JPS60257227A - 接合状態検出方法及び装置 - Google Patents

接合状態検出方法及び装置

Info

Publication number
JPS60257227A
JPS60257227A JP11296084A JP11296084A JPS60257227A JP S60257227 A JPS60257227 A JP S60257227A JP 11296084 A JP11296084 A JP 11296084A JP 11296084 A JP11296084 A JP 11296084A JP S60257227 A JPS60257227 A JP S60257227A
Authority
JP
Japan
Prior art keywords
laser
inspected
optical system
inspection
speckle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11296084A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0455099B2 (https=
Inventor
Takashi Hiroi
高志 広井
Takanori Ninomiya
隆典 二宮
Yasuo Nakagawa
中川　泰夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11296084A priority Critical patent/JPS60257227A/ja
Priority to US06/707,501 priority patent/US4641527A/en
Publication of JPS60257227A publication Critical patent/JPS60257227A/ja
Publication of JPH0455099B2 publication Critical patent/JPH0455099B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP11296084A 1984-06-04 1984-06-04 接合状態検出方法及び装置 Granted JPS60257227A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11296084A JPS60257227A (ja) 1984-06-04 1984-06-04 接合状態検出方法及び装置
US06/707,501 US4641527A (en) 1984-06-04 1985-03-04 Inspection method and apparatus for joint junction states

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11296084A JPS60257227A (ja) 1984-06-04 1984-06-04 接合状態検出方法及び装置

Publications (2)

Publication Number Publication Date
JPS60257227A true JPS60257227A (ja) 1985-12-19
JPH0455099B2 JPH0455099B2 (https=) 1992-09-02

Family

ID=14599842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11296084A Granted JPS60257227A (ja) 1984-06-04 1984-06-04 接合状態検出方法及び装置

Country Status (1)

Country Link
JP (1) JPS60257227A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2241878A2 (de) 2009-04-15 2010-10-20 Göpel electronic GmbH Verfahren zur Inspektion von Lötstellen an elektrischen und elektronischen Bauteilen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2241878A2 (de) 2009-04-15 2010-10-20 Göpel electronic GmbH Verfahren zur Inspektion von Lötstellen an elektrischen und elektronischen Bauteilen

Also Published As

Publication number Publication date
JPH0455099B2 (https=) 1992-09-02

Similar Documents

Publication Publication Date Title
US4641527A (en) Inspection method and apparatus for joint junction states
US6118525A (en) Wafer inspection system for distinguishing pits and particles
KR100283834B1 (ko) 반도체칩의 본딩방법 및 그 장치
JP7390680B2 (ja) レーザ溶接品質検査の方法及びレーザ溶接品質検査装置
EP0943088B2 (en) Wafer inspection system for distinguishing pits and particles
Liu et al. A novel approach for flip chip solder joint quality inspection: Laser ultrasound and interferometric system
JP7373874B2 (ja) 不良検出装置及び不良検出方法
JPS6085363A (ja) 接合状態検出方法及びその装置
JPS60257227A (ja) 接合状態検出方法及び装置
JPH01113638A (ja) 認識装置
JPH01101475A (ja) 導通形成検査装置
JP4040777B2 (ja) 異物検査装置
JPS627200A (ja) 接合状態検出装置
JPS61240105A (ja) 接合状態検出方法
JPS62133341A (ja) はんだ付部検査装置
JPS6165175A (ja) 回路部品端子の接合状態検査方法とその装置
JPH03186739A (ja) 磁気ディスク基板の外周端部損傷の検出回路
JPS63177045A (ja) 実装済プリント基板自動検査装置における半田フヌレ検出方式
JP3336392B2 (ja) 異物検査装置及び方法
JPH1194782A (ja) 非接触半田付け検査方法及びその装置
JPS627198A (ja) 接合状態検出装置
JPH03249549A (ja) はんだ接合状態検査方法
JP2939876B2 (ja) 実装済プリント基板検査装置における判定基準自由設定方法
JPS59147206A (ja) 物体形状検査装置
JPH08264605A (ja) 積層基板の検査方法、およびこれを用いたｓｏｉウェハ、このｓｏｉウェハを用いた半導体集積回路装置、ならびに積層基板の検査装置