JPS60254534A - Manufacture of cathode - Google Patents
Manufacture of cathodeInfo
- Publication number
- JPS60254534A JPS60254534A JP11044084A JP11044084A JPS60254534A JP S60254534 A JPS60254534 A JP S60254534A JP 11044084 A JP11044084 A JP 11044084A JP 11044084 A JP11044084 A JP 11044084A JP S60254534 A JPS60254534 A JP S60254534A
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- emitter
- photosensitive adhesive
- cathode cap
- emitter material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/04—Manufacture of electrodes or electrode systems of thermionic cathodes
- H01J9/042—Manufacture, activation of the emissive part
Abstract
Description
【発明の詳細な説明】
産１−Ｅ０利Ｊじ辷旺
この発明はカソードの基体上にエミッタ物質を被着する
方法に関する。DETAILED DESCRIPTION OF THE INVENTION This invention relates to a method of depositing an emitter material onto a cathode substrate.
従米勿肢血
陰極線管の電子銃に使用されるカソードにはカソードキ
ャンプ（基体）外面にエミッタ物質を被着しヒータで間
接的に加熱する傍熱型のものや、ヒータに直接的に固定
した基体にエミッタ物質を被着した直熱型のものがある
。このようなカソードの一例を第５図を参照して説明す
ると、（１）は有底円筒状制御電極、（２）は制御電極
（１）内に収納された傍熱型カソードである。カソード
（２）は両端開口の金属製スリーブ（°３）と、スリー
ブ（３）の先端外周に被嵌固定された金属製カソードキ
ャップ（４）と、スリーブ（３）の後端外周に溶接され
た金属製筒状体（５）と、筒状体（５）の外周に突設し
たエンボス（６）＜６）で同軸状にかしめ固定された耐
熱性絶縁材よりなるリング状のインシュレータ（７）と
、カソードキャップ（４）土に被着されたエミッタ物質
（８）と、筒状体（５）に一端が溶接されたカソード引
出しり一ト（９）と、スリーブ（３）内に収納されたヒ
ータ（１０）で構成される。The cathodes used in the electron guns of Jumei Mushoku cathode ray tubes are of the indirectly heated type, in which an emitter material is coated on the outer surface of the cathode camp (substrate) and heated indirectly with a heater, or the cathode is directly fixed to the heater. There is a direct heating type in which an emitter material is coated on the base. An example of such a cathode will be described with reference to FIG. 5. (1) is a bottomed cylindrical control electrode, and (2) is an indirectly heated cathode housed within the control electrode (1). The cathode (2) is made of a metal sleeve (°3) with openings at both ends, a metal cathode cap (4) fitted and fixed to the outer circumference of the tip of the sleeve (3), and welded to the outer circumference of the rear end of the sleeve (3). A ring-shaped insulator (7) made of a heat-resistant insulating material coaxially caulked and fixed with an embossing (6) <6) protruding from the outer periphery of the cylindrical body (5). ), a cathode cap (4), an emitter material (8) deposited on the soil, a cathode drawer (9) one end welded to the tubular body (5), and a sleeve (3) housed in the emitter material (8). It consists of a heater (10).
尚、（１１）ば制御電極（１）内でのカソード（２）の
位置決めを行ろスペーサ、（１２）は制御電極（１）内
でカソード（２）を固定するリテーナである。Note that (11) is a spacer for positioning the cathode (2) within the control electrode (1), and (12) is a retainer that fixes the cathode (2) within the control electrode (1).
カソード（２）のエミッタ物質（８）の被着形成は第６
図に示すようにカソードキャップ（４）を取付けたスリ
ーブ（３）をインシュレータ（７）を固定した筒状体（
５）に挿入して固定したサブアッセンブル体（１３）を
治具（１４）の上面に形成された複数の穴（１５） （
１５Ｌ−の１つ１つに１個ずつ位置決め収納し、この各
サブアッセンブル体（１３） （１３）−上にカソード
キャップ（１４） （１，４）−のみを露出さゼ°る穴
（１６） （１６）・−を有するプレート（１７）を被
せた状態で、プレー） （１７）の上方から穴（１６）
（１（３）−に露呈した各カソードキャップ（４）（４
） −上にエミッタ物質（８）をバインダに混和させた
混合液をスプレー法にて塗布する方法で行っている。The deposition of the emitter material (8) on the cathode (2) is carried out in the sixth step.
As shown in the figure, the sleeve (3) to which the cathode cap (4) is attached is attached to the cylindrical body (to which the insulator (7) is fixed).
The sub-assembly body (13) inserted and fixed in the jig (14) has a plurality of holes (15) (
A hole (16) is positioned and stored in each of the subassemblies (13) (13) to expose only the cathode cap (14) (1,4). ) (16) - Cover the plate (17) with holes (16) from above (17).
(1 (3) - each exposed cathode cap (4) (4
) - A mixed solution in which the emitter substance (8) is mixed with a binder is applied onto the surface by a spray method.
溌ＪＩ帆解迭ユ。（ｙ債、１■
ところで上記スプレー法は設備的作業的に簡単であるが
、プレート（１７）の上面全域にエミッタ物質混合液が
塗布されてそのごく一部がカソードキャップ（４）（４
）・・−上に塗布されることになり、而もプレー） （
１７）上に液状のものが強く吹き付けられて被着してい
るため、プレート（１７）上からのエミッタ物質の回収
が難しく、且つ回収しても異物の混合が多くて再使用で
きなく、エミッタ物質のカソード製造上の無駄が極めて
多い問題があった。またカソードキャップ（４）（４）
−上でエミッタ物質粒子が団塊状に凝集してみかけ粒度
が悪く平面度が良好でないことがあり、その結果カソー
ド（２）と制ｆｌ電極（１）間の距離（ＧＫ間隔）が一
定化せず、電子銃の動作特性のばらつきを生し、陰極線
管の解像度の低下を招くことがあった。溌JI 迭迭ゆう. (y bond, 1■ By the way, the above spray method is simple in terms of equipment and work, but the emitter substance mixture is applied to the entire upper surface of the plate (17), and a small portion of it is applied to the cathode cap (4) (4).
)...− will be applied on top, and will also play) (
17) It is difficult to collect the emitter material from the plate (17) because a liquid substance is strongly sprayed onto the plate (17), and even if it is collected, there are many foreign substances mixed in, making it impossible to reuse the emitter material. There was a problem in that there was a large amount of wasted material in the production of cathodes. Also cathode cap (4) (4)
- The emitter material particles may aggregate into nodules on the upper surface, resulting in poor apparent particle size and poor flatness. As a result, the distance (GK spacing) between the cathode (2) and control fl electrode (1) may not be constant. First, it caused variations in the operating characteristics of the electron gun, leading to a decrease in the resolution of the cathode ray tube.
鵬犯す玉去及勿王政
本発明は上記問題点に鑑み提案されたもので、カソード
キャンプ上にエミッタ物質を簡単な設備で平面度良く、
且つエミッタ物質の無駄を最小限にして被着形成するこ
とを目的とし、この目的を達成するためにカソードキャ
ンプ外面に感光性粘着物質を塗布する工程、この塗布さ
れた感光性粘着物質を露光し粘着性を発現させる工程、
この粘着性を発現した感光性粘着物質上に粉末状エミッ
タ物質を被着さぜるニー程を含むことを特徴とする製造
方法を提供する。The present invention was proposed in view of the above-mentioned problems, and it is possible to place an emitter material on a cathode camp with simple equipment and with good flatness.
In addition, the purpose is to deposit the emitter material with minimal wastage, and to achieve this purpose, a process of applying a photosensitive adhesive material to the outer surface of the cathode camp, and exposing the applied photosensitive adhesive material to light. A step of developing adhesiveness,
The present invention provides a manufacturing method characterized by including a knee step of depositing a powdered emitter material on the photosensitive adhesive material that has developed tackiness.
作朋
このような本発明の方法によると、カソードキャップ上
の粘着性を有する感光性粘着物質上にエミッタ物質粉末
を振りかけてから、感光性粘着物質に接着さていない余
分なものを吹き飛ばす等すれば簡単に平面度良く被着形
成でき、而もエミッタ物質粉末の余分なものは簡単に回
収でき、この場合回収したものへの異物混入は極めて少
く゛ζ再使用を０Ｉ能にする。According to the method of the present invention, emitter material powder is sprinkled onto the sticky photosensitive adhesive material on the cathode cap, and then the excess material that is not adhered to the photosensitive adhesive material is blown off. It can be easily deposited and formed with good flatness, and excess emitter material powder can be easily recovered.In this case, the amount of foreign matter mixed into the recovered material is extremely small, making it possible to reuse it.
災旌拠
本発明を第５図に示すカソード（２）に適用し、第１図
乃輩第４回の工程図に基づき以下説明する。Disaster relief The present invention will be applied to the cathode (2) shown in FIG. 5, and will be explained below based on the process diagram of FIG. 1, Part 4.
先ず第１図に示すようにカソードキャップ（４）、スリ
ーブ（３）、筒状体（５）、インシュレータ（７）の一
体物のサブアッセンブル体（１３）を用窓し、これのカ
ソードキャップ（４）上に感光性粘着物質（１８）を薄
く等厚に塗布する。次に塗布した感光性粘着物質（１日
）を露光して粘着性を発現させる。この露光は例えば第
２図に示すようにセブアッセンブル体（１３）の複数個
を従来同様の治具（１４）の穴（１５） （１５）・・
−に収納してプレート（７）を被せた状態で複数個一括
して行う。次に第３図に示すようにプレート（７）上に
エミッタ物質粉末（８”）を振りかけ、一部をプレート
（１７）の穴（１６） （１６）−・−から露呈する露
光済み感光性粘着物質（１Ｂ） （１Ｂ）−上に振りか
けて接着させる。十分にエミッタ物質粉末（８゛）の振
りかけが完了すると、次はプレート（１７）上をエアー
プロー等してプレート（１７）上のエミッタ物質粉末（
８′）及び粘着物質（１Ｂ） （１Ｂ）−上の余分なエ
ミッタ物質（８゛）を吹き飛ばして第４図に示すように
粘着物質（１Ｂ） （１８Ｌ−上に直接接着された所望
のエミッタ物質（８゛）のみを残す。この残ったエミッ
タ物質（８゛）はほぼ等厚な状態になる。後は赤外線ラ
ンプによる加熱等による処理にてカソードキャンプ（４
）上のエミッタ物質粉末（８′）を焼き締めれば所望の
平面度良好なエミッタ物質（８）が形成される。First, as shown in Fig. 1, a sub-assembly body (13) consisting of a cathode cap (4), a sleeve (3), a cylindrical body (5), and an insulator (7) is prepared, and its cathode cap ( 4) Apply the photosensitive adhesive material (18) thinly and equally thickly on top. Next, the applied photosensitive adhesive material (1 day) is exposed to light to develop adhesiveness. For example, as shown in FIG. 2, this exposure is carried out by attaching multiple pieces of the assembly body (13) to holes (15) (15) of a jig (14) similar to the conventional one.
- Store multiple pieces at once and cover them with the plate (7). Next, as shown in Figure 3, emitter material powder (8'') is sprinkled on the plate (7), and a portion of the exposed photosensitive material is exposed through the holes (16) (16) of the plate (17). Adhesive substance (1B) (1B) - Sprinkle it on top to make it adhere.Once the emitter substance powder (8゛) has been sufficiently sprinkled, the next step is to blow air onto the plate (17). Emitter material powder (
8') and the adhesive material (1B) (1B) - Blow away the excess emitter material (8') on the adhesive material (1B) (18L-) and remove the desired emitter material directly adhered onto the adhesive material (1B) (18L-) as shown in Figure 4. Only the material (8゛) remains. This remaining emitter material (8゛) becomes almost the same thickness. Afterwards, it is heated with an infrared lamp, etc. to form the cathode camp (4゛).
) is baked to form an emitter material (8) with a desired flatness.
上記第３図のエミッタ物質粉末（８゛）の振りかけ後に
吹き飛ばされたエミッタ物質粉末（８”）は真空引き等
の手段を介して簡単に回収することができる。このよう
に回収されたエミッタ物質粉末（８°）・＼の異物混入
はプレート（ｉ７）やその周辺雰囲気を清浄に保ことに
より極めて少なくでき、これにより回収したエミッタ物
質粉末（８°）はその才ま再使用できてエミッタ物質の
無駄を大幅に少なくすることができる。The emitter material powder (8") blown away after sprinkling the emitter material powder (8") shown in Fig. 3 above can be easily recovered by means such as vacuuming. The contamination of powder (8°) and ＼ can be extremely reduced by keeping the plate (i7) and its surrounding atmosphere clean, and as a result, the collected emitter material powder (8°) can be reused and used as an emitter material. waste can be significantly reduced.
尚、上記本発明方法は傍熱型カソードだけでなく、直熱
型カソードにも通用できる。またプレート（１７）はカ
ソードキャップ（４） （４）−を気密性良り銘′呈さ
せるゴム等の弾性部材で構成することが望ましい。The method of the present invention described above is applicable not only to indirectly heated cathodes but also to directly heated cathodes. Further, the plate (17) is desirably made of an elastic member such as rubber, which provides good airtightness to the cathode cap (4).
立ユ辺立来
本発明によればエミッタ物質被着形成時に出るエミッタ
物質の余分なものの回収、再使用が可能となり、エミッ
タ物質の無駄の少ないカソード製造方法が提供できる。According to the present invention, it is possible to recover and reuse the excess emitter material produced during the deposition and formation of the emitter material, thereby providing a method for manufacturing a cathode with less wastage of the emitter material.
またカソードキャップ上にエミッタ物質を平面度良く形
成することが容易にできて高精度のカソードが提供でき
、電子銃の特性安定化、陰極線管の解像変向上等が図れ
る。Furthermore, the emitter material can be easily formed on the cathode cap with good flatness, and a highly accurate cathode can be provided, and the characteristics of the electron gun can be stabilized and the resolution of the cathode ray tube can be improved.
第１図乃至第４図は本発明方法を説明する各工程での側
断面図、第５図は傍熱型カソードとこれを収納した制御
電極の一例を示す側断面図、第６図は第５図のカソード
の製造方法を示す部分断面図である。
（２） −カソード、（４） −カソードキャップ、（
３°）−粉末状エミッタ物質−、（１Ｂ）−感光性粘着
物質。1 to 4 are side cross-sectional views at each step to explain the method of the present invention, FIG. 5 is a side cross-sectional view showing an example of an indirectly heated cathode and a control electrode housing the cathode, and FIG. FIG. 6 is a partial cross-sectional view showing a method of manufacturing the cathode of FIG. 5; (2) - cathode, (4) - cathode cap, (
3°) - powdered emitter material -, (1B) - photosensitive adhesive material.
Claims (1)
る工程、この塗布された感光性粘着物質を露光し粘着性
を発現させる工程、この粘着性を発現した感光性粘着物
質上に粉末状エミッタ物質を被着させる工程を含むこと
を特徴とするカソードの製造方法。(11) A step of applying a photosensitive adhesive substance to the outer surface of the cathode cap, a step of exposing the applied photosensitive adhesive substance to develop tackiness, and a step of applying a powdered emitter substance on the photosensitive adhesive substance that has developed tackiness. A method for producing a cathode, the method comprising the step of adhering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11044084A JPS60254534A (en) | 1984-05-30 | 1984-05-30 | Manufacture of cathode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11044084A JPS60254534A (en) | 1984-05-30 | 1984-05-30 | Manufacture of cathode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60254534A true JPS60254534A (en) | 1985-12-16 |
Family
ID=14535772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11044084A Pending JPS60254534A (en) | 1984-05-30 | 1984-05-30 | Manufacture of cathode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60254534A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2785445A1 (en) * | 1998-10-28 | 2000-05-05 | Mitsubishi Electric Corp | Alignment and fixing jig for oxide cathodes, used in electron tubes such as cathode tubes, holds metallic cathode bodies with their upper surfaces facing upwards for screen printed layer application |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5158060A (en) * | 1974-11-18 | 1976-05-21 | Sony Corp | |
| JPS53120364A (en) * | 1977-03-30 | 1978-10-20 | Hitachi Ltd | Production apparatus and method of electron emissive film |
| JPS5549834A (en) * | 1978-10-04 | 1980-04-10 | Hitachi Ltd | Diagrammatic powder-applied layer forming method |
-
1984
- 1984-05-30 JP JP11044084A patent/JPS60254534A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5158060A (en) * | 1974-11-18 | 1976-05-21 | Sony Corp | |
| JPS53120364A (en) * | 1977-03-30 | 1978-10-20 | Hitachi Ltd | Production apparatus and method of electron emissive film |
| JPS5549834A (en) * | 1978-10-04 | 1980-04-10 | Hitachi Ltd | Diagrammatic powder-applied layer forming method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2785445A1 (en) * | 1998-10-28 | 2000-05-05 | Mitsubishi Electric Corp | Alignment and fixing jig for oxide cathodes, used in electron tubes such as cathode tubes, holds metallic cathode bodies with their upper surfaces facing upwards for screen printed layer application |
| NL1012804C2 (en) * | 1998-10-28 | 2000-05-23 | Mitsubishi Electric Corp | Oxide Alignment / Fastening Template and Method for Manufacturing Oxide Cathodes Using Them. |
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