JPS6031009Y2 - Transfer device for soldering objects - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a device for driving a soldering object container.

Conventionally, soldering involves manually attaching the soldered object to the holding claws of a holder conveyed by a line conveyor, and manually removing the soldered object from the holding claws. However, the work efficiency is poor, and even if this work were to be automated, no effective means could be found to speed up the work.

The present invention was developed in view of these points, and aims to provide a soldering object moving device that can quickly and accurately attach and detach objects to be soldered to and from a soldering line conveyor in a short period of time. It is something.

An embodiment of the present invention will be described based on the drawings.

For soldering, the line conveyor 1 is arranged in an endless manner.

For this soldering, the line conveyor 1 has a pair of inner and outer endless conveyor rails 2 and 3 horizontally disposed on the floor surface, and an endless conveyor check 74 is arranged along the inner conveyor rail 2. Conveyance pins 5 are provided protruding from the conveyance check 74 at predetermined intervals.

In addition, the soldering is carried out by movably supporting rolling wheels 7 on both sides of the holder 6 carried by the line conveyor 1 on the carrying rails 2 and 3, and connecting plates 8 protruding from the inner side of the holder 6. is fitted onto the conveying pin 5 so as to be vertically movable.

Then, a drive motor (not shown) rotates the conveyance check 74 at intervals, thereby holding the holder 6.
is driven to rotate intermittently along the transport rails 2 and 3 in an endless manner.

Further, the holder 6 is provided with at least a pair of holding claws 9 for holding a printed circuit board P as an object to be soldered.

This holding claw 9 has a holding force by being biased by a spring (not shown) so that the lower end closes inward, and the upper end of this holding claw 9 has a mechanism for opening the lower end against the above-mentioned holding force. The roller 11 is mounted on a shaft.

In addition, the above soldering is performed sequentially along the line conveyor 1.
The objects to be soldered are the material intake part 12, the foaming type fluxer 13, the preheater 14, the objects to be soldered are the object vertically moving solder tank 15, the cooling fan 16, the lead cutter 17, the roller brush 18,
A foaming type fluxer 19, a preheater 21, a jet type soldering bath 22, an immersion type cleaning device 23, a cooling fan 24, a soldering material collecting portion 25, and a holding claw cleaning device 26 are arranged.

Note that 27 is an exhaust duct, and 28 is an exhaust fan.

Then, the printed circuit board P is attached to the holding claws 9 of the holder 6 from the outside at the intake part 12, flux is applied to the lower surface of the printed circuit board P using the fluxer 13, preheated by the preheater 14, and the solder is applied to the lower surface of the printed circuit board P. By lowering the printed circuit board P at the position of the tank 15 and immersing its lower surface in the melted solder of the solder tank 15, the printed circuit board P and the lead wires of the electrical components inserted therein are temporarily soldered. Temporarily fix it, cool it with the cooling fan 16, cut off the excess lead wire protruding below the printed circuit board P with the lead cutter 17, and completely remove the cut lead wire with the roller brush 18. The temporarily soldered parts are reliably soldered using the fluxer 19, preheater 21, and jet soldering bath 22, and then passed through the immersion cleaning device 23 and cooling fan 24, and then the holding claws 9 of the holder 6 are brought to the extraction section 25. The printed circuit board P held by the board P is removed to the outside, and only the holding claws 9 are cleaned by the cleaning device 26 to wash off the adhered fluxer.

Further, the above-mentioned soldering is carried out in the material intake part 12, the soldering is carried out in the material receiving part 25, and the soldering is carried out in the line conveyor 1.
A holder positioning mechanism 31 is provided above the holder 6 for positioning and fixing the holder 6 at a fixed position.

That is, the air cylinders 34 are fixed to the machine frame 32 via a pair of left and right mounting plates 33, and the air cylinders 34 are
A guide block 36 is fixed to the tip of the piston rod 35 of No. 4, a positioning body 37 is fixed to the lower end of this guide block 36, and a conical groove 38 for positioning is provided at the tip of this positioning body 37. , so that the holder positioning pins 39 projecting upward from both sides of the holder 6 are fitted.

Note that 41 is a guide rod that is slidably fitted to the guide block 36.

Then, when the holder 6 stops at the intake part 12 and the extraction part 25, this stop is detected by a limit switch, etc., and the piston rod 35 of the air cylinder 34 is pushed down, and the conical groove 38 is positioned to position the holder. The pin 39 is fitted into the pin 39, and the holder 6 is accurately positioned and fixed by this fitting.

In addition, the holding claw opening/closing mechanisms 42 on the intake side and the extraction side for opening and closing the holding claws 9 are connected to the holding claw opening/closing mechanism 42 on the intake side and the extraction side for opening and closing the holding claws 9 in the material intake portion 12 for the soldered object and the material collection mountain portion 25 for the soldered material.
be placed above the stopping position of each.

That is, a pair of left and right mounting plates 43 are fixed to the machine frame 32, a hole 44 is bored in the center of the mounting plate 43, and guides 4 in the conveyor direction are provided on the upper surface of both sides of the hole 44.
The upper slider 4 is fixed between the guides 45 on both sides.
6 is slidably fitted in the direction of the conveyor, and this slider 4
A diagonal groove 47 is bored in the lower surface of the slider 6, and an air cylinder 48 is fixed on the mounting plate 43, and its piston rod 49 is connected to one end surface of the slider 46.

Further, supporting parts 51 are fixed to the lower surfaces of both sides of the hole 44,
A lateral guide 52 is installed between the supporting parts 51 on both sides, a lower slider 53 is fitted into the guide 52 so as to be slidable in the lateral direction, and a roller 54 is rotatably mounted on the upper surface of the slider 53. The roller 54 is movably fitted into the diagonal groove 47, and an opening/closing claw plate 55 is fixed to the lower surface of the slider 53, and the tip of the opening/closing claw plate 55 is connected to the roller 11 of the holding claw 9. placed on the outside of the

Then, the piston rod 49 of the air cylinder 48
is pushed out, the diagonal groove 47 of the upper slider 46 is moved in the direction of the conveyor, and the lower slider 53, which is fitted into this diagonal groove 47 via the roller 54, is moved inward along the lateral guide 52. The opening/closing claw plate 55 of the slider 53 pushes the roller 11 of the holding claw 9 inward to open the tip of the holding claw 9 outward, and the printed circuit board P held by the holding claw 9 is released.

Further, the soldering object is placed in the material intake section 12 and the soldering material is provided in the material receiving section 25 in the soldering conveyor 1.
On the sides of the board, there are arranged an intake-side loaded container 56 and an empty extraction-side container 57, which store printed circuit boards P in multiple stages in the vertical direction with an interval between them.

That is, the box-shaped housing main body is made up of an upper plate 58, a lower plate 59, and angles 61 at four corners that support the upper and lower plates 58 and 59.
A pair of columns 62, 63 are provided between the upper and lower plates 58, 59 on both sides of the housing body, and objects to be soldered are inserted in multiple stages in the vertical direction on the columns 62, 63 on both sides. The parts 64 are arranged parallel and horizontally opposite each other, and the object insertion groove 6 for soldering is provided on the opposite surface of the insertion part 64.
5 is formed to have the thickness of the printed circuit board P.

A gap 66 that is sufficiently larger than the thickness of the printed circuit board P is provided between each of the insertion grooves 65, so that electrical components (not shown) and their lead wires inserted into the printed circuit board P can be easily connected to other circuit boards P. prevent mutual interference with other objects.

Further, openings 67 are provided at both ends of the insertion groove 65,
The insertion groove 65 of the printed circuit board P is passed through this opening 67.
Insertion into and removal from the insertion groove 65 are performed.

Further, inside each insertion groove 65, a presser spring 68 whose tip end slightly protrudes from the bottom surface of the insertion groove 65 is fixed in the direction in which the printed circuit board P is taken out. Free removal from the top prevents it from falling.

Further, the above-mentioned - side support column 63 is provided so as to be movable and adjustable along a long hole 69 bored in the upper and lower plates 58.59, and after adjusting the movement according to the size of the printed circuit board P, the upper and lower plates 58
．． Fixed at 59.

Further, on the lower surface of the lower plate 59 of the containers 56, 57, there are 4
A ball-shaped moving ring 71 is provided at the corner, and a guide disk 72, a lock pin 73, and a feed pin 74 are provided at the center.

In addition, the above-mentioned soldering is carried out on the side of the line conveyor 1, in which the intake-side and take-out-side containers 56 and 57 are intermittently transferred in the vertical direction at the accommodation interval of the printed circuit board P. Vertical feed mechanisms 75 and 76 are provided, respectively.

That is, a pair of guide posts 78 are installed upright on the machine frame 32, a vertically movable base plate 81 is vertically movably provided on the guide post 78 via a slider 79, and the vertical feed base 82 is horizontally moved from the vertically movable base plate 81. Furthermore, sprocket wheels 84.85 are rotatably attached to the upper and lower parts of the machine frame 32, and an endless chino 86 is wound between the upper and lower sprocket wheels 84.85. is connected to the connecting portion 87 on the back surface of the vertically movable board 81.

Also, a bevel gear 89 is integrally fitted to the drive shaft 88 of the lower sprocket wheel 85, and this
The bevel gear 92 of the rotational drive device 91 is engaged with the rotation drive device 91.

The rotation drive device 91 is formed by a motor, a worm reducer, and a torque limiter.

Then, the bevel gear 92 of the rotary drive device 91 is intermittently driven to move the check 786 intermittently, and the vertical feed base 82 connected to the check 786 is moved at the storage interval of the storage bodies 56 and 57. Intermittent transfer in the vertical direction.

In addition, the storage body vertical feeding mechanism 75 on the intake side and the extraction side
．． Each of the vertical feed bases 82 of 76 is provided with a container positioning mechanism 93 for positioning and fixing the containers 56 and 57 on the vertical feed base 82.

That is, a pair of guides 94 are fixed to the lower surface of the vertical feed base 82 with a gap between them, and a slider 95 is slidably fitted between the guides 94.
The base of the container fixing claw 97 is inserted into the container 6 and rotatably attached to the shaft 98, and the tip of the container fixing claw 97 projects upward through the hole 99 of the base 82.
A V-groove 101 is formed at the tip, and the V-groove 101 is fitted into the lock pin 73 on the lower surface of the container 56. 102 is interposed to urge the tip of the fixing claw 97 upward, and an inclined surface 103 is formed on the carry-in side of the fixing claw 97.

Further, an air cylinder 104 is fixed to the lower surface of the base 82, and this air cylinder 1'.

The tip of the piston rod 105 of No. 4 is connected to one end surface of the slider 95.

Further, a pair of guides 106 are fixed to the upper surface of the central portion of the vertical feed base 82 with a parallel interval therebetween.
Guide disc body 7 on the lower surface of the housing body 56 and 57 between 06 and 06
A stopper 10 is configured to slidably fit the housings 56 and 57 onto the surface of the vertically movable base plate 81.
Fix 7.

10B is a limit switch.

Then, when the containers 56.57 are fed onto the vertical feed base 82 along the guide 106, the containers 56.5
The lock pin 73 on the lower surface of 7 is connected to the inclined surface 1 of the fixed claw 97.
03 etc. and enters the tip of the groove 101 of this fixing claw 97, and at the same time the fixing claw 97 presses down the compression coil spring 1.
02, the lock pin 73 is returned to the state shown in the figure.
Locks the return.

When the piston rod 105 is retracted in this state, the fixing claw 97 moves into its V-groove i.

1 to press the lock pin 73 toward the vertically movable base plate 81, press the container 56.57 against the stopper 107, and fix the container 56.57 in a fixed position.

Further, when removing the housing body 56.57 from the vertical feed base 82, push out the piston rod 105, release the fitting between the fixing claw 97 and the lock pin 73, and lift the housing body 56.57. good.

Further, the containers 56 and 57 are placed in the standby positions of the vertical feed bases 82 on the intake side and the take-out side.
Container transverse transport mechanism 111, 1 for horizontally transporting the container toward 2
Connect 12.

That is, the transverse feed base 113 is fixed to the machine frame 32, and the base 116 of the container feed-in pawl 115 is slidably fitted into the parallel space 114 at the center of this base 113, and the container feed-in pawl is 115 moves back and forth on the base 113, and a groove 117 is provided at the tip of the feeding claw 115, and this V groove 117 is arranged to move forward and backward on the base 113.
so that it fits into the feed pin 74 on the lower surface of.

Further, a pair of sprocket wheels 118 are rotatably supported on the machine frame 32 below the lateral feed base 113,
Between this pair of sprocket wheels 118 is an endless chino 1.
19, and a part of this chain 7119 is connected to the base 116 of the container feeding claw 115.

Also, the drive shaft 12 of the one sprocket wheel 118
1 is connected to a rotary drive device 123 such as a motor via a chino transmission mechanism 122.

Then, the rotary drive device 123 is driven for a certain period of time, and the container 5 placed on the lateral feed base 113 is
6. Connect the feed pin 74 of 57 to the V- of the feed claw 115.
It is pushed by the groove 117 and the containers 56, 57 are transferred from the horizontal feed base 113 to the vertical feed base 82 at the same level.

In addition, since the vertical feed base 82 is waiting at the lower part of the object receiving section 12 for soldering, the container horizontal feeding mechanism 111 is provided at a lower fixed position, and the object to be soldered is not placed at the object receiving section 25. Since the vertical feed base 82 is on standby above, the container lateral feed mechanism 112 is provided at a fixed position above.

In addition, in the material intake part 12 for the wave soldering and the material collection mountain part 25 for soldering, there is a position below the stopping position of the holding claw 9 at the same level as the holding claw 9 and below the holding claw 9. The objects 124 and 125 and 126 and 127 for soldering objects which are moved up and down between a certain lowering level are arranged.

That is, the mounting plate 128 is fixed to the machine frame 32, and the guide rod 13 is attached to the four guides 129 fixed to the mounting plate 128.
A vertically movable base 132 is fixed to the upper end of this guide rod 131, an air cylinder 133 is fixed to the mounting plate 128, and the tip of the piston rod 134 is fitted to the vertically movable base 132. Connect to the center of the

The soldering target is placed on one side of the vertically movable base 132 via the support section 135 in the object intake section 12.
When soldering the object on the side, the object holder fixes the body 124 and also connects the object on the other side of the base 132 via a support part 137 fixedly supported by a pair of guides 136 with sliding adjustment function. For soldering, a body 125 is provided for the object holder, and the holders on both sides are attached to printed circuit boards P on opposite sides of the bodies 124 and 125.
A receiving part 138 is provided for locking.

In addition, in the mounting portion 25 to be soldered, a pair of guide blocks 141 and an air cylinder 142 are fixed on one side of the vertically movable base 132 via a support portion 139.
A body base plate 144 is fitted into the guide block 141 through a guide rod 143 so that it can move forward and backward, and the body base plate 144 is connected to the tip of the piston rod 145 of the air cylinder 142. A soldering body 126 is attached to one side of the upper end surface of the board 144, and a pair of guides 146 are attached to the other side of the vertically movable base 132.
A pair of guide blocks 148 and the air cylinder 14 are connected to each other via a support portion 147 that is fixedly supported by a sliding adjustment function.
9 and the guide rod 15 to the guide block 148.
1, the body base plate 152 is fitted into the body base plate 152 so as to be freely retractable.
The tip of the piston 153 is connected to the upper end surface of the body board 152.
27, and the receivers on both sides have a body 126°127
A groove 154 that fits into both sides of the printed circuit board P is formed on the opposing side surface of the board.

The plates 124, 125 and 126, 127 of the receiver are provided in a direction perpendicular to the holding claws 9 of the holder 6 so that they do not interfere with each other.

Then, in the intake section 12, the receiver receives the printed circuit board P at the receiving step part 138 of the bodies 124, 125 at a certain descending level, and pushes up the piston rod 134 to hold the printed circuit board P at the level of the holding claw 9. Let it rise to
In addition, in the extraction section 25, before the holding claw 9 releases the printed circuit board P, the receiver positioned at the level of the holding claw 9 moves the bodies 126, 127 to the piston rod 145°1.
53 and moves inward, and the other side of the printed circuit board P is clamped by the V groove 154, whereby the holding claws 9 and the printed circuit board P are bonded with flux or the like, and the holding claws 9 The risk of the printed circuit board P shifting when opening can be prevented by holding the printed circuit board P in the groove 154, and after the holding claw 9 is released, the piston rod 134 is pulled down and the receiver body 126, 127 removes the printed circuit board. The substrate P is lowered from the level of the holding claws 9 to a certain descending level.

Further, in the intake part 12 and the extraction part 25, the objects to be soldered are the bodies 124, 125 and 126, 1.
The container 56 is placed at the same level as the constant descending level of 27.
．． 57 is to be soldered so that the object insertion portions 64 are arranged continuously.

Further, the soldering object is placed on the object intake part 12, and the object receiving part 124, 125 is placed on the side opposite to the object receiving part 125, and the object receiving part 12 is placed on the side opposite to the object receiving part 125. At the same descending level, the object pushing mechanism 1
Place 61.

That is, the motor 162 and this motor 162 are mounted on the machine frame 32.
A gear mechanism section 163 that decelerates the rotation of the gear mechanism section 163 is fixed, and a pushing rod 165 on which a rack 164 that engages with the pinion in this gear mechanism section 163 is formed is inserted into the gear mechanism section 163, and this pushing rod 165 is inserted into the gear mechanism section 163. A base 167 of one pushing claw 166 is fixed to the tip of the rod 165, and a base 169 of the other pushing claw 168 is slidably fixed to this base 167.

There is a ■ groove 171 at the tip of both of these pushing pawls 166.16B.
is formed so that this V-groove 171 and the printed circuit board P at a certain level accommodated in the intake-side container 56 fit together.

Then, the motor 162 is driven to push out the pushing rod 165 through engagement between the pinion and the rack 164, and the V-groove 171 moves the printed circuit board P at a certain level in the housing body 56 down the certain level. When soldering is carried out on the intake side of the level, the object receiver is pushed horizontally toward the bodies 124 and 125.

Further, the soldering object is placed in the object receptacle 25, and the object receptacle is the object receiving body 126,
127, the object pushing mechanism 1 is placed at the same lowering level on the side opposite to the receptacle 57 on the ejection side.
Place 81.

Note that this mechanism 181 has the same structure as the object pushing mechanism 161 for soldering on the intake side, so a description thereof will be omitted.

In addition, this action on the ejection side is such that the soldering target on the ejection side at a certain descending level is caused by the groove 171 at the tip of the pushing rod 165. horizontally toward a certain level of the container 57.

Next, the overall effect will be explained.

A worker picks up the storage body 5 in which printed circuit boards P are stored in each stage.
6 is the cross-feeding base 1 of the storage body cross-feeding mechanism 111 on the intake side.
13 and empty containers 57 are set on the cross-feeding base 113 of the container cross-feeding mechanism 112 on the extraction side.
, 112 to the vertical feeding mechanism 75.76 for the storage body on the intake side and the extraction side, and is positioned and fixed on the vertical feeding base 82 of this mechanism 75.76.

Then, on the intake side, the container 56 is initially located at the bottom, and the object pushing mechanism 161 pushes out the uppermost printed circuit board P in the container 56 from the container 56 and lowers the board to be soldered. The level to be soldered is the body 124, 12
5, this printed circuit board P is raised to the level of the holding claws 9 of the holder 6 by the support bodies 124 and 125, and at this level is positioned at a certain position by the holder positioning mechanism 31, and the printed circuit board P is held at a fixed position by the holding claws. It is held by the holding claws 9 which are waiting in the opened state by the opening/closing mechanism 42, and is transported by the line conveyor 1 and soldered.

Note that on this intake side, the container 56 is intermittently raised by the container vertical transport mechanism 75, and is discharged from the container 56 in the order of printed circuit boards P in the upper stage to printed circuit boards P in the lower stage.

On the extraction side, once the holder 6 is positioned at a certain position by the holder positioning mechanism 31, the objects to be soldered on both sides that have risen to the level of the holding claws 9 are
7 to clamp the other side of the printed circuit board P, and then the holding claw opening/closing mechanism 42 opens the holding claw 9, and the receiver is lowered to a certain lowering level by the bodies 126 and 127. The objects to be soldered at the same level are pushed out from the bodies 126 and 127 by the object pushing mechanism 181 and accommodated in each stage of the receiving body 57 on the extraction side.

Note that on this take-out side, the container 57 is initially located at the top, and each time a printed circuit board P is inserted, it is sequentially moved downward by the container vertical feed mechanism 76, and the printed circuit board P is located at the bottom of this container 57. They are inserted in order from the row above.

In this way, both on the intake side and on the output side, the heavy containers 56 and 57 containing printed circuit boards P in all stages are positioned at the bottom, so that the lateral feed on the intake side is prevented. It is easy for the operator to supply the containers 56 to the base 113 and to take out the containers 57 from the vertical feed base 82 on the take-out side.

In addition, the motors and air cylinders of each mechanism are controlled in sequence using limit switches and the like.

As described above, according to the present invention, a holding claw for holding the object to be soldered is provided on a holder conveyed by a line conveyor, and a holding claw for holding the object to be soldered is provided below the stopping position of the holding claw at the same level as the holding claw. For soldering objects that are moved up and down between the descending level below this holding claw, the object bracket is placed, and for the above-mentioned wave soldering, the object object is placed continuously at the same level as the descending level of the body. For the above wave soldering, the object insertion part is placed, and for the above wave soldering, the object holding mechanism is placed at the lower level of the body, and for the above wave soldering, the object pushing mechanism is placed linearly at the same level as the object insertion part. Therefore, even if the line conveyor is moving, the soldering is performed at the intake part of the line conveyor, and the wave soldering described above is performed when the soldering object is inserted into the object insertion part by the object pushing mechanism below the line conveyor. When soldering is carried out, the object to be soldered can be carried into the body, and the object to be soldered can be kept waiting below the stop position of the holding claw of the holder, so soldering is carried out using a line conveyor. Even if the stoppage time is short, during that time the body of the receiver rises to the level of the holding claw, and the work of holding the object to be soldered on the body by the holding claw can be done in a short time. For soldering, even when the line conveyor is moving, for soldering, even when the line conveyor is moving, the above-mentioned wave soldering is carried out by an object pushing mechanism. Since the soldered material can be transported to the object insertion section,
During soldering, even if the line conveyor stops for only a short time, during that time the body of the above-mentioned receiver rises to the level of the holding claw, and the soldering object of the holding claw is moved to the body of the above-mentioned receiver. Therefore, soldering can be done on a line conveyor, whereas soldering can be quickly and accurately attached and detached.

[Brief explanation of the drawing]

The figures show one embodiment of the present invention, in which Fig. 1 is a plan view of the soldering line, Fig. 2 is a front view of the material intake part and the soldering material part, and Figure 3 is a plan sectional view of the material intake part to be soldered, and Figure 4 is IV-I of Figure 3.
5 is a cross-sectional view taken along the line ■--V in FIG. 3, FIG. 6 is a cross-sectional view taken along the ■-■ line in FIG. 3, FIG. 7 is an exploded perspective view of the vertical feed base, and FIG. 9 is a plan view of the holding claw opening/closing mechanism, and FIG. 9 is a perspective view of the drive mechanism of the receptacle for soldering on the extraction side. P...The object to be soldered is a printed circuit board as an object,
1... Soldering is done on line conveyor, 6...
・・Honda, 9・・・Holding claw, 42・・・・
Holding claw opening/closing mechanism, 64...The object to be soldered is the object insertion part, 124,125゜126.127...The object receiver is the body to be soldered, 161.181...・The object is pushed by a mechanism for soldering.

Claims (1)

[Scope of utility model registration request] Soldering is carried out by a line conveyor, and the holder is provided with a holding claw that holds the object to be soldered, a holding claw opening/closing mechanism arranged above the stop position of the holding claw that opens and closes the holding claw, and the above-mentioned holding claw. The object to be soldered, which is placed below the stop position of the claw and is moved up and down between the same level as the above-mentioned holding claw and the descending level below this holding claw, is connected to the body of the object receiver, and the above-mentioned soldered object is On the side, in the above wave soldering, the object receiver is placed continuously at the same level as the descending level of the body. A device for transferring objects to be soldered, characterized in that the soldering device is provided with an object pushing mechanism arranged linearly at the same level as an object insertion part.