JPS6033302B2 - semiconductor assembly equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor assembly apparatus, and more particularly to an assembly apparatus for sequentially joining semiconductor pellets to a large number of stems via solder or the like.

Conventionally, in this type of joining process, a jig is used to place the solder piece and pellet on the stem, and after positioning,
The bullets are joined by continuously moving them in a furnace with a hydrogen atmosphere, or by heating a heater block in a box with a nitrogen atmosphere, and placing the stem on top of the heater block.

However, in the former method, the joining position of the pellets is determined by jigs and tools, which increases the variation in the accuracy of the joining position of the pellets due to vibrations when the pellets are moved in the furnace, and also requires many man-hours and becomes complicated. , leading to a decrease in work efficiency.

Also, the escape of electricity and hydrogen is significant. Since large amounts of these are consumed, running costs rise.
On the other hand, in the latter method, the pellets are joined in a box in a nitrogen atmosphere, resulting in poor workability and poor productivity, resulting in a significant drop in productivity. The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a semiconductor assembly device that can accurately and quickly join a semiconductor pellet onto a stem without consuming a large amount of electricity or inert gas. It is.

Embodiments of the present invention will be described below with reference to the drawings.

The assembly device of the present invention includes an elongated upper heater block 2 placed on two guide rails 1, 1 spaced apart from each other and arranged in parallel, and a long upper heater block 2 placed between each of the guide rails 1. Multiple sets of long lower heater blocks 3...
3, and a heater block drive mechanism 4, which is a moving mechanism that moves these lower heater blocks 3 in the vertical and horizontal directions.

The heater block 2 has a structure shown in FIGS. 1 to 4.

That is, numeral 5 in the figure is a heater block main body which is an elongated body with a tunnel-shaped cross section, and this heater block main body 5 is installed on the guide rails 1, 1. Moreover, as shown in FIGS. 2 and 3, on this main body 5, an elongated frame-like body 7 with an inert gas blowing pipe 6 and a notched lower end is airtightly fixed, and the upper surface of the above-mentioned main body 5 and the frame-like body 7 are A gas band chamber 8 is formed by the body 7. Further, the main body 5 has a plurality of passages 10 having one end connected to the gas band retention chamber 8 and opening into the Ikebata tunnel 9, for introducing the inert gas supplied from the blowing pipe 6 into the tunnel 9. ...10 are drilled. Moreover, inside the main body 5, a plurality of heaters 11 are arranged perpendicularly to the longitudinal direction of the main body 5.
11 is buried, and lead wires 12...12 are connected to each heater 11...11. Furthermore, a portion of the heater block main body 5 in the longitudinal direction is recessed as shown in FIGS. 1 and 4, and gateways 13...13 are provided in the recess. These Sekiguchi section 1
A rectangular plate-like body 15 having an insertion hole 14 for a semiconductor bellet is competitively attached to 3...13, and the above-mentioned upper heater block 3... is attached to the four corners of the plate-like body 15.・・３
4 positioning pins 1 for pressing and fixing the stem of
6...16 are inserted. Further, each of the lower heater blocks 3 . . . 3 has a structure shown in FIGS. 1 to 6.

That is, in the figure, 17 is a lower heater block main body which is a long body having a plurality of approximately diamond-shaped recesses 18, which are stem iron fittings, formed on the upper surface, and this heater block main body 17 is The heat block drive unit 4 inserted and arranged between the guide rails 1 and 1 and attached to the lower surface moves the upper heater block 2 up (arrow A) as shown by arrows A to E in FIG. 2, it moves forward (arrow B), further rises (arrow C), then descends (arrow D) and retreats (arrow E) to return to its original position. Further, a notch 19 is provided on the lower surface of the lower heater block main body 17, and a sealing plate 21 with an inert gas blowing pipe 20 is airtightly fixed to the lower surface. A gas retention chamber 22 is formed by the stop plate 21 . Moreover, one end of the main body 17 is opened to each of the building parts 18...18.
Then, the pond end is closed to the retention chamber 22, and the inert gas supplied from the blowing pipe 20 is passed through each depression 18...18.
A belt-shaped passage 23 for introduction into the main body 17 is bored in the longitudinal direction of the main body 17. Furthermore, the main body 17 has the main body 1
Two heaters 24, 24 are buried along the longitudinal direction of the heater 7, and lead wires 25...25 are connected to the ends of each heater 24, 24. Furthermore, as shown in FIG. 1, the heater block drive mechanism 4 has a unitized structure in which each of the two sets of lower heater blocks 3, 3 is actuated. The explanation of is omitted. That is, in the figure, 26...26 are two fixed rods suspended from the bottom surfaces of the main bodies 17, 17 of the two sets of lower heater blocks 3, 3 in the longitudinal direction and in the middle direction, respectively. Each group of fixed rods 26...26 has a horizontal axis 27.
...27 is attached to the shaft. These horizontal axes 2
7 and 27 are formed by penetrating annular receiving portions 29...29 supported by four support rods 28...28,
The balls 27, 27 are movable in the horizontal direction. These receiving parts 29...29 support rods 28...
The lower part of 28 is inserted into the guide tube 30...30,
A spring (not shown) is connected to the lower end, and the spring urges the bags 27, 27 passing through the receiving portions 29 downward. Also, these 4
．． The book support rods 28...28 are inserted into and fixed to one horizontal connecting plate 31, and the connecting plate 31 is provided with a cam floor 32. The cam floor 32 is fixed to a drive shaft 33 and comes into contact with a rotating cam 34, and the displacement of the cam 34 and the cam floor 32 at the contact point causes the connection plate 31 to move between the support rods 28...28.
It moves up and down in accordance with or against the biasing force of the spring at the lower end. The drive shaft 33 is rotated via a pulley 35 on which a belt (not shown) is stretched.
is a push plate through which the two shafts 27, 27 are inserted and fixed at the upper end and the connecting plate 31 passes through the lower part, and this push plate 36 is biased in the direction of arrow F by a spring (not shown). Further, this push plate 36 is in contact with the side surface of the rotary plate 37 which is inclined and attached to the drive shaft 33,
The rotation of the rotary plate 37 causes the push plate 36 to reciprocate horizontally in accordance with or against the biasing force of the spring, and in conjunction with this, the shafts 27, 27 similarly reciprocate. According to such a configuration, N2 gas, which is an inert gas, is supplied from the blowing pipes 6, 20 of the upper heater block 2 and each of the lower heater blocks 3, respectively. When the heaters 11...11, 24, 24 of blocks 2, 3...3 are energized, the N2 gas flows into the gas line storage chambers 8, 22 of each block 2, 3...3, and then passes through each passage 10... ... 10, 23 into the lower surface of the main body 5 of the upper heater block 2, the upper surface of the main body 17 of the lower heater block 3, and the band-shaped cavity 38 surrounded by the two guide rails 1. N2 inside the cavity 38
filled with gas, and each heater 1...11,24
, 24, a plurality of stems 39 .
...39 is heated and the solder piece thereon is melted without being oxidized.

In this way, when the drive shaft 33 of the heater block drive mechanism 4 is rotated while the inside of the cavity 38 is made into an N2 gas atmosphere and the stems 39...39 on the guide rails 1, 1 are heated, the cam 34 is rotated. , the connecting plate 31 is pressed upward via the cam floor 32 that comes into contact with this, and the four support rods 28 inserted and fixed to this plate 31...
28 moves upward against the urging force of a spring (not shown) at its lower end, and these support rods 28...28
2 which penetrated the annular receiving part 29...29 at the upper end of the
The book shafts 27, 27 move upward in synchronization, and along with this, the fixed rod 26 to which the shafts 27, 27 are hooked...
・Each lower heater block 3 through 26...
3's main bodies 17...17 rise in the direction of arrow A in FIG. In this way, the lower heater block main body 17...1
7 rises in the direction of arrow A, a plurality of stems 39 placed on the guide rails 1, 1 shown in FIG.
9 is the lower block main body 17 as shown in FIGS. 3 and 6.
......17 Numerous building sections on the top surface 18...1
8 and separates from the guide rails 1 and 1. At the same time, due to the rotation of the inclined rotary plate 37 of the drive shaft 33,
The push plate 36 that is in contact with the rotating plate 37 moves in the horizontal direction of arrow F in accordance with the biasing force of a spring (not shown), and the two shafts 27, 27 into which the push plate 36 is inserted and fixed are synchronized. The shafts 27, 27 are connected to the main body 17 of each lower heater block 3 through the fixed shaft 26...26 to which the shafts 27, 27 are attached. moves forward in the direction of arrow B in FIG. As the lower heater block main bodies 17...17 move forward in the direction of arrow B, the stems 39, which are iron-filled in the recesses 18...18 of the main bodies 17...17, move forward in the direction of arrow B. ...39 is the main body 17...
、． ．． 17 for a predetermined distance. Furthermore, cam 3
4, the lower heater block bodies 17, 17 are again raised in the direction of arrow C in FIG. When the lower heater block main body 17...17 rises again in the direction of arrow C, the semiconductor pellet insertion hole 14 of the upper heater block 2 is opened as shown in FIG. Recessed portion 18 of main body 17...17'...
The upper surface of the stem 39 ... 39 inserted with iron into the four positioning pins 16 inserted around the insertion hole 14
...Abuts against the lower end of 16, stem 39...
39 is positioned and fixed. In this state, by inserting a semiconductor pellet (not shown) onto the stem 39 through the insertion hole 14, the solder piece on the stem 39 is melted in the heated N2 gas atmosphere within the cavity 38. Therefore, the semiconductor pellet is connected to stem 3 through solder that is prevented from oxidizing.
9, can be bonded quickly with high precision and good reproducibility, and in a good conductive state. After that, the heater block drive mechanism 4
As the cam 34 rotates, the connecting plate 31 moves downward,
Four support rods 38 inserted and fixed to this plate 31...
. . 38 moves downward in accordance with the biasing force of a spring (not shown) at its lower end, and the annular receiving portions 29 . . . 29,
The main body 17 of each lower block 3...3 is connected via the two shafts 27, 27 and the fixed shaft 26...26.
...17 descends in the direction of arrow E in FIG.

In this way, the lower heater block main body 17...1
7 descends in the direction of arrow E, the main body 17...1
The bottom surface of the raised part 18 of 7 is lower than the top surface of the guide rail 1, and the stem 39 39, which is fitted with iron into the recessed part 18, is shown in Fig. 3. After passing through the state shown in FIG. 2, it is left on the guide rail 1 and placed on it. At the same time, due to the rotation of the inclined rotary plate 37 of the drive shaft 33, the push plate 36 in contact with the rotary plate 37 moves in the horizontal direction of arrow G against the biasing force of a spring (not shown). , two shafts 27, 27
The main bodies 17...17 of each lower heater block 3...3 are moved back in the direction of arrow E in FIG. ...1
Only stem 7 returns to its original position, and preparation for the next stem feed is completed. Therefore, according to the assembly apparatus of the present invention, while heating the stem, the lower heater block can be repeatedly raised, advanced, raised, lowered, and retreated by the moving mechanism, thereby transporting the stem by a predetermined distance intermittently, and simultaneously positioning and fixing the stem. The space in which the stem is inserted, that is, the cavity where the upper heater block, lower heater block, and guide rail are loosened, can be maintained in a good N2 atmosphere at all times, which prevents oxidation of the solder and stem and improves the heating effect on the stem. In addition to improving bonding position accuracy, it is possible to perform stable and reliable bonding.

In addition, the inert gas from the upper heater block and lower heater block is introduced into the cavity surrounded by each block and guide rail, and there is little escape to the outside world, so a large amount of inert gas is consumed and this gas is heated. It is possible to significantly reduce the power consumption required for this purpose, and as a result, the running cost can be reduced.

Note that the semiconductor assembly apparatus according to the present invention is not limited to the form in which the stem assembly portion of the lower heater block is used as a stand as in the above embodiment; for example, pins may be installed horizontally on the upper surface of the block to ensure that the stems are horizontally conveyed when the stems are conveyed. It may also be possible to prevent it from shifting in the direction.

This lower heater block is not limited to a plurality of divided parts, but may be an integral one. The lower heater block moving mechanism of the assembly apparatus according to the present invention is not limited to the structure as in the above embodiment, but may also be constructed with a moving mechanism equipped with a cylinder or the like.

The assembly apparatus according to the present invention is not limited to being used in the step of joining a semiconductor pellet to a stem as in the above embodiment, but can also be applied to various heating steps in the semiconductor manufacturing process.

As described in detail above, according to the present invention, the stem can be conveyed, positioned and fixed intermittently by a predetermined distance, and the stem can always be transported using a good heated inert gas without consuming a large amount of electricity or inert gas. Semiconductor assembly that can be maintained in an atmospheric condition, thereby preventing oxidation of the solder and stem, improving the heating effect on the stem, improving bonding accuracy, achieving stable and highly reliable bonding, and reducing running costs. equipment can be provided.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway front view of a semiconductor assembly apparatus showing an embodiment of the present invention, FIG. 2 is a sectional view taken along the line 0-0 in FIG. 1, and FIG. 3 is a lower heater shown in FIG. 2. 4 is a sectional view taken along line W-W in FIG. 1, FIG. 5 is a perspective view showing the lower heater block in FIG. 1, and FIG. FIG. 6 is a top view of the lower heater block of FIG. 5; 1... Guide rail, 2... Upper heater block, 3... Lower heater block, 4...
・Heat block drive mechanism, 5... Upper heater block body, 9... Tunnel part, 10.
... Passageway, 12 ... Heater, 14.
... Stem insertion hole, 16 ... Positioning pin, 17 ... Lower heater block body, 18 ...
・Recess, 23... Passage, 24... Heater, 27... Shaft, 29... Receiving part, 31... Connection plate, 3
3... Drive shaft, 34... Cam, 37.
... Rotating plate, 38 ... Cavity part, 39 ...
...Stem. Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6

Claims (1)

[Claims] 1. Two guide rails arranged parallel to each other and separated from each other, and an upper heater that is a long body with a tunnel-shaped cross section, has an opening into which a semiconductor pellet is inserted in the longitudinal direction, and has a built-in heating heater. a block, a passage provided in the heater block for blowing inert gas into the tunnel, and a lower heater block which is an elongated body and has a plurality of stem insertion parts on its upper surface and has a built-in heater;
The lower heater block is provided with a passage for blowing inert gas into the fitting part, and a moving mechanism for moving the lower heater block in vertical and horizontal directions, and the upper heater block is mounted on the two guide rails. 1. A semiconductor assembly apparatus, characterized in that the lower heater block is placed between the rails, and the lower heater block is raised, advanced, lowered and retreated by the moving mechanism.