JPS603190A - Method of connecting printed board - Google Patents
Method of connecting printed boardInfo
- Publication number
- JPS603190A JPS603190A JP11120183A JP11120183A JPS603190A JP S603190 A JPS603190 A JP S603190A JP 11120183 A JP11120183 A JP 11120183A JP 11120183 A JP11120183 A JP 11120183A JP S603190 A JPS603190 A JP S603190A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- wiring
- circuit board
- board
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はプリント基板の配線間に切欠部を設けることに
より接続の信頼性を向上させたプリント基板の接続方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for connecting printed circuit boards in which connection reliability is improved by providing cutouts between wirings on the printed circuit board.
従来例の構成とその問題点
近年、機器の小型化のため可撓性プリント基板が多く用
いられるようになってきた。従来、可撓性プリント基板
の配線とプリント基板の配線との熱圧着による接続方法
は、第１１ン１シで示ず様に、ｉコＪ撓性プリント基板
１の配線２およびプリント基板３の配線４の互いに接続
すべき部分に半Ｌ１１５を塗抹し、可撓性プリント基板
１の半田５の塗抹された配線部分にプリント基板２の半
田らの塗抹された配線部分を重ね合わせ、これを第２図
に示すように半田が溶解するに充分なだけの’ＩＡ□１
１度に熱した金属片６で可撓性プリント基板２の上から
おさえつけ、両基板の配線部分の半Ｈ」５が溶ｒｑ７１
！ Ｌ、配線か接続された時点で金属片を冷却すること
により、可撓性プリント基板とプリント基板の配線を接
続していた。Conventional configurations and their problems In recent years, flexible printed circuit boards have come into widespread use in order to downsize devices. Conventionally, a method of connecting wiring on a flexible printed circuit board and wiring on a printed circuit board by thermocompression bonding has been used to connect the wiring 2 of the flexible printed circuit board 1 and the wiring of the printed circuit board 3, as shown in the Half L115 is smeared on the parts of the wiring 4 that are to be connected to each other, and the smeared wiring part of the printed circuit board 2 is overlapped with the smeared wiring part of the solder 5 of the flexible printed circuit board 1. As shown in Figure 2, apply enough 'IA□1 to melt the solder.
Place a heated metal piece 6 on top of the flexible printed circuit board 2, and melt the wiring part of both boards with the rq71.
! L. The flexible printed circuit board and the printed circuit board wiring were connected by cooling the metal piece once the wiring was connected.
ところが、この従来の接続方法では、第３図のように、
可撓性プリント基板１の配ａ３とプリント基板２の配線
４の間の、熱により溶解した半ＦＪ］５が圧着により各
基板の配線と配線の間に流れ出し、各配線の不必要な短
絡を引き起こす可能性が犬きく、また、配線の接続部が
両基板により隠れてしまい、接続の良否の確認力襠「か
しい等、接続の信頼性か悪いという欠点があった。However, with this conventional connection method, as shown in Figure 3,
The heat-melted semi-FJ between the wiring a3 of the flexible printed circuit board 1 and the wiring 4 of the printed circuit board 2 flows out between the wirings of each circuit board due to pressure bonding, causing unnecessary short circuits of each wiring. In addition, the connection part of the wiring was hidden by both boards, making it difficult to confirm whether the connection was good or not, and the reliability of the connection was poor.
発明の目的
本発明は上記従来の問題点を解消するもので、接続の信
頼性を同上させることのできるプリント基板の接続方法
を提供することを目的とする。OBJECTS OF THE INVENTION The present invention solves the above-mentioned conventional problems, and an object thereof is to provide a printed circuit board connection method that can improve the reliability of the connection.
発明の構成
本発明は、可撓性プリント基板とプリント配線基板のそ
れぞれの基板の複数の配線間の基板に切欠部を設けた後
、可撓性プリント基板とプリント基板の配線を熱圧着に
より接続するものであり、この方法により配線の接続不
良が軽減するとともに、接続の良否の確認が容易に行な
えるため接続の信頼性が同上するものである。Structure of the Invention The present invention provides a method of connecting the wiring of the flexible printed circuit board and the printed circuit board by thermocompression bonding after providing a notch in the board between the plurality of wirings of each of the flexible printed circuit board and the printed wiring board. This method reduces connection failures in the wiring, and also improves the reliability of the connection since it is easy to check whether the connection is good or bad.
実施例の説明
以下本発明の一実施例について第４図〜第６図を用いて
説明する。図において１は可撓性プリント基板、３はこ
の基板に施された配線、２はプリント基板、４はこの基
板に施された配線、５はこれらの配線の互いに接続する
部分に塗抹された半田」であり、これらは従来例の構成
と同じものである。また、７は上記各プリント基板１，
２の配線間に設けられた切欠部であり、８は圧着接続範
囲を示すものである。この構成において、切欠部７は第
４図のように熱圧着による接続範囲８よりも大きくして
おき、また、半１■］５は基板のない部分にくるように
塗抹する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 4 to 6. In the figure, 1 is a flexible printed circuit board, 3 is a wiring applied to this board, 2 is a printed circuit board, 4 is a wiring applied to this board, and 5 is solder applied to the parts where these wirings connect to each other. ”, and these are the same configurations as the conventional example. In addition, 7 is each of the above-mentioned printed circuit boards 1,
2 is a notch provided between the wires, and 8 indicates a crimp connection range. In this configuration, the notch 7 is made larger than the connection range 8 by thermocompression bonding, as shown in FIG. 4, and the half 1.5 is painted so as to be on the part where there is no substrate.
上記のように構成された可撓性プリント基板とプリント
基板の配線を、従来の方法と同様に第６図のように熱圧
着する。この方法による熱圧着接続では、第６図の断面
図に示すように、各基板の配線に塗抹された半田５が、
溶解し各基板の配線の間に流れ出しても上下に半田の逃
げ道があるため、従来例のように不必要な短絡がおこる
ことかない。The flexible printed circuit board constructed as described above and the wiring of the printed circuit board are thermocompression bonded as shown in FIG. 6 in the same manner as in the conventional method. In thermocompression bonding using this method, as shown in the cross-sectional view of FIG. 6, the solder 5 applied to the wiring of each board is
Even if the solder melts and flows between the wiring lines on each board, there are escape routes above and below, so unnecessary short circuits will not occur as in the conventional example.
以上のように、本発明のプリント基板の接続方法による
と各基板の複数の配置線間のノ、（板にｊ５Ｊ欠部を設
けることにより、各プリント基板の接続すべき複数の配
線の間隔が狭い場合、あるいは配線に塗抹した半田の量
が多すぎる場合等に起こる配線間の不必要な短絡を防ぎ
、壕だ、その＠認も基板のない部分を通して目で容易に
行なうことができる。さらに、この方法によｈば、不要
な短絡が発生したとしても、基板のない部分の半田を外
部から取除くことにより、要易に修正できる。また、プ
リント基板に可撓性プリント基板を重ねる際に、各基板
の基板のない部分を合わせることにより１４．配線のず
れをなくすこともできる。As described above, according to the method for connecting printed circuit boards of the present invention, the intervals between the plurality of wiring lines to be connected on each printed circuit board can be reduced by providing the j5J cutouts on the board. This prevents unnecessary short circuits between wires that occur when the wires are narrow or when too much solder is applied to the wires, and trenches can be easily identified by eye through the areas where there is no board. According to this method, even if an unnecessary short circuit occurs, it can be easily corrected by removing the solder from the part where the board is not present.Also, when stacking a flexible printed circuit board on a printed circuit board, 14. Misalignment of wiring can also be eliminated by aligning the parts of each board that do not have a board.
発明の効果
本発明は、互いに接近した複数の配線パターンをもつ可
撓性プリント基板と、同様な複数の接近した配線パター
ンをもつプリント基板それぞれに、互いに接続すべき配
線パターンと他の互いに接続すべき配線パターンとの間
の基板に切欠部を設けることにより、配線の不必要な短
絡を軽減し、接続の良否の確認が容易にでき、接続の信
頼性か向上するばかりでなく、さらに、基板のない部分
を通して、配線の接続部に直接外部から手を加えること
ができるため、不良の修正も容易に行なえるという効果
を得ることができるものである。Effects of the Invention The present invention provides a flexible printed circuit board having a plurality of wiring patterns close to each other, and a printed circuit board having a plurality of similar wiring patterns close to each other. By providing a notch on the board between the desired wiring pattern, unnecessary short circuits in the wiring can be reduced, and it is easy to check whether the connection is good or bad. This not only improves the reliability of the connection, but also Since the connection part of the wiring can be directly accessed from the outside through the part without a mark, it is possible to obtain the effect that defects can be easily corrected.
第１図および第２図は従来のプリント基板の接続方法を
説明するための斜視図、第３図は第２図Ａ−へ線による
断面図、第４図および第５図は本発明の一実施例におけ
るプリント基板の接続方法を説明するための斜視図、第
６図は第６図のＢ−Ｂ線による断面図である。
１・・・・・可撓性プリント基板、２・・・・・・可撓
性プリント基板に施された配線、３・・・・・・プリン
ト基板、４・・・・・・プリント基板に施さ−れた配線
、５・・・・・・各基板の配線に塗抹された半田、６・
・・・熱圧着のための金属片、７・・・・・切欠部。1 and 2 are perspective views for explaining a conventional printed circuit board connection method, FIG. 3 is a sectional view taken along the line A-- in FIG. FIG. 6 is a perspective view for explaining the method of connecting printed circuit boards in the embodiment, and FIG. 6 is a sectional view taken along line BB in FIG. 1... Flexible printed circuit board, 2... Wiring on flexible printed circuit board, 3... Printed circuit board, 4... Printed circuit board Wiring applied, 5...Solder smeared on the wiring of each board, 6.
...Metal piece for thermocompression bonding, 7...Notch.
Claims (1)
と、ｉＪｉ′Ｊ記配線パターンと同様な複数の接近した
配線パターンをもつ可撓性プリント基板それぞれに、互
いに接続すべき配線パターンと他の互いに接続すべき配
線パターンとの間の基板に切欠部を設けた後、前記両プ
リント基板の配線・（ターンを半田を用いて熱圧着接続
するプリント基板の接続方法。A printed circuit board having a plurality of wiring patterns close to each other, and a flexible printed circuit board having a plurality of wiring patterns close to each other similar to the wiring patterns described above, each have wiring patterns to be connected to each other and other wiring patterns to be connected to each other. A printed circuit board connection method in which a notch is provided in the board between the desired wiring pattern, and then the wiring and (turns) of both printed circuit boards are connected by thermocompression using solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11120183A JPS603190A (en) | 1983-06-20 | 1983-06-20 | Method of connecting printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11120183A JPS603190A (en) | 1983-06-20 | 1983-06-20 | Method of connecting printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS603190A true JPS603190A (en) | 1985-01-09 |
Family
ID=14555062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11120183A Pending JPS603190A (en) | 1983-06-20 | 1983-06-20 | Method of connecting printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS603190A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62116580U (en) * | 1986-01-17 | 1987-07-24 | ||
| WO2011052212A1 (en) * | 2009-10-29 | 2011-05-05 | パナソニック株式会社 | Substrate-connecting structure |
-
1983
- 1983-06-20 JP JP11120183A patent/JPS603190A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62116580U (en) * | 1986-01-17 | 1987-07-24 | ||
| WO2011052212A1 (en) * | 2009-10-29 | 2011-05-05 | パナソニック株式会社 | Substrate-connecting structure |
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