JPS60251167A - Manufacture of forming material - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field] The present invention is applicable to electrical and electronic parts such as lamp holders, fuse tubes, and insulator substrates, mechanical seals, mechanical parts such as ceramic honeycombs, and automobile parts such as turbines and plugs. The present invention relates to a method for manufacturing a molding material that can be used.

[Background technology]

In general, plastics have many characteristics such as high moldability, electrical properties, excellent chemical resistance, and low cost, but they have the major drawback of being easily flammable and emitting toxic gases. . On the other hand, ceramic has excellent properties such as heat resistance, strength, and chemical resistance, but has a large shrinkage rate and lacks one-dimensional stability. In addition, it has the disadvantage of high cost due to high pressure molding, high temperature, and long firing time.

[Purpose of the invention]

The purpose of the present invention is to obtain a low-cost ceramic that has high dimensional accuracy without impairing the heat resistance, strength, and chemical resistance that conventional ceramics have, and that can be fired at low temperatures and in a short time. The objective is to provide a molding material that can be used.

[Disclosure of the invention]

In the present invention, a mixture of refractory aggregate and low melting point glass with a phosphoric acid binder added is heated and dried, and after cooling, a thermosetting resin is added.
A detailed description of the present invention will be given below with regard to a method for producing a molding material characterized by adding a mold release agent 1 and a coloring agent.

The refractory aggregate used in the present invention is preferably silicon carbide, silicon nitride, silicon oxide, aluminum oxide, magnesium oxide, clay, stone, graphite, etc. in the form of powder or small particles, used alone or in an appropriate combination. used. The low melting point glass should preferably have a softening point of 350 to 850°C. This is because below aSO°C the heat resistance of the ceramic is reduced, and above 850°C the energy saving performance is reduced. Phosphoric acid binders include phosphoric acid, magnesium phosphate, metaphosphoric acid,
Pi-01J acid, sodium phosphate, aluminum phosphate, etc. can be used, but there are no particular limitations. The amount of low melting point glass added to the refractory aggregate is not particularly limited, but preferably 20 to 70q6 of low melting point glass to 20 to 70% by weight of the refractory aggregate (hereinafter simply referred to as 迤).

In other words, if the refractory aggregate is less than 20 inches, the strength after firing will be insufficient, if it exceeds 70 degrees, there will be many defects during press molding, if the low melting point glass is less than 2096 degrees, it will not become porcelain, and if it exceeds 70 degrees, the shrinkage rate will be low. This is because it becomes larger. Further, the amount of the phosphoric acid binder is preferably 1 to 5. In other words, if it is less than 1 inch, it will not become porcelain.

This is because if it exceeds 5 inches, the press formability will decrease and the water absorption rate will increase. As the thermosetting resin, general thermosetting resins such as phenol resin, melamine resin, unsaturated polyester resin, furan resin, diallyl phthalate resin, epoxy resin, and urea resin can be used, but it is preferable that gas or It is desirable to use epoxy resin, unsaturated polyester resin, diallyl phthalate resin, etc., which does not generate reaction by-products such as liquid, from 5 to 20 inches. This is because degreasing takes a long time and does not save energy. As the mold release agent, amide, polyethylene, etc. can be used, and it is preferable to add 1 to 5 parts. That is, 1
If it is less than 5%, it will stick to the mixing machine during kneading, and if it is more than 5%, it will take a long time to degrease.
Since cobalt oxide or the like can be used, the type and amount added are not particularly limited, but it is preferable to add 2 to % of a heat-resistant inorganic pigment. That is, 2
This is because if it is less than 1, the uniform coloring property will decrease, and if it exceeds logA, the strength will decrease. Furthermore, a dispersant such as water or alcohol can be added as necessary, but preferably 1
-5 section is desirable. That is, if it is less than 1 inch, the dispersibility decreases,
This is because heating and drying takes a long time, exceeding 5 inches. Although the mixing order is not particularly limited, it is preferable to add the phosphoric acid binder to the mixture of the refractory aggregate, low melting point glass, and colorant. Alternatively, a dispersant may be added to the phosphoric acid binder in advance to dilute and adjust the viscosity of the phosphoric acid binder. Next, the above mixture was added to Zoo-150
After heating and drying at ℃ for 3 to 5 hours.

After cooling to room temperature, a thermosetting resin and a mold release agent are added, and the mixture is kneaded using a mixer such as a roll or a kneader.

The molding material is obtained by pulverizing with an oak type pulverizer, cutter mill, feather mill, etc. The molding material is molded by a normal molding method to obtain a molded product, and then fired to produce ceramic and sumimono.

The present invention will be explained below using examples.

Examples 1 to 3 Molding materials were obtained by blending, mixing, and cross-grinding the materials based on the recipe shown in Table 1.

Table 1 [Effect of the invention] The molding materials of Examples 1 to 3 were molded at a molding pressure of 200 VJcd.
The results of comparing conventional ceramics obtained by compression molding at 160°C for 3 minutes and firing them at 200°C for 30 minutes, 400°C for 90 minutes, and 600°C for 120 minutes as conventional examples are as follows. As is clear from Table 2, the performance of the ceramic of the present invention was well confirmed to be superior to that of the present invention.

Claims (2)

[Claims] (1) Manufacture of a molding material characterized by heating and drying a mixture of refractory aggregate and low-melting point glass with a phosphoric acid binder added thereto, and adding a thermosetting resin, a mold release agent, a coloring agent, etc. after cooling. Method. (2) The method for producing a molding material according to claim 1, wherein the thermosetting resin does not generate reaction by-products such as gas or liquid during the curing reaction process.