JPS6031290A - Method of producing flexible circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION In particular, the present invention relates to a method for manufacturing a flexible circuit board that is thin, has high flexibility, and has a small shape, and is easy to handle.

In some types of flexible circuit boards, an adhesive is previously provided on the back surface of necessary parts such as terminal portions, and the flexible circuit board is adhered to and mounted on equipment using this adhesive. Flexible circuit boards like this are shipped with appropriate release paper attached to the adhesive part, but if the product is particularly thin, small, and highly flexible, it may be shipped with release paper attached. If you punch out individual products according to their external shapes, the products will stick together, so
Handling in the punching process, inspection process, etc. becomes complicated, and counting becomes difficult. Furthermore, when mounting such a flexible circuit board, there is a problem in handling that a very small area of release paper must be removed with tweezers or the like, which increases the number of man-hours.

Such difficulty in handling the flexible circuit board also causes damage such as wrinkles and bending to the product during various operations.

The present invention provides a method for manufacturing a flexible circuit board that suitably solves these six problems, and is characterized by the fact that a plurality of required flexible circuit boards to be made into a product are mounted on a flexible base material. After cutting off unnecessary parts of the base material between the flexible circuit boards so as to leave both sides of the flexible base material in the direction in which the flexible circuit boards are arranged, the terminal section of each flexible circuit board is removed. A release sheet is attached to the back surface of the base material with an adhesive provided on the back surface portion corresponding to , and then both sides of the flexible base material are cut off and a large number of only the flexible circuit boards are placed on the release sheet. The reason is that they are arranged so that they can be separated into pieces.

The drawings show a preferred embodiment thereof, and are shown in FIG.
1 indicates a base material such as a 7-lex plex copper-clad laminate, and a large number of flexible circuit boards 2 to be made into a product are formed on this base material 1 according to a conventional method. Each circuit board 2#'i has a required wiring pattern l formed between the terminal parts 3 as shown in the figure, and the flexible part j is surface coated with a film or ink, etc., as necessary. You can also do that. When manufacturing a special VC thin and highly flexible flexible circuit board (2), both sides of the base material (1) shown with diagonal lines are attached to ensure ease of handling in each process and to prevent wrinkles or bending. Leave copper foil etc. on unnecessary parts 7 located between the parts and each circuit board 2, or remove these parts 6,
It is also preferable to cover the reinforcing layer 7 with a material such as resin in advance. Conventionally, each circuit board 2 is punched out into pieces along the product outline at this stage, but in the present invention, preferably, the terminal portion 3 of each circuit board 2 is punched out as shown in FIGS. 1 and 2. It is advisable to apply an adhesive 9 to the back surface of the base material 1 corresponding to the above, and to apply a tape-like release sheet on the adhesive.Then, as shown in FIG. Only unnecessary portions 7 are removed by punching or the like, excluding both side portions 6. As a result, each circuit board 2L
Both sides of the base material 1 are supported in a continuous manner between them, so there is no fear that the base material 1 will fall apart.

Therefore, the tape-like release sheet l is peeled off, and as shown in FIGS. 3 and 1, the release sheet corresponding to the width Vc of the base material l)
10 will be pasted. The release sheet IO is pasted with the adhesive 9 left on the terminal portion 3 of each circuit board 2 and the back side of both sides B of the base material 1 by the punching process described above. Then, when both sides 6 of the base material 1 indicated by diagonal lines in FIG. 3 are cut along cutting ML along with both sides of the release sheet IO, as shown in FIG. It is possible to obtain a finished product in which only each circuit board is aligned.

Each flexible circuit board 2 is arranged on the release sheet 10 with the adhesive 9 provided only on the back side of the terminal portion 3, so when mounting, each circuit board λ is removed from the release sheet 10A. It can be easily peeled off and quickly assembled into equipment as it comes with an adhesive, making it much easier to handle than before and allowing for highly efficient mounting processing without causing wrinkles or bends to the product during work. . As a means to further facilitate the peeling off of the circuit board 2, as shown by the imaginary line in FIG. l
It is best to provide the
This effectively eliminates the risk of inadvertently causing damage to the product, such as wrinkles, scratches, or bending, and also improves efficiency.

According to the method of the present invention, a large number of flexible circuit boards that become products can be manufactured in a state where they are aligned on a release sheet.
There is no risk of products sticking together as in the past, and the inspection process can be efficiently processed all at once as a sheet-like product.It is also extremely easy to count the number of products, resulting in a significant reduction in man-hours. In addition to eliminating the fear of damaging the product during the process, handling at the time of shipment can be facilitated and processed efficiently, and workability during mounting can be significantly improved.

A simple reprint of the French drawings in FIGS. 1 and 2 shows that after forming a large number of flexible circuit boards on a base material according to the present invention, an adhesive and a release tape are applied to the back surface corresponding to the terminal portion of each circuit board. A partial perspective view and an enlarged cross-sectional view of main parts conceptually showing the state in which the sheet is pasted, and Figures 3 and 3 show the tape-like structure after removing unnecessary parts between each circuit board, leaving both sides of the base material. The same perspective view and cross-sectional view as above, with the release sheet peeled off and a release sheet with the same width as the base material affixed, and a completed product by cutting out both sides of the base material in Figure 3 - Figure 1I. It is a perspective view of the state obtained.

／　、、、、、7 Lexipul base material J　、、、、、Flexible circuit board 3...End part ＋、、、、、Wiring pattern ,! 1.Flexible part Otsu 8030. Both sides of the base material 7. Unnecessary part , r　, , , Tape-shaped release sheet Wa... Adhesive １０　・・・・・・Release sheet /l　、、、、、Toruban Applicant: Nippon Meku)on Co., Ltd. Figure 1 Figure 4 Fang 5

Claims (1)

[Claims] (1) A plurality of required flexible circuit boards to be a product are formed on a 7-flexible base material, and both sides of the flexible base material are left in the direction in which each of these flexible circuit boards is arranged. After cutting off all the unnecessary parts of the base material between each of the above flexible circuit boards, a release sheet is pasted on the back side of the above base material with an adhesive provided on the back side part corresponding to the terminal part of each of the above flexible circuit boards. Then, a method for manufacturing a flexible circuit board comprising cutting off both sides of the flexible base material and arranging only a large number of the flexible circuit boards on the release sheet in a removable manner. (2) After affixing a tape-like release sheet to the back surface portion of the base material including the terminal portion of each flexible circuit board via an adhesive, cutting off unnecessary base material portions between each of the flexible circuit boards. 2. The method of manufacturing a flexible circuit board according to claim 1, comprising the step of: carrying out the following steps, and then reducing the size of the tape-like release sheet and then adhering the release sheet to the back surface of the base material. (8) The method for manufacturing a flexible circuit board according to claim (1) or (2), which includes forming a reinforcing layer in advance on the portions of the seven lexical base materials other than the formation area of each flexible circuit board. (4) The method for manufacturing a flexible circuit board according to any one of claims (1) to (3), wherein a through hole located partially in the outer shape of each flexible circuit board is formed in the release sheet. 0