JPS6028090B2 - Manufacturing method of reed switch - Google Patents

Manufacturing method of reed switch

Info

Publication number
JPS6028090B2
JPS6028090B2 JP2564480A JP2564480A JPS6028090B2 JP S6028090 B2 JPS6028090 B2 JP S6028090B2 JP 2564480 A JP2564480 A JP 2564480A JP 2564480 A JP2564480 A JP 2564480A JP S6028090 B2 JPS6028090 B2 JP S6028090B2
Authority
JP
Japan
Prior art keywords
enclosure
fixed
piece
contact
movable piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2564480A
Other languages
Japanese (ja)
Other versions
JPS56132731A (en
Inventor
泰生 山下
征治 名倉
三幸 浅井
静彦 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Manufacturing Co Ltd filed Critical Yaskawa Electric Manufacturing Co Ltd
Priority to JP2564480A priority Critical patent/JPS6028090B2/en
Publication of JPS56132731A publication Critical patent/JPS56132731A/en
Publication of JPS6028090B2 publication Critical patent/JPS6028090B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明はリードスイッチ、特に耐振型のりードスィッチ
の製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a reed switch, particularly a vibration-resistant type reed switch.

例えば第1図に示す構成のIJ−ドスィッチは、ガラス
製の封入容器1の先端に、良導電性磁性材にてなる第1
及び第2の固定端子2及び3が一部を封入容器1の内部
に挿入された状態で封着されており、第1の固定端子2
には良導電性のバネ材にてなる接触片4が蓮設され、第
2の固定端子3には同じく良導電性のバネ材にてなる支
持片5がその先端が第1の固定端子2近くまで延出した
状態で蓮設され、同支持片5には磁性材にてなる可動片
6が前記第1の固定端子2と所要の薮極重ね代を有する
状態に、接点7背部のかしめピンをかしめることにより
取り付けられたものである。
For example, an IJ-doswitch having the configuration shown in FIG.
The second fixed terminals 2 and 3 are partially inserted into the enclosure 1 and sealed together, and the first fixed terminal 2
A contact piece 4 made of a spring material with good conductivity is provided on the second fixed terminal 3, and a support piece 5 made of a spring material with good conductivity is attached to the second fixed terminal 3, the tip of which is connected to the first fixed terminal 2. A movable piece 6 made of a magnetic material is mounted on the supporting piece 5 in a state extending close to the first fixed terminal 2, and the back of the contact 7 is caulked so as to have a required overlapping margin with the first fixed terminal 2. It is attached by caulking a pin.

図中8は外部磁界の消塾時において接点間隙、磁気間隙
を規制するために封入容器1の内壁面に当接するように
上記接点7の背部に突設したストッパー、3a,6aは
それぞれ第2の固定端子3と可動片6との間に補助磁気
間隙を形成して外部磁界による可動片6の駆動力を向上
させるための折曲部である。上記のような構成のリード
スイッチでは、可動片6を外部磁界により駆動する際の
動作の安定のため支持5にヒンジ点5aを形成して、そ
のヒンジ点5aを支点として可動片6が動作するように
している。
In the figure, 8 is a stopper protruding from the back of the contact 7 so as to come into contact with the inner wall surface of the enclosure 1 in order to regulate the contact gap and magnetic gap when the external magnetic field is extinguished, and 3a and 6a are second stoppers, respectively. This is a bent portion for forming an auxiliary magnetic gap between the fixed terminal 3 and the movable piece 6 to improve the driving force of the movable piece 6 by an external magnetic field. In the reed switch configured as described above, in order to stabilize the operation when the movable piece 6 is driven by an external magnetic field, a hinge point 5a is formed on the support 5, and the movable piece 6 operates using the hinge point 5a as a fulcrum. That's what I do.

一般用のIJードスィッチでは、このヒンジ点5aと可
動片6との接触圧は2〜5外こ設定されるが、耐振型と
して設計する場合には前記の接触片4、支持片5の材質
にMoバネ等を使用してバネ定数を上げ、ヒンジ点5a
と可動片6との接触圧も30〜40のこしなければなら
ない。その結果、このリードスイッチを振動の多い環境
下に置いた場合、硬いMoバネ材(硬さ:Hv310〜
330)にてなる支持片5に押圧された例えば、48%
Fe−52%Ni合金(硬さ:Hvloo〜110)の
可動片6は局部的に摩耗し、その摩耗粉が例えば前記折
曲部3a,6a間の補助磁気間隙に入って投入不良を起
すおそれがある。本発明は、このような問題点を解消し
、特に耐振型のりードスィッチとして適合するように可
動片6の支持片5との接触部に無電解〆ッキを施して耐
摩耗性を向上させると共に、その無電解〆ッキ皮膜層の
加熱硬化処理を封入容器封着後の歪取りのための熱処理
の際の加熱により歪取りと同時に行おうとするものであ
る。以下本発明を、上述した第1図の構成のリードスイ
ッチを例にして1つの実施例に基づき説明すれば、まず
第2図に示すように後に支持片5のヒンジ点5aの部分
と接触する部分6b(以下ヒンジ部という)に無電解〆
ッキを施すのであるがメッキ処理を容易にするため6c
の部分も含めて一端に無電解〆ツキを行う。
In a general IJ switch, the contact pressure between the hinge point 5a and the movable piece 6 is set to 2 to 5 degrees, but when designed as a vibration-proof type, the materials of the contact piece 4 and the support piece 5 are Increase the spring constant using a Mo spring, etc., and adjust the hinge point 5a.
The contact pressure between the movable piece 6 and the movable piece 6 must also be 30 to 40. As a result, when this reed switch is placed in an environment with a lot of vibration, the hard Mo spring material (hardness: Hv310~
For example, 48% pressed against the support piece 5 consisting of 330)
The movable piece 6 made of Fe-52%Ni alloy (hardness: Hvloo~110) may wear locally, and the wear powder may enter the auxiliary magnetic gap between the bent portions 3a and 6a, causing a feeding failure. There is. The present invention solves these problems, and improves wear resistance by applying electroless sealing to the contact portion of the movable piece 6 with the support piece 5 so as to be particularly suitable for a vibration-proof type lead switch. , the heat curing treatment of the electroless sealing film layer is performed at the same time as strain relief by heating during the heat treatment for strain relief after sealing the sealed container. Hereinafter, the present invention will be described based on one embodiment, taking the reed switch having the configuration shown in FIG. 1 as an example. First, as shown in FIG. Electroless plating is applied to the part 6b (hereinafter referred to as the hinge part), but in order to facilitate the plating process, the part 6c is
Apply electroless sealing to one end, including the part.

メッキ液には化学組成Ni90〜92%、P8〜10%
の無電鮫ニッケルメッキ液を用いた。処理方法は次の通
りである。(1) 可動片6をバレル研磨処理によりバ
リ取り及び表面研磨する。
The chemical composition of the plating solution is Ni90-92%, P8-10%.
Electroless shark nickel plating solution was used. The processing method is as follows. (1) Deburr and surface polish the movable piece 6 by barrel polishing.

(0) 可動片6の先端鞍極部6dを適当な治具に挿し
込む。
(0) Insert the tip saddle pole portion 6d of the movable piece 6 into a suitable jig.

袷臭は電流を流す必要が無いので約80℃に耐えるもの
であれば何でも良い。1つの治臭には複数個の可動片を
取り付けることとする。
Since there is no need to run an electric current through the lining, any material that can withstand temperatures of about 80 degrees Celsius will suffice. A plurality of movable pieces are attached to one odor control device.

(m) メッキを必要とする部分のみ酸洗いする。(m) Pickle only the parts that require plating.

(W) 80〜9ぴ0のメッキ液に、メッキを必要とす
る部分のみ浸す。
(W) Immerse only the parts that require plating in 80-90% plating solution.

3び分の浸済で10仏のメッキ層が生成された。A plating layer of 10 layers was produced after 3 layers of immersion.

なおメッキ皮膜生成速度は下表の通りである。(V)
メッキ液から取り出した後、200午0で1時間のべー
キング(仮燐)を行った。
The plating film formation rate is shown in the table below. (V)
After taking it out from the plating solution, it was baked (temporary phosphorus) for 1 hour at 200 pm.

上述した化学組成の無電解ニッケルメッキではメッキ後
の熱処理によって第3図に示すような硬さのメッキ皮膜
層が得られるが、本発明では、この段階では加熱硬化処
理は行わないこととする。
In electroless nickel plating having the chemical composition described above, a plated film layer having a hardness as shown in FIG. 3 can be obtained by heat treatment after plating, but in the present invention, heat curing treatment is not performed at this stage.

次に、可動片6の綾極部6dにCr又はRhメッキを施
した後、第2の固定端子3と支持片5と可動片6とをか
しめて組み立てる。また第1の固定端子2と接触片4も
、かしめにより組み立てる。次に、第1の固定端子2と
第2の固定端子3とを第4図に示すようにそれぞれ支持
台9,1川こ支持させ、第1の固定端子2と第2の固定
端子3とを対向させて適当な位置に固定しておき、これ
らの第1及び第2の固定端子2,3に覆わせたガラス管
1′を、図の矢印A方向に移動させるとガラス管1′の
内壁面にストッパー8が当接し、更にガラス管1′をA
方向に移動して可動接点7が接触片4に接触したところ
で移動を停止する。この場合、接極部である第1の固定
端子2の先端部と可動片6の先端部とは間隙をもって対
向している。次に、ガラス管1′を矢印A方向と逆の方
向に移動させると、ストッパー8がガラス管1′の内墜
面に当接したまま可動片6は接触片4より離れて行き、
可動接点7と接触片4との接点間隙が所タ定の間隙に達
したところで移動を停止させ、封着用ヒートコイル11
,12に通電してガラス管1′の両端を約700℃で加
熱して封着する。
Next, after applying Cr or Rh plating to the traverse pole portion 6d of the movable piece 6, the second fixed terminal 3, the support piece 5, and the movable piece 6 are assembled by caulking. Further, the first fixed terminal 2 and the contact piece 4 are also assembled by caulking. Next, as shown in FIG. When the glass tube 1' covered by the first and second fixed terminals 2 and 3 is moved in the direction of arrow A in the figure, the glass tube 1' The stopper 8 comes into contact with the inner wall surface, and the glass tube 1' is
When the movable contact 7 comes into contact with the contact piece 4, the movement is stopped. In this case, the tip of the first fixed terminal 2, which is the armature, and the tip of the movable piece 6 are opposed to each other with a gap. Next, when the glass tube 1' is moved in the direction opposite to the direction of arrow A, the movable piece 6 moves away from the contact piece 4 while the stopper 8 remains in contact with the falling surface of the glass tube 1'.
When the contact gap between the movable contact 7 and the contact piece 4 reaches a predetermined gap, the movement is stopped, and the sealing heat coil 11
, 12 to heat both ends of the glass tube 1' to about 700° C. and seal them.

なお、このときの加熱時間は短いので上記可動片6のメ
ッキ皮膜層の硬化は十分でない。0 このようにして封
着されたガラス封入容器1には封着部に熱歪み(内部残
存応力)があり、このままでは機械的強度に問題がある
ので、歪取りのため440℃で30分の熱処理で行う。
Note that since the heating time at this time is short, the plating film layer of the movable piece 6 is not sufficiently hardened. 0 The glass sealed container 1 sealed in this way has thermal distortion (internal residual stress) in the sealed part, and if left as it is, there will be a problem in mechanical strength. This is done by heat treatment.

この熱処理の温度は前述のようにNi90〜92%、P
8〜10%の無電解ニッケルメッキ皮膜層の硬度を最大
にする温度400℃とほぼ一致し、その硬度はHvlo
ooと約2倍に増大する。
As mentioned above, the temperature of this heat treatment is 90-92% Ni, P
This is almost the same as the temperature of 400°C that maximizes the hardness of the 8-10% electroless nickel plating film layer, and the hardness is Hvlo
It increases approximately twice as much as oo.

また摩耗性も第5図の1に見られるように2の硬質クロ
ムメッキとほぼ同等となる。同図中3は砲金、4はニッ
ケル電気メッキの摩耗量を示す。本発明では、このよう
にして可動片6のヒンジ部6bの硬度を増大させたので
、耐振型のりードスィッチとして支持片5のバネ定数を
上げて硬いものを使用しても耐摩耗性に優れ、メッキを
施さない場合に生じる摩耗粉による投入不良等のおそれ
を解消できると共に、無電解〆ッキ皮膜層の硬化処理を
ガラス封入容器1の熱歪取りのための熱処理により同時
に行えるため、特別の硬化処理工程を要せず、特に耐振
型のりードスィッチを製造するに当ってその製造工程を
短縮できるという効果を奏するものである。
In addition, the abrasion resistance is almost the same as that of hard chrome plating (2), as shown in Figure 5 (1). In the figure, 3 indicates the wear amount of the gunmetal, and 4 indicates the wear amount of the nickel electroplating. In the present invention, the hardness of the hinge portion 6b of the movable piece 6 is increased in this way, so even if the spring constant of the support piece 5 is increased and a hard piece is used as a vibration-resistant lead switch, it has excellent wear resistance. This eliminates the risk of charging failures due to abrasion powder that would occur when plating is not applied, and the hardening of the electroless glazing film layer can be performed simultaneously with the heat treatment to remove thermal distortion of the glass enclosure 1. This method does not require a hardening process, and has the advantage of shortening the manufacturing process, especially when manufacturing a vibration-resistant type ride switch.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に係るリードスイッチの構成を示す説明
図、第2図は可動片の被メッキ部を示す説明図、第3図
は本発明実施例に用いた無電解〆ッキ皮膜層の熱処理温
度とビッカース硬さとの関係を示すグラフ、第4図は本
発明に係る製造方法の一工程を示す説明図、第5図は摩
耗試験による各素材の摩耗量を示すグラフである。 1:封入容器、1′:ガラス管、2:第1の固定端子、
3:第2の固定端子、4:接触片、5:支持片、6:可
動片、7:接点(可動接点)8:ストッパー、9,10
:支持台、11,12・・・..・ヒートコイル。 第1図 第3図 第2図 第4図 第5図
Fig. 1 is an explanatory diagram showing the structure of the reed switch according to the present invention, Fig. 2 is an explanatory diagram showing the plated part of the movable piece, and Fig. 3 is an electroless plating film layer used in an example of the present invention. FIG. 4 is an explanatory diagram showing one step of the manufacturing method according to the present invention, and FIG. 5 is a graph showing the amount of wear of each material in an abrasion test. 1: Enclosed container, 1': Glass tube, 2: First fixed terminal,
3: Second fixed terminal, 4: Contact piece, 5: Support piece, 6: Movable piece, 7: Contact (movable contact) 8: Stopper, 9, 10
: Support stand, 11, 12... ..・Heat coil. Figure 1 Figure 3 Figure 2 Figure 4 Figure 5

Claims (1)

【特許請求の範囲】[Claims] 1 非磁性材の封入容器と、同封入容器内に一部をのぞ
ませて付着した第1及び第2の固定端子と、第1の固定
端子に設けられた固定接点と、第2の固定端子に基端部
を固着され先端部を前記第1の固定端子に向つて延出さ
せた良導電性バネ材よりなる支持片と、上記第1の固定
端子側の折曲部に対して所要の接触重ね代を有する状態
に当該支持片に先端部を固定された磁性材にてなる可動
片と、上軌支持片に連設され前記固定接点に対して接離
する可動接点とよりなるリードスイツチを製造するに当
り、まず部品の状態の可動片の基端部であつて組み立て
後に前記支持片と接触することとなる部分に無電解メツ
キを施しておき、前記各部品を封入容器用両端開口管の
内部に組み立てて同管の両端を加熱して封着し、その後
封入容器の歪取りのために施す熱処理工程により封入容
器の歪取りと同時に前記可動片の無電解メツキ皮膜層を
加熱硬化させることを特徴とするリードスイツチの製造
方法。
1. An enclosure made of a non-magnetic material, first and second fixed terminals partially exposed inside the enclosure, a fixed contact provided on the first fixed terminal, and a second fixed terminal. A supporting piece made of a highly conductive spring material whose base end is fixed to the terminal and whose distal end extends toward the first fixed terminal, and a support piece as required for the bent part on the first fixed terminal side. A lead consisting of a movable piece made of a magnetic material whose tip end is fixed to the supporting piece with a contact overlap margin of In manufacturing the switch, first electroless plating is applied to the proximal end of the movable piece in the state of parts, which will come into contact with the support piece after assembly, and each part is attached to both ends of the enclosure. The tube is assembled inside the open tube and both ends of the tube are heated and sealed, and then the electroless plating layer of the movable piece is heated at the same time as the distortion of the enclosure is removed through a heat treatment process to remove distortion of the enclosure. A method for manufacturing a reed switch, which comprises curing the reed switch.
JP2564480A 1980-03-01 1980-03-01 Manufacturing method of reed switch Expired JPS6028090B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2564480A JPS6028090B2 (en) 1980-03-01 1980-03-01 Manufacturing method of reed switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2564480A JPS6028090B2 (en) 1980-03-01 1980-03-01 Manufacturing method of reed switch

Publications (2)

Publication Number Publication Date
JPS56132731A JPS56132731A (en) 1981-10-17
JPS6028090B2 true JPS6028090B2 (en) 1985-07-03

Family

ID=12171534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2564480A Expired JPS6028090B2 (en) 1980-03-01 1980-03-01 Manufacturing method of reed switch

Country Status (1)

Country Link
JP (1) JPS6028090B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0478448A (en) * 1990-07-20 1992-03-12 Fujitsu Ltd Clean room

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5971211A (en) * 1982-10-14 1984-04-21 株式会社日立製作所 Method of heat treating sealed metal part and sealed electr-ic part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0478448A (en) * 1990-07-20 1992-03-12 Fujitsu Ltd Clean room

Also Published As

Publication number Publication date
JPS56132731A (en) 1981-10-17

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