もしくは無機充填材
を配合し、さらに特定量のフッ素樹脂を併用する仁とに
よって、耐熱性、剛性が高く、強度が良好で低い成形収
縮率と良能型性を有する組成物を得ることが出来ること
を見い出し、本発明に達した。
In view of the above situation, the present inventor conducted extensive research and found that heat resistance and rigidity can be improved by blending a resinous reinforcing material or an inorganic filler with polyetherimide resin, and further adding a specific amount of fluororesin. It has been discovered that it is possible to obtain a composition that has high strength, good strength, low mold shrinkage, and good moldability, and has arrived at the present invention.

本発明はポリエーテルイミド20= 80 wt%、m
雄状強化材もしくは無機充填材10〜70wt%、フッ
素樹脂0.5〜20Wtチからなることを特徴とするポ
リエーテルイミド梅脂組成物で・ある。
The present invention uses polyetherimide 20 = 80 wt%, m
This is a polyetherimide plum fat composition characterized by comprising 10 to 70 wt% of a male reinforcing material or inorganic filler and 0.5 to 20 wt% of a fluororesin.

本発明で用いるポリエーテルイミドは一般式(ここに、
孔は6〜30個の炭素原子を荷する2価の芳香族有機基
であり、几はR基、 2〜20個の炭素原子を有するア
ルキレン基、シクロアルキレン基、および02〜3アル
キレン基で連鎖停止されたポリジオルガノシロキサン基
の中から選ばれた2価の有機基である。)で表わされる
重合体である。
The polyetherimide used in the present invention has the general formula (where,
Holes are divalent aromatic organic groups carrying 6 to 30 carbon atoms; It is a divalent organic group selected from chain-terminated polydiorganosiloxane groups. ) is a polymer represented by

ここで、Rはたとえば シtどが挙げられる。Here, R is for example Examples include sites.

特に典型的なポリエーテルイミドは一般式で表わされる
ポリマーであり、こ第1は米国ゼネラルエレクトリツク
ネ−1より11 L T E lklの曲性で一般に市
販されている。その1・y遣方法は性分11?、+57
−9872月公報などに開示されている。
A particularly typical polyetherimide is a polymer represented by the general formula, which is commercially available from General Electric Company 1 in the United States with a curvature of 11LTElkl. Part 1: Is the way you spend your time characteristic 11? ,+57
-Disclosed in the February 987 bulletin, etc.

本等う明組成物のhζ分として使用されるS維状強化利
はガラス繊維、炭素給緋、力香族ポリアミド松維、炭化
ケイ素組維、窒化ケイ素繊維、アルミナ枠紺、チタン酸
カリウノ・繊維、鉱物繊維等であり、一般に樹脂の耐熱
性、強度、剛性等の改良に使用される繊維状強化材が適
用される。
The S fibrous reinforcement used as the hζ component of the main coating composition is glass fiber, carbon-filled scarlet, aromatic group polyamide pine fiber, silicon carbide fiber, silicon nitride fiber, alumina frame navy blue, potassium titanate, etc. Fibrous reinforcing materials, such as fibers and mineral fibers, are generally used to improve the heat resistance, strength, rigidity, etc. of resins.

本発明組成物の成分として使用されろ無機充填材として
は、タルク、・炭酸カルシウム、炭酸マグネシウム、亜
硫酸カルシウム、水酸化アルミニウム、マイカ、二硫化
モリブデン、ウオラストナイト、グラファイト、チタン
白、カラスビーズ、ジルコニア、シリカ等が適用される
Inorganic fillers used as components of the composition of the present invention include talc, calcium carbonate, magnesium carbonate, calcium sulfite, aluminum hydroxide, mica, molybdenum disulfide, wollastonite, graphite, white titanium, glass beads, Zirconia, silica, etc. are applied.

該繊維状強化材もしくは無機充填利は通常無処理でも使
用しうるが、ポリエーテルイミドと親和性をもたせるた
めに、アミノシラン、エポキシシラン等のシランカップ
リンク剤、クロミッククロライド、ぞの他目的に応じた
表面処理剤を使用することができる。
The fibrous reinforcing material or inorganic filler can usually be used without treatment, but in order to have an affinity with polyetherimide, it may be added with a silane coupling agent such as aminosilane or epoxysilane, chromic chloride, or other materials depending on the purpose. surface treatment agents can be used.

本発明組成物の成分として使用されるフッ素樹脂とは、
分子中にフッ紫原子CF)を含有する合成高分子をいう
が、その例としては四フッ化エチレン樹脂、四フッ化エ
チレンーパーフロロアルキルビニルエーテル共irt合
枦(脂、四−フッ化エチレン1六フッ化プロピレン共重
合樹脂、四フッ化エチレンーエチレン共重合樹脂、三フ
ッ化塩化エチレン樹脂、フッ化ビニリデン樹脂などが挙
げられる。
The fluororesin used as a component of the composition of the present invention is:
Synthetic polymers containing a fluorine atom (CF) in the molecule, examples of which include tetrafluoroethylene resin, tetrafluoroethylene perfluoroalkyl vinyl ether copolymer (fat, tetrafluoroethylene 1 Examples include hexafluoropropylene copolymer resin, tetrafluoroethylene-ethylene copolymer resin, trifluorochloroethylene resin, and vinylidene fluoride resin.

前記フッ素樹脂の(ノコ、四フッ化エチレン樹脂(ポリ
テトラフルオロエチレン)は融点か約880℃であるが
、溶融粘度が高く融点以上でも流動しない。したがって
、該組成物中での分散状態が成形加工条件によっても変
化しにくく、組成物の竹性、機械的強度や射出成形時の
離型性が変化しに(いため好ましい。
The melting point of the fluororesin (polytetrafluoroethylene) is about 880°C, but it has a high melt viscosity and does not flow even above the melting point. Therefore, the dispersion state in the composition is It is preferable because it does not easily change depending on processing conditions, and the bamboo properties, mechanical strength, and mold releasability during injection molding of the composition do not change.

配合邦、とじては、ポリエーテルイミド20〜8Qsv
t%、繊維状強化相もしくは無機充填材lO〜7 Q 
wtl、フッ素樹脂0.5〜2Q wtl(繊維状強化
相もしくは無機充填材とフッ素樹脂の合計量としては、
全樹脂組成物の20〜80wLチ)配合したものが有効
である。
The compound is polyetherimide 20~8Qsv
t%, fibrous reinforcing phase or inorganic filler lO~7Q
wtl, fluororesin 0.5-2Q wtl (total amount of fibrous reinforcing phase or inorganic filler and fluororesin:
A mixture of 20 to 80 wL of the total resin composition is effective.

すなわち、該強化相もしくは該充填材とフッ素樹脂の合
計量が樹脂組成物中の3 Q wtチを越え、ポリエー
テルイミドの敵が2 Q wtチ未満の時は、混合が不
十分であり、均一・なpA成物が得られず、樹脂組成物
の流動性が朱なかれ、成形が困難になる。才だ、該強化
材もしくは該充填材とフッ素樹脂の合計pが2owtw
、H満の時は、十分な成形収縮率低下効果力律t−られ
シ(いまた、該強化材もしくは該充填利とフッ素樹脂の
合計量が20〜8Q wtlであっても、該強化材もし
くは該充填材の量がlQwtチ未満であれば成形収縮率
低下効果が不十分であり、逆にフン素樹脂の量がQ、5
wt%未満であれば、射出成形時等の離型性が十分でな
い。
That is, when the total amount of the reinforcing phase or the filler and the fluororesin in the resin composition exceeds 3 Q wt and the amount of polyetherimide is less than 2 Q wt, the mixing is insufficient; A uniform pA composition cannot be obtained, the fluidity of the resin composition becomes dull, and molding becomes difficult. The total p of the reinforcing material or the filler and the fluororesin is 2owtw.
, H is satisfied, the molding shrinkage rate reducing effect is sufficient. Alternatively, if the amount of the filler is less than 1Qwt, the effect of reducing the molding shrinkage rate is insufficient;
If it is less than wt%, mold releasability during injection molding etc. will not be sufficient.

また、該強化材もl、 (は該充填材が7(1wt9B
を越えると、混合か不十分となり、コンパウンド化の工
程が困難になり、均一な組成物が得られない。フッ素樹
脂の量が2gwt%を越えると得られた成形品の強度低
下が顕著になり、好ましくない。
Also, the reinforcing material is 7 (1wt9B
If it exceeds this amount, the mixing will be insufficient, the compounding process will be difficult, and a uniform composition will not be obtained. If the amount of fluororesin exceeds 2 gwt%, the strength of the obtained molded product will decrease significantly, which is not preferable.

本発明の組成物の配合手段は特に限定されない。ポリエ
ーテルイミド、該線維状強化材もしくは該無機充填材、
フッ素樹脂を各々別々に溶融混合機に供給することが可
能であり、またあらかじめこれら原料類を乳鉢、ヘンシ
ェルミキサー、ボールミル、リボンブしンターなどを利
用して予備混合してから溶融混合機に供給することもで
きる。
The means of blending the composition of the present invention is not particularly limited. polyetherimide, the fibrous reinforcing material or the inorganic filler,
It is possible to feed each fluororesin separately to the melt mixer, and these raw materials are premixed in advance using a mortar, Henschel mixer, ball mill, ribbon printer, etc. and then fed to the melt mixer. You can also do that.

なお、本発明組成物に対して、本発明の目的をそこなわ
ない範囲で、酸化防止剤および熱安定剤、紫外線吸収剤
、滑剤、離型剤、染料、顔料などの着色剤、難燃剤、難
燃助剤、帯電防止剤などの通常の添加剤をl塊以上添加
することができる。
The composition of the present invention may contain antioxidants, heat stabilizers, ultraviolet absorbers, lubricants, mold release agents, colorants such as dyes and pigments, flame retardants, Ordinary additives such as flame retardant aids, antistatic agents, etc. can be added in quantities of 1 or more.

また、他の熱可塑性樹脂(たとえば、ポリエチレンボリ
ブロビレン、ポリアミド、ポリカーボネート、ポリエス
テルカーボネート、ポリエチレンテレフタl/ −l−
、ポリブチレンテレフタレート、ポリサルホン、ポリエ
ーテルサルホン、変性ポリフェニレンオキナイド、アク
リロニトリル−スチレン−ブタジェン樹脂(A13S樹
1]1)、ポリフェニレンサルファイド樹脂など)、熱
硬化性樹脂(例えばフェノール樹脂、エポキシ樹脂など
)を目的に応じて配合することかできる。
In addition, other thermoplastic resins (e.g. polyethylene polypropylene, polyamide, polycarbonate, polyester carbonate, polyethylene terephthalate l/-l-
, polybutylene terephthalate, polysulfone, polyethersulfone, modified polyphenylene oquinide, acrylonitrile-styrene-butadiene resin (A13S tree 1] 1), polyphenylene sulfide resin, etc.), thermosetting resins (e.g., phenolic resin, epoxy resin, etc.) can be mixed according to the purpose.

以下、\施例により本発明を具体的に説明するか、これ
らは好適な態様の例示であつ°C,シロ胞例の組成物に
限定されるものではな0゜実厳例1〜5 構造式 で表わされるポリエーテルイミド(GE社7〜IJLT
EM” 1000 )と、つオラストナイト(長潮産業
製NYAD−(J1CaSi03 剣状)と四フッ化エ
チレン樹BF1(J u l 製フル1゛ンL169)
を第1表に示jノだ組成で混合し、二軸押出機(池貝鉄
上Jl!! PCM−80)+こより840℃の温度で
#J融混練した後、ストランドを水冷、切断してベレッ
トを得tこ。
Hereinafter, the present invention will be specifically explained with reference to examples, which are merely illustrative of preferred embodiments and are not limited to the compositions shown in the examples. Polyetherimide (GE company 7~IJLT) represented by the formula
EM” 1000), auralastonite (NYAD-(J1CaSi03 sword-shaped) manufactured by Nagashio Sangyo), and tetrafluoroethylene tree BF1 (Full 1゛L169 manufactured by Jul)
were mixed with the composition shown in Table 1, melt-kneaded using a twin-screw extruder (Ikegai Tetsujo Jl!! PCM-80) at a temperature of 840°C, and the strands were water-cooled and cut. Get a beret.

得られたペレットを射出成形(住友−ネスタール47/
28射出成形機、シリンダ一温度860℃、金型温度1
80℃)により、曲げ試験片を成形した。型開き後、エ
ジェクタービンにより成形品を突出す際の抵抗をストレ
インケージタイプの圧力センサーを開いて測定した。
The obtained pellets were injection molded (Sumitomo-Nestal 47/
28 injection molding machine, cylinder temperature 860℃, mold temperature 1
80° C.) to form a bending test piece. After opening the mold, the resistance when ejecting the molded product using an ejector turbine was measured by opening a strain cage type pressure sensor.

また、得られた曲げ試験片を用いて、曲げ強度、曲げ弾
性率、熱変形温度、成形収縮率を測定した。
Further, using the obtained bending test piece, bending strength, bending elastic modulus, heat deformation temperature, and molding shrinkage rate were measured.

曲げ強度はA8TM ])−790、熱変形温度はAC
T轟t D−648(18,6Kf/c= )に準拠し
て測定した。結果を第1表に示す。
Bending strength is A8TM ])-790, heat distortion temperature is AC
Measured in accordance with T Todoro t D-648 (18,6 Kf/c = ). The results are shown in Table 1.

比較例1〜5 実施例1〜5に用いたポリエーテルイミドとウオラスト
ナイト、四フッ化エチレン樹脂を第1表に示した割合で
猟合し、実施例1〜5と同様の加工を行い、物性を測定
した。
Comparative Examples 1 to 5 The polyetherimide used in Examples 1 to 5, wollastonite, and tetrafluoroethylene resin were combined in the proportions shown in Table 1, and the same processing as in Examples 1 to 5 was performed. , the physical properties were measured.

結果を@1表に示す。The results are shown in Table @1.

本発明組成物は、ポリエーテルイミドーの鮒熱性と剛性
(弾性率)が改良され、高い強度をもち、かつ低い成形
11v、縮率と良熱型性を有することかオノかる(実施
例1〜5)。
The composition of the present invention has improved thermal properties and rigidity (modulus of elasticity) of polyetherimide, has high strength, and has low moldability 11V, shrinkage rate, and good heat moldability (Example 1). ~5).

また、本発明組成物以外の組成においては成形収縮率の
改良が十分でなかったり(比較例2)、強度の低下が大
きか・りたり(比較例4)、離型性が不十分である(比
較例5)など、目的とする良好な特性を有していない。
In addition, in compositions other than the composition of the present invention, the improvement in molding shrinkage rate was not sufficient (Comparative Example 2), the strength decreased significantly (Comparative Example 4), and the mold releasability was insufficient. (Comparative Example 5), etc., do not have the desired good characteristics.

Claims (1)

【特許請求の範囲】[Claims] ポリエーテルイミド20〜80wt%%m錐状強化月も
しくは無機充填@lO〜70%−tチおよびフッ素樹脂
0.5〜2 Q wtチからなることを特徴とするポリ
エーテルイミド樹脂組成物。
A polyetherimide resin composition comprising 20 to 80 wt% of polyetherimide or inorganic filled @lO to 70% of polyetherimide and 0.5 to 2 Q of fluororesin.
JP14779583A 1983-08-11 1983-08-11 Polyether-imide resin composition Granted JPS6038464A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14779583A JPS6038464A (en) 1983-08-11 1983-08-11 Polyether-imide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14779583A JPS6038464A (en) 1983-08-11 1983-08-11 Polyether-imide resin composition

Publications (2)

Publication Number Publication Date
JPS6038464A true JPS6038464A (en) 1985-02-28
JPH0452301B2 JPH0452301B2 (en) 1992-08-21

Family

ID=15438376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14779583A Granted JPS6038464A (en) 1983-08-11 1983-08-11 Polyether-imide resin composition

Country Status (1)

Country Link
JP (1) JPS6038464A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62299580A (en) * 1986-06-17 1987-12-26 東邦レーヨン株式会社 Sized carbon fiber and its production and composition containing sized carbon fiber
EP0301543A2 (en) * 1987-07-29 1989-02-01 Sumitomo Electric Industries Limited Molded article made from a resinous composition
JPH03185069A (en) * 1989-10-20 1991-08-13 General Electric Co <Ge> High-density thermoplastic molding composition
JPH05239346A (en) * 1991-08-02 1993-09-17 General Electric Co <Ge> Halogen-free flame retardant for siloxane polyetherimide copolymer and use of titanium dioxide as heat stabilizer
EP0864893A2 (en) * 1997-03-13 1998-09-16 Nippon Telegraph and Telephone Corporation Packaging platform, optical module using the platform, and methods for producing the platform and the module
WO2002003397A2 (en) * 2000-06-30 2002-01-10 3M Innovative Properties Company Insulation material for use in high-frequency electronic parts
JP2008508380A (en) * 2004-07-30 2008-03-21 ソルヴェイ(ソシエテ アノニム) Aromatic polyimide composition and articles produced therefrom

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182852A (en) * 1982-12-28 1984-10-17 ゼネラル・エレクトリツク・カンパニイ Polyether imide composition for bearing
JPS59202258A (en) * 1983-04-30 1984-11-16 Mitsui Toatsu Chem Inc Polyether-imide resin composition
JPS60501006A (en) * 1983-04-07 1985-07-04 ゼネラル エレクトリツク カンパニイ Polyetherimide-fluorinated polyolefin blend

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182852A (en) * 1982-12-28 1984-10-17 ゼネラル・エレクトリツク・カンパニイ Polyether imide composition for bearing
JPS60501006A (en) * 1983-04-07 1985-07-04 ゼネラル エレクトリツク カンパニイ Polyetherimide-fluorinated polyolefin blend
JPS59202258A (en) * 1983-04-30 1984-11-16 Mitsui Toatsu Chem Inc Polyether-imide resin composition

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62299580A (en) * 1986-06-17 1987-12-26 東邦レーヨン株式会社 Sized carbon fiber and its production and composition containing sized carbon fiber
JPH022990B2 (en) * 1986-06-17 1990-01-22 Toho Reeyon Kk
EP0301543A2 (en) * 1987-07-29 1989-02-01 Sumitomo Electric Industries Limited Molded article made from a resinous composition
JPH03185069A (en) * 1989-10-20 1991-08-13 General Electric Co <Ge> High-density thermoplastic molding composition
JPH05239346A (en) * 1991-08-02 1993-09-17 General Electric Co <Ge> Halogen-free flame retardant for siloxane polyetherimide copolymer and use of titanium dioxide as heat stabilizer
EP0864893A2 (en) * 1997-03-13 1998-09-16 Nippon Telegraph and Telephone Corporation Packaging platform, optical module using the platform, and methods for producing the platform and the module
EP0864893A3 (en) * 1997-03-13 1999-09-22 Nippon Telegraph and Telephone Corporation Packaging platform, optical module using the platform, and methods for producing the platform and the module
US6222967B1 (en) 1997-03-13 2001-04-24 Nippon Telegraph And Telephone Corporation Packaging platform, optical module using the platform, and methods for producing the platform and the module
WO2002003397A2 (en) * 2000-06-30 2002-01-10 3M Innovative Properties Company Insulation material for use in high-frequency electronic parts
WO2002003397A3 (en) * 2000-06-30 2002-06-20 3M Innovative Properties Co Insulation material for use in high-frequency electronic parts
JP2008508380A (en) * 2004-07-30 2008-03-21 ソルヴェイ(ソシエテ アノニム) Aromatic polyimide composition and articles produced therefrom

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