JPS6026635A - Pb alloy for electrode for electroplating - Google Patents

Pb alloy for electrode for electroplating

Info

Publication number
JPS6026635A
JPS6026635A JP13519383A JP13519383A JPS6026635A JP S6026635 A JPS6026635 A JP S6026635A JP 13519383 A JP13519383 A JP 13519383A JP 13519383 A JP13519383 A JP 13519383A JP S6026635 A JPS6026635 A JP S6026635A
Authority
JP
Japan
Prior art keywords
electroplating
alloy
electrode
bath
sulfuric acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13519383A
Other languages
Japanese (ja)
Inventor
Nobukazu Suzuki
鈴木 信和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP13519383A priority Critical patent/JPS6026635A/en
Publication of JPS6026635A publication Critical patent/JPS6026635A/en
Pending legal-status Critical Current

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  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE:To obtain a Pb alloy showing superior durability in an electroplating bath contg. sulfuric acid and exerting no unfavorable influence on deposition on a cathode during electroplating even when a very small amount of the alloy is dissolved, by adding specified amounts of Ag and/or Sn and Bi to Pb. CONSTITUTION:The composition of this Pb alloy for an electrode for electroplating is composed of 0.1-5wt% in total of Ag and/or Sn, 0.1-5wt% Si and the balance Pb with inevitable impurities. An insoluble anode made of the Pb alloy shows superior durability in an electroplating bath contg. sulfuric acid, and it exerts no unfavorable influence on deposition on a cathode during electroplating even when a very small amount of the alloy is dissolved in the electroplating bath to contaminate the bath.

Description

【発明の詳細な説明】 本発明は、pb金合金特に電気メッキ電極用pb合金に
関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a pb gold alloy, particularly a pb alloy for electroplating electrodes.

一般に、金属材の電気メッキに際しては、電気メツキ浴
中にて、不溶性陽極を使用し、陰極たる被メツキ金属材
の表面に、Zn、 5nSNi、 FeおよびCu、さ
らにはこれらの合金などの金属を電気メッキすることが
行われている。このときの不溶性陽極としては、例えば
Pb製のものが使用されている。これはpbが電気メッ
キ浴に対して耐食性があり、がっメッキ処理時の通電に
よって、その表面に酸化鉛(以下、Pb。
Generally, when electroplating metal materials, an insoluble anode is used in an electroplating bath, and metals such as Zn, 5nSNi, Fe, Cu, and alloys thereof are applied to the surface of the metal material to be plated as a cathode. Electroplating is performed. As the insoluble anode at this time, for example, one made of Pb is used. This is because Pb has corrosion resistance against electroplating baths, and when electricity is applied during galvanizing, the surface is coated with lead oxide (hereinafter referred to as Pb).

2で示す)が形成し、このPbo2が不溶性陽極として
の機能を発揮するからである。
2) is formed, and this Pbo2 functions as an insoluble anode.

しかしながら、従来のpb部製不溶陽極は、表面に形成
したPbO2のpb基体に対する付着力が弱いため、必
ずしも満足する耐久性(使用寿命)を示さないことが判
明した。
However, it has been found that conventional insoluble anodes made of PB do not necessarily exhibit satisfactory durability (use life) because the PbO2 formed on the surface has weak adhesion to the PB substrate.

そこで、近年′、TtやNbなどの耐食性にすぐれた基
体の表面にPb0,2を被覆したpbo 2被覆不溶性
陽極や、pb基体に対するpbo2の付着力を高める目
的で、種々の合金成分を含有させた各種成分組成のpb
合金製不溶性陽極が提案されてきたが、前者のタイプの
不溶性陽極においては、主に内部歪が原因でpbo 2
被覆層が剥離しやすいと云う問題があり、また後者のタ
イプの不溶性陽極においては、い、ずれもとくに硫酸浴
系電気メッキ浴に使用した場合、必ずしもすぐれた耐久
性を示さないのが現状である。
Therefore, in recent years, PBO2-coated insoluble anodes have been developed in which the surface of a substrate with excellent corrosion resistance such as Tt or Nb is coated with Pb0,2, and various alloy components have been developed to increase the adhesion of PBO2 to the Pb substrate. PB of various component compositions
Insoluble anodes made of alloys have been proposed, but in the former type of insoluble anodes, the pbo 2
There is a problem that the coating layer easily peels off, and the latter type of insoluble anode does not necessarily exhibit excellent durability, especially when used in a sulfuric acid electroplating bath. be.

しかして、本発明の目的とするところは、上述のような
従来技術の欠点を解消した電気メツキ電極用材料、特に
硫酸系電気メツキ浴中で、被メツキ金属材の表面に電気
メツキ層を形成するのに使用した場合にすぐれた耐久性
を示す不溶性陽極用材料を提供することである。
SUMMARY OF THE INVENTION Therefore, the object of the present invention is to provide a material for electroplating electrodes that eliminates the drawbacks of the prior art as described above, and in particular, to provide a material for forming an electroplating layer on the surface of a metal material to be plated in a sulfuric acid-based electroplating bath. An object of the present invention is to provide an insoluble anode material that exhibits excellent durability when used for

そこで、本発明者らは、上述の目的を達成すべくpb合
金材料について研究を行ったところ、へg−Bi−Pb
系および5n−Bi−Pb系のpb金合金硫酸系電気メ
ッキ浴にすぐれた耐久性を示すとともに、微量の溶解が
あっても何ら陰極での電気メッキの析出に悪影響を及ぼ
さないことを見い出して本発明を完成した。
Therefore, the present inventors conducted research on pb alloy materials in order to achieve the above-mentioned purpose, and found that heg-Bi-Pb
It has been discovered that the Pb gold alloy of 5n-Bi-Pb type and 5n-Bi-Pb type pb gold alloys exhibits excellent durability in sulfuric acid-based electroplating baths, and even a small amount of dissolution does not have any adverse effect on electroplating deposition at the cathode. The invention has been completed.

ここに、本発明の要旨とするところは、重量%で、Ag
およびSnの1種または2種を合計で0.1〜5,0%
、Bi:0.1〜5.0%、残部pbおよび不可避的不
純物からなる組成を有する電気メッキ電極用Pb合金で
ある。
Here, the gist of the present invention is that Ag
and one or two types of Sn in a total of 0.1 to 5.0%
, Bi: 0.1 to 5.0%, the balance being Pb and inevitable impurities.

なお、「電気メツキ電極」とは、例えば、メッキ前処理
としての電解清浄処理用の電極をも包含することは当業
者にはすでに明らかであろう。
It should be noted that it is already clear to those skilled in the art that the term "electroplating electrode" includes, for example, an electrode for electrolytic cleaning treatment as a pretreatment for plating.

本発明において合金組成を以上の如く規定した理由を次
に説明する。
The reason why the alloy composition is defined as above in the present invention will be explained below.

Agは硫酸酸性溶液におけるpb熔出を防止するために
添加するものであって、0.1%未満では効果はなく、
一方、5.0%を越えるとその効果は飽和してしまい、
それ以上の改善は見られない上、むしろ材料コストを上
昇させてしまう。したがって、本発明にあって、Agは
0.1〜5.0%に制限する。
Ag is added to prevent PB dissolution in a sulfuric acid solution, and if it is less than 0.1%, it has no effect.
On the other hand, if it exceeds 5.0%, the effect will be saturated,
No further improvement is seen, and on the contrary, the material cost increases. Therefore, in the present invention, Ag is limited to 0.1 to 5.0%.

Biもpbの溶出防止のために添加するのであって、0
.1%未満ではその効果がなく、一方、5.0%を越え
ても余り顕著な改善効果は見られず、むしろ材料コスト
を上昇させ、さらにはpbの機械的特性を低下させ、成
形加工が困難になるため、本発明にあってはBiの添加
量は0.1〜5.0%に制限する。
Bi is also added to prevent the elution of PB, and 0
.. If it is less than 1%, there is no effect, and on the other hand, if it exceeds 5.0%, no significant improvement effect is seen, but rather increases the material cost, further reduces the mechanical properties of PB, and makes the molding process difficult. Therefore, in the present invention, the amount of Bi added is limited to 0.1 to 5.0%.

SnはAgに代えて添加してもよく、その効果はAgに
均等である。ただ゛し、0.1%未満では効果がなく、
一方、5.0%を越えるとその効果は飽和してしまう。
Sn may be added instead of Ag, and its effect is equivalent to that of Ag. However, it is ineffective if it is less than 0.1%.
On the other hand, if it exceeds 5.0%, the effect will be saturated.

本発明ではAgとSn−とを添加する場合、合計で0.
1〜5.0%に制限する。
In the present invention, when Ag and Sn- are added, the total amount is 0.
Limit to 1-5.0%.

このように、本発明に係るPb合金でもって構成した不
溶性陽極は、硫酸系電気メッキ浴においてすぐれた耐久
性を示すと共に、たとえ微量の溶解により電気メッキ浴
を汚染したとしても、陰、極での電気メッキの析出に何
ら悪影響は及ぼさないのである。
As described above, the insoluble anode made of the Pb alloy according to the present invention exhibits excellent durability in a sulfuric acid-based electroplating bath, and even if a small amount of dissolution contaminates the electroplating bath, it can be used as a cathode or electrode. It does not have any adverse effect on the electroplating deposition.

以下、本発明を実施例によってさらに詳述するが、各実
施例は単に本発明の例示のために示すのであって、それ
らによって本発明が制限されることはない。
EXAMPLES Hereinafter, the present invention will be explained in more detail with reference to examples, but each example is merely shown for illustrating the present invention, and the present invention is not limited thereto.

爽施桝上 通常の溶解法にて、第1表に示される成分組成をもった
Pb合金溶湯を調整し、鋳造し、次いで、圧延にて厚さ
1龍の板材とした。このようにして得た板材より厚さ1
議璽、IJ30龍、長さ100m勇の寸法をもった試験
片を切出し、この試験片を陽極とし、電解面積を12 
、5 caとした。一方、陰極には上記陽極と同寸法の
pt板材を用い、これら両板材を、Na 2 SO4を
100 g /βの割合で熔解した硫酸酸性芒硝溶液(
pH−2)中に浸漬し、浴温70℃、印加電流10A 
(電流密度80 A/dm2) 、通電時間100時間
の条件下で電解試験を行った。試験後、Na1l(を1
60g / I−およびグリコースを200g/l熔解
した水溶液中にこれらの試験片を浸漬して試験片の電解
面の酸化皮膜を除去した。このときの試験片の重量減か
ら前記試験片の単位電気量当りの重量減を測定した。こ
れらの測定結果を併せて第1表に示した。
A Pb alloy molten metal having the composition shown in Table 1 was prepared using a conventional melting method and cast, and then rolled into a plate having a thickness of 1 mm. The thickness of the plate material obtained in this way is 1
A test piece with a length of 100 m was cut out, and this test piece was used as an anode, and the electrolytic area was 12
, 5 ca. On the other hand, a PT plate with the same dimensions as the anode was used for the cathode, and both plates were heated with a sulfuric acid-based mirabilite solution in which Na 2 SO4 was dissolved at a ratio of 100 g/β.
pH-2), bath temperature 70°C, applied current 10A.
(Current density: 80 A/dm2) and a current application time of 100 hours. After the test, Na1l (1
These test pieces were immersed in an aqueous solution in which 60 g/I- and 200 g/l of glycose were dissolved to remove the oxide film on the electrolytic surface of the test pieces. From the weight loss of the test piece at this time, the weight loss per unit electricity of the test piece was measured. These measurement results are also shown in Table 1.

また、第1表に示される測定結果にもとずいて、第1図
にAgおよびBi含有量と試験片の重量減との関係を、
そして第2図にSnおよびBi含有量と試験片の重量減
との関係をそれぞれグラフで示した。
Based on the measurement results shown in Table 1, Figure 1 shows the relationship between the Ag and Bi contents and the weight loss of the test piece.
FIG. 2 graphically shows the relationship between the Sn and Bi contents and the weight loss of the test piece.

これらの結果からも分かるように、Biおよび醜または
Snの添加量の増加に伴って溶解重量減は著しく低下し
ているのが分かる。
As can be seen from these results, it can be seen that as the amounts of Bi and Sn added increase, the weight loss due to dissolution decreases significantly.

爽土皿1 本例は、本発明に係るPb合金の代表的成分組成である
実施例1における試験阻16のAg 1%、Bi 5%
を含有するPb合金および比較の目的で同じく試験No
、13のAg 1%のみを含有する比較用Pb合金をそ
れぞれ用い、炭素鋼板の表面に約101の厚さにホモケ
ン加工によりこれらのPb合金を肉盛することにより、
電気メツキ用不溶性陽極を製造し、次いで、これらの不
溶性陽極を、実際の製造ラインの電気メツキ槽に適用し
、亜鉛メッキを実施した。
Sodo dish 1 This example shows the typical composition of the Pb alloy according to the present invention, 1% Ag, 5% Bi of test sample 16 in Example 1.
and for comparison purposes also test No.
, 13 and 13 containing only 1% of Ag, and by overlaying these Pb alloys on the surface of a carbon steel plate to a thickness of about 101 by Homoken processing,
Insoluble anodes for electroplating were manufactured, and then these insoluble anodes were applied to an electroplating bath on an actual production line to carry out galvanizing.

亜鉛メッキの浴組成は、Zn304400g/ R、N
a 2 S。
The bath composition for galvanizing is Zn304400g/R,N
a2S.

a75g/I11浴のpllは1.8〜2.2、浴の温
度は50±5℃とし、被メツキ金属材には冷延鋼板を用
い、電流密度は40〜6〇八/dm2とした。
The pll of the a75g/I11 bath was 1.8 to 2.2, the bath temperature was 50±5°C, a cold rolled steel plate was used as the metal material to be plated, and the current density was 40 to 608/dm2.

これらの条件下で亜鉛メッキを継続し、6ケ月経過後に
おける前記不溶性陽極の平均消耗深さを測定した。その
結果、本発明に係る合金を用いたものは平均0.8 m
+a/A、Ilrおよび前記の比較用Pb合金を用いた
ものは、平均3.0 龍/A、Hrの電極重量減を示し
た。
Zinc plating was continued under these conditions, and the average depth of wear of the insoluble anode was measured after 6 months had passed. As a result, those using the alloy according to the present invention averaged 0.8 m
+a/A, Ilr and those using the comparative Pb alloy described above showed an average electrode weight loss of 3.0 A/A, Hr.

本発明に係るPb合金から作った不溶性陽極は、比較用
電極に比してすぐれた耐久性を示した。なお、その間の
亜鉛メッキへの悪影響は何ら観察されなかった。一方、
比較用の電極の場合、メッキ層に不均一析出部分がみら
れた。
The insoluble anode made from the Pb alloy according to the present invention showed superior durability compared to the comparison electrode. Note that no adverse effect on galvanizing was observed during this period. on the other hand,
In the case of the comparative electrode, non-uniform deposits were observed in the plating layer.

第1表 (次頁へつづく) (第1表のつづき) (次頁へつづく) (第1表のつづき) (注)*発明例Table 1 (continued on next page) (Continued from Table 1) (continued on next page) (Continued from Table 1) (Note) *Invention example

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、AgおよびBiの添加量と電極重量減との関
係を示すグラフ;および 第2図は、同じ<SnおよびBiの添加量と電極重量減
との関係を示すグラフである。 出願人 住友金属工業株式会社 代理人 弁理士 広 瀬 章 − 幕!図 εt (η) 乙°2図 Bi(γ)
FIG. 1 is a graph showing the relationship between the added amounts of Ag and Bi and the electrode weight loss; and FIG. 2 is a graph showing the relationship between the added amounts of Sn and Bi and the electrode weight loss. Applicant Sumitomo Metal Industries Co., Ltd. Agent Patent Attorney Akira Hirose − Maku! Figure εt (η) Otsu°2 Figure Bi (γ)

Claims (1)

【特許請求の範囲】[Claims] 重量%で、八gおよびSnの1種または2種合針で0.
1〜5.0 %、Bi : 0.1〜5.0 %、残部
pbおよび不可避的不純物からなる組成を有する電気メ
ッキ電極用pb合金。
In terms of weight %, 8g and Sn or 2 types of needles are 0.
A PB alloy for electroplating electrodes having a composition of 1 to 5.0% Bi, 0.1 to 5.0% Bi, and the balance PB and unavoidable impurities.
JP13519383A 1983-07-26 1983-07-26 Pb alloy for electrode for electroplating Pending JPS6026635A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13519383A JPS6026635A (en) 1983-07-26 1983-07-26 Pb alloy for electrode for electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13519383A JPS6026635A (en) 1983-07-26 1983-07-26 Pb alloy for electrode for electroplating

Publications (1)

Publication Number Publication Date
JPS6026635A true JPS6026635A (en) 1985-02-09

Family

ID=15146013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13519383A Pending JPS6026635A (en) 1983-07-26 1983-07-26 Pb alloy for electrode for electroplating

Country Status (1)

Country Link
JP (1) JPS6026635A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6396299A (en) * 1986-10-13 1988-04-27 Yoshizawa Kiko Toubu Kk Insoluble anode made of lead alloy

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6396299A (en) * 1986-10-13 1988-04-27 Yoshizawa Kiko Toubu Kk Insoluble anode made of lead alloy
JPH0125398B2 (en) * 1986-10-13 1989-05-17 Yoshizawa Kiko Tobu Kk

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