JPS6037249Y2 - polishing equipment - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a polishing device with an improved dust suction structure.

Work that requires polishing has heretofore been performed in various fields, and will be explained below using automobile painting work as an example.

In the automobile painting process, the car body is further transported to a drying room after undergoing the same process, and the paint film is dried there.

However, when the car body is taken out of the drying room, there are cases where the painted surface is partially uneven, and the uneven surface is polished with a polishing device to make a smooth surface. However, in order to prevent paint dust generated during the polishing work from scattering within the factory, a polishing device having the structure shown in Figure 1.2.3 was used.

That is, a motor (not shown) is built into the main body 2 from which the handle portion 1 is protruded, and a rotation pad 3 is attached to the rotation axis of the motor.
A ring-shaped cover 4 is attached to the lower part of the main body 2 with a slight gap from the upper surface of the rotating pad 3, and a hose 5 connected to a vacuum pump (not shown) is connected to the handle by known means such as bolts (not shown). The hose 5 is inserted into the section 1 so that the open end of the hose 5 communicates with the inner space inside the main body 2.

As clearly shown in FIG. 2, the rotating pad 3 includes an upper disc part 6 made of synthetic resin and having a bolt 6' upright in the center for connecting to the rotating shaft of the motor; The pad part 7 joined to the bottom surface of the pad part 6 is integrally formed with a circular vinyl part 8 joined to the bottom surface of the pad part 7, and these three parts 6. 7. 8 contains the same 3rd part 6.
Six dust suction holes 9 passing through 7.8 are drilled.

A sandpaper 10 as shown in FIG. 3 is bonded to the bottom surface of the vinyl portion 8 with an adhesive, and this sandpaper 10 has six holes 11 perforated at positions approximately corresponding to the dust suction holes 9. The hole 11 is aligned with the dust suction hole 9 and the above adhesive is applied.

When the sandpaper 10 is adhered to the vinyl part 8 and the polishing work is performed, the paint dust is sucked into the inner space of the main body 2 through the hole part 11 and the dust suction hole 9 by the vacuum pump, and then passes through the hose 5 to a storage chamber (not shown). Dust is sucked into the dust section.

However, in the above conventional device, the sandpaper 10
However, due to time constraints during assembly line work, as shown in FIG. It is quite difficult to align the holes with the adhesive, and the operator has to make many fine adjustments to align the holes when bonding, which is time-consuming and increases processing costs. there were.

The present invention was devised with the aim of solving the above-mentioned problems of the conventional device, and includes a plurality of holes at positions approximately corresponding to the dust-sucking holes on the bottom surface of the rotating pad, which has a plurality of dust-sucking holes penetrating between the upper and lower surfaces. A piece of sandpaper with holes perforated therein is glued, and the dust generated during the polishing work is sucked from the hole through the dust suction hole by suction negative pressure applied from the upper surface side. A concave groove is formed to connect the holes to each other, and the dust is sucked into the dust suction hole through the concave groove even when the dust suction hole and the hole portion do not coincide with each other. The gist of this paper is the characteristic polishing device.

According to the present invention, concave grooves are formed on the bottom surface of the rotating pad to connect the dust suction holes to each other, so even if the holes in the sandpaper do not completely match the dust suction holes in the rotating pad, , or even if the sandpaper is glued in a state where they are hardly aligned, the hole and the dust suction hole are always in communication through the concave groove, so not only is the dust well sucked from the hole to the dust suction hole, but the sandpaper is It has the advantage of being easy to install.

An embodiment of the present invention will be described below with reference to FIGS. 5 and 6. The difference in structure from the conventional device described above lies in the structure of the lower surface of the rotary pad, and the other structures are the same.

That is, FIG. 5 is a plan view of the rotary pad 12 as seen from the bottom, in which six dust suction holes 13 are arranged on the same circumference in the vinyl part 14, the pad part 15, and the disc part 16, as in the conventional device described above. It is formed by penetrating the

Reference numeral 17 denotes a groove having a concave cross section and formed by cutting off the vinyl portion 14 in a ring shape so as to connect the dust suction holes 13.

In the embodiment having the above configuration, even if the hole of the sandpaper is misaligned with the dust suction hole 13 when sandpaper (not shown) is adhered to the lower surface of the vinyl part 14, the hole on the sandpaper side is on the concave groove 17, so the sandpaper Since the hole communicates with the dust suction hole 13 via the concave groove 17 between the sandpaper and the vinyl portion 14, it has the effect of sucking dust into the hose side by suction negative pressure within the main body.

In the above embodiment, the vinyl portion 14 is cut off to form concave grooves, but as shown in FIG. 7, an appropriate number of concave grooves 18 may be formed on the surface of the vinyl portion. In the above example, six dust suction holes and six sandpaper holes are formed, but it goes without saying that the number of holes may be other than this, and the arrangement is not circular.
They may be arranged non-uniformly.

Furthermore, although the concave groove may be formed in a ring shape as described above, it may also be formed in a meandering manner, and the dust suction holes may be arbitrarily connected by the concave groove.

[Brief explanation of the drawing]

Fig. 1 is an external perspective view of the polishing device, Fig. 2 is an enlarged external perspective view of the rotary pad, Fig. 3 is an external perspective view of the sandpaper,
FIG. 4 is an explanatory view of the operation of adhering sandpaper to the rotating pad, FIG. 5 is a plan view of the lower surface of the rotating pad in an embodiment of the present invention, and FIG. 6 is a view taken along the arrow VI-- in FIG.
FIG. 7 is a partial sectional view taken along the VI line, and is a partial sectional view of another modification similar to FIG. 6. In the figure, numeral 12: rotating pad, 13: dust suction hole, 14: vinyl portion, 17.18: concave groove.

Claims (1)

[Scope of utility model registration request] A piece of sandpaper with a plurality of holes perforated at positions approximately corresponding to the dust suction holes is glued to the bottom surface of the rotating pad, which has a plurality of dust suction holes penetrating between the top and bottom surfaces, and the dust generated during the polishing operation is removed from the top surface side. In the device in which dust is sucked from the hole through the dust suction hole by applied suction negative pressure, a concave groove is formed on the lower surface of the rotating pad so as to connect the dust suction holes to each other, and the dust suction hole and the hole are connected to each other. A polishing device characterized in that the dust is sucked into the dust suction hole through the concave groove even when they do not coincide with each other.