JPS60257158A - Semiconductor refrigerator - Google Patents

Abstract

PURPOSE:To reduce a wiring inductance to elements by a method wherein, when a laminated body comprising switching elements and diodes is immersed in refrigerant in an enclosed container for ebullition and condensation, the laminated body is divided to locate the side of part comprising the switching elements on the position adjacent to the terminal leading out part provided in the container. CONSTITUTION:Diodes 4, 4' and gate turn off thyristors 3, 3' respectively connected in series are contained in an enclosed container 12 while refrigerant 13 filled therein is communicated with a condenser 15 through a communicating tube 14 to the ebullition and condensation of the refrigerant 13 for refrigerating the contrained elements. In such a constitution, the thyristors 3, 3' and the diodes 4, 4' are respectively composed of the first laminated body S1 and the second laminated body S2 with the first laminated body S1 approaching to a terminal fitting surface 18. Through these procedures, the thyristor groups may approach to snubber circuit comprising a diode 5 and a condenser 6 outside the container 12 to reduce the wiring inductance without containing the snubber circuit in the container 12.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to semiconductor devices such as inverter devices and chopper devices, and particularly to a semiconductor cooling device suitable for semiconductor devices requiring a snubber circuit.

[Background of the invention]

UTo is used for semiconductor devices such as inverter devices.

8CJ) A large number of semiconductor elements including switching elements such as transistors and diodes are used, but these elements often require some kind of cooling means.

Figure 2 shows an example of an inverter device, which converts DC power supplied via a filter capacitor 1 into three-phase AC power and supplies it to an induction motor 2, using a GTO as a switching element. 3,3'
is GTo, 4.4' is freewheel diode, 5.5
' is the resistance of the snubber circuit, 6.6' is the capacitor of the snubber circuit, 7.7' is the resistance of the snubber circuit, 8 is the reactor for limiting current when a phase is shorted, and 9 is the reactor 8 when cutting off the current.
This diode is used to circulate the current. Incidentally, although the above has been shown only for the U phase, the ■ phase and the W phase have exactly the same configuration.

The main emission +li in such semiconductor devices is
i has G'l'o3,3/ and tie oto4,4'te,
Therefore, in such a device, it is sufficient to apply some kind of cooling means only to these δGTOs and diodes.

Incidentally, in recent years, the so-called Buddha cooling method has been widely adopted in VC for cooling such semiconductor devices.

Fig. 3 shows an example of a conventional example in which a rhythmic boiling method is applied to the inverter device shown in Fig. 2, where 12 is a closed container, 13 is a vinegar solution, 14 is a connecting pipe, and 15 is a condenser. ,1
6 is a terminal, 17 is a binding body, 18 is a terminal mounting surface, and 19 is a fin. Note that S represents a stack of semiconductor elements.

The sealed container 12 is provided independently for each phase ([J, V, W) of the inverter device, as shown by the broken line in FIG.
A stacked body S including tjTO3, 3', diodes 4°4', 9, and a cooling piece 19 is housed inside, and a fluorocarbon 113 (
A predetermined refrigerant liquid 13 such as part name) is sealed and immersed.

Therefore, when the temperature of the laminate S rises due to the heat generated by these G 'l' 0, heat is given to the refrigerant liquid 13, and this refrigerant /&13 boils, so that the laminate S becomes 1 = 1
The vapor evaporated from the refrigerant liquid 13 by boiling is transferred from the connecting pipe 14 to the condenser 15.
It enters the connecting pipe 14, is cooled by the outside air, and then returns to the connecting pipe 14.
Urine comes from Therefore, by this continuous cycle, semiconductor elements such as (jTO) are efficiently cooled.

Next, in the conventional example shown in FIG. 3, in addition to the laminated body S, the snubber circuit diode 5.5',
Capacitors 6 and 6' are also housed together.

However, as mentioned above, these do not require any particular cooling.

However, the reason why these are housed in the closed container 12 is as follows. In other words, the snubber circuit is to protect G'l'03, 3', and therefore the diode 5.5' and capacitor 6.6' are connected between the terminals of GTO3, 3'. Unless they are connected by the shortest connection path, there is no f[.

In other words, as the connection lines from diodes 5, 5' and capacitors 6.6' to connection points a and b or C and d in FIG. This is because the snubber circuit cannot sufficiently absorb the high voltage generated when the current is cut off (thus, the protective function cannot be obtained).

Therefore, we will now introduce diodes 5 and 5 for these snubber circuits.
If the capacitors 6 and 6 are not housed in the sealed container 12, the external diodes 5 and 5' and the capacitors 6 and 6 are connected to a'r03 through the terminals 16, as shown in FIG. , 3/, therefore,
For example, as shown in FIG. 4, GTO3,3 in the stack S
Even if the position of ' is moved toward the terminal 16, the length of the wiring between them will become longer as shown by Ll, and a sufficient protective function will not be obtained, which is the reason for the third This is why in the conventional example shown in the figure, the diodes 5, 5' and the capacitor 6#6' are housed together with the laminate S in the closed container 12.

Incidentally, the pressure inside the closed container 12 in such a semiconductor cooling device constantly fluctuates from a substantially vacuum state at low temperatures to several atmospheres at high temperatures.

Therefore, all the elements and parts housed in this container must be able to withstand the above-mentioned pressure changes.

However, in semiconductor devices and the like, there are almost no problems caused by such pressure fluctuations, or general capacitors are not designed to withstand such pressure fluctuations. Therefore, in the conventional example shown in FIG. 3, it is necessary to use capacitors 6, 6' of special specifications.

Further, capacitors have a property that their electric current resistance decreases in a reduced pressure atmosphere, and for this reason, in the conventional example shown in FIG. 3, it is necessary to use capacitors 6 and 6' that have a sufficient margin in voltage resistance.

Furthermore, in the conventional example shown in FIG. 3, not only the laminate S but also the capacitors 6 and 6' must be accommodated, so the closed container 12 requires a large volume.

As a result of the above, in the conventional example shown in Figure 3 above, the capacitor for the snubber circuit requires a special specification, it also needs to have sufficient margin for its withstand voltage, and in addition, the sealed container becomes large. Therefore, the disadvantage was that the cost was likely to increase.

Furthermore, in Japan, a sealed container that generates a considerable amount of internal pressure is legally regulated as a pressure vessel if its internal volume exceeds a predetermined size. If containers are subject to such legal regulations, their costs will rise significantly.

Therefore, if the capacitor for the snubber circuit is housed in a sealed container as in the conventional example described above, the volume of the sealed container will increase by that amount, and if this capacitor is not housed, it will not be damaged. This has the disadvantage that it may result in legal restrictions being imposed.

Therefore, proposals have been made to eliminate such drawbacks of the conventional examples, and one example is the invention of Japanese Patent Application Laid-open No. 10248/1983.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned concerns, and its purpose is to provide a simple structure with a sufficiently short wiring length even if the capacitor for the snubber circuit is provided outside the sealed container. An object of the present invention is to provide a semiconductor cooling device that can perform the following steps.

[Summary of the invention]

In order to achieve this object, the present invention has a structure in which the laminate of the semi-solid element is divided into two parts, and the side of one of the laminates is attached close to the terminal pull-out part in the airtight container. is a sexual characteristic.

[Embodiments of the invention]

EMBODIMENT OF THE INVENTION Hereinafter, the semiconductor cooling device according to the present invention will be explained in detail with reference to illustrated embodiments.

FIG. 1 shows the disaster application Vu of the present invention, and in this figure, Sl
indicates the first laminate, S1 indicates the @2 laminate, and other symbols indicate the same threads as in the conventional example shown in FIG.

The 8+41 laminate S is a stack of the GTOs 3, 3' and the cooling piece 19, and is held in the hermetic container 12 so that its sides are sufficiently close to the terminal mounting surface 18 of the hermetic container 12. ing.

The second M noodle body S2 has a diode 4.4' and 9;
The cooling pieces 19 are stacked together, and the first 8 and the cooling pieces S are held side by side in the closed container 12.

As a result, the wiring from 1.1TO3, 3' to the outside can be led out almost as is, just via the terminal 16, and the diodes 5, 5' of the snubber circuit and the capacitor 6.
Even if the capacitor 6' is provided outside the sealed container 12, the wiring length for it can be made the shortest distance as shown in the figure. Therefore, according to the embodiment, the capacitor 6. Despite being installed outside of 12, GTO3,3'
The wiring inductance between the snubber circuit and the snubber circuit can be suppressed to a sufficiently low level, and the GTOs 3 and 3' can be reliably protected.

In the embodiment shown in Fig. 1, the stacking directions of the valleys and increases S1 and S are vertical, and that is, the disc-shaped GTO, diode, cooling plate, etc. are horizontal. Although they are housed in a closed container 12 in a closed state, consideration may be given so that these bodies S1 + S2 are arranged horizontally and qTO, etc. are arranged vertically.

In addition, in the above embodiment, only the case where the switching element that can safely be used as a snubber circuit is V is shown, but it goes without saying that it can also be implemented as a switching element such as an SCR or a transistor. .

〔Effect of the invention〕

As explained above, according to the present invention, the inductance of the external wiring for the switching system integrated with the ram can be kept sufficiently small, so that it can be installed outside the continuous airtight container for the snubber circuit. As a result, large fluctuations in ambient air pressure relative to the snubber circuit capacitor are eliminated, so there is no need for special specifications or cylinder pressure, and a small, low-cost capacitor can be used.

Further, according to the present invention, since there is no need to house the condensate droplet for the snubber circuit in the sealed container together with the laminate, the sealed container can be made smaller and does not need to be regulated as a pressure vessel. In this respect, lower costs can be expected.

Furthermore, since there is no need to place the capacitor in a refrigerant liquid that becomes relatively high temperature, there is less risk of deterioration of the capacitor, and high reliability can be easily obtained.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing an embodiment of a semiconductor cooling device according to the present invention, Fig. 2 is a circuit diagram of an inverter device which is an example of the application of the present invention, and Fig. 3 shows a conventional example of a semiconductor cooling device. The sectional view, FIG. 4, is an explanatory view of the problems of the conventional example. 3.3'...<iTo, 4.4', g...
···diode. 5.5'... Diode for snubber circuit, 6.6
'... Capacitor for snubber circuit, 12...
... Airtight container, 13 ... Refrigerant liquid, ]5 ...
・・Sizing device, 16・・・・・・Terminal, 18・・・・・・
Terminal mounting surface, 19...Cooling piece #51aSt・
...Laminated body. Figure 1 5

Claims (1)

[Claims] 1. Immerse a semiconductor element including a switching element and a diode in a refrigerant liquid in a closed container, and boil the refrigerant liquid. In a semiconductor cooling device that performs cooling by compression, the laminate is divided into a first 4"k laminate portion that houses the switching element and a second 4"k laminate portion that includes the diode. A semiconductor cooling device characterized in that the laminate portion of No. 1 is disposed such that its side portion is located near a terminal pull-out portion formed in the airtight container. 2. Claim 1: V In this case, the first laminate part and the second laminate part are arranged such that their sides face each other, and the wall surface on which the terminal pull-out part of the sealed container is formed and the above-mentioned A semiconductor cooling device characterized in that the semiconductor cooling device is arranged so that the side portions of the first laminate portion are parallel to each other.