JPS6024939A - Particle board and manufacture thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a particle board that can be used in a wide range of applications and a method for manufacturing the same.

Conventionally, there has been a device of this type as shown in FIG. Figure 2 shows the structure of the particle board manufactured as shown in Figure 1. 1 is a surface layer A consisting of small mesh chips, 2 and 3 are center layers B-C consisting of relatively coarse mesh chips, and 14 is a mesh layer. The surface layer consists of small chips. Next, the process will be explained. Chips that are made into pieces and cut from plywood scraps and cut ends are sorted into surface and center layers according to shape and size, and then sent to an adhesive applicator. Next, a substance mixed with a vinyl acetate resin adhesive, a curing agent such as ammonium chloride, and a paraffin emulsion is added to the chip material by an adhesive applicator and sent to the forming stage 4, where it is mechanically molded. It is evenly distributed on the mat by using wind power. In order of mat feeding direction: 1 for surface layer A, 2 for center layer B, 3 for center layer C, 4 for surface layer
be distributed. Next, it is heat-pressed using several presses, and the surface is polished to complete the process. According to this conventional manufacturing method, the particle board characteristics depend on the chip material and
The basic physical properties are determined by the shape, type and amount of adhesive, and the amount of chips to be formed.In order to increase the bending strength, which is important for the standard classification of particleboard, it is necessary to increase the density by using a large amount of chips. They had no choice but to resort to measuring the amount or using a large amount of adhesive.

In addition, in the forming direction and the direction perpendicular to it, 10 to 20
It is extremely difficult to eliminate the bending strength difference in % kneading degree due to the relationship with the mat feed speed.Especially when used for acoustic-related applications, it is difficult to eliminate the bending strength difference in terms of vibration transient characteristics and transmission characteristics, which are important factors. However, conventional manufacturing methods can only accommodate a very limited range of measures. However, given the advantages of vertical reporting such as productivity and uniformity, it should have a wider range of uses. The present invention was developed from the above viewpoint, and consists of a honeycomb core with adhesive applied to the center layer, and is a particle board that can be expected to be used in a wide range of applications, with the main purpose of obtaining high bending strength with low specific gravity. It is intended to provide the following information. An embodiment of the present invention will be described below with reference to the drawings. FIG. 3 shows a forming diagram. In the figure, 31 is a spreader for the surface layer A1, 32 is a spreader for the center layer B2, 33 is a spreader for the center layer C3, 34 is a spreader for the surface layer D4, and 35 is a spreader on the mat. The scattered surface layer chips A136, Chip B137, Chip C138, Chip D139 are honeycomb cores before being expanded, 40 is a feed roller, 41 is a honeycomb core feed pitch controller, 42 and 43 are adhesive spray guns, and 44 is a honeycomb core. The feed pitch controller 45 is a pressing roller. Figure 4 shows a honeycomb core sprayed with adhesive; 46 is a honeycomb core;
47 is a small hole provided in the honeycomb core 46, and 48 is an adhesive. FIG. 5 shows the flow of water vapor generated during hot press. The surface layer chips A35 are spread by the spreader 31 in the conventional manner. The honeycomb core 39 before being expanded is
It is pulled by the feed roller 40 and a gap is created. Next, the tip of the pitch controller 41 enters the gap and controls the pitch while shaping the honeycomb core. The adhesive spray guns 42 and 43 are each oriented at different angles to spray adhesive onto the inner surface of the honeycomb core. The sprayed fly cam core 44 passes through a pitch controller and is set at a predetermined height above the mat surface by a pressing roller 45. Next, the center chip 836 is coated with foam adhesive on the set honeycomb core surface.
The center chips C37 are spread by spreaders 32 and 33 in the same manner as before. At this stage, the honeycomb is buried in the chips, and then the surface layer chips D38 are spread by the spreader 34. When the semi-pressing is completed after footing, the center chip is in a state where the honeycomb is wrapped around, as shown in FIG. 5 before hot-pressing. In FIG. 5, in the state after hot-pressing, the surface layer chips A3B and 38 surface layer chips form a kind of skin layer. Further, water vapor generated during hot press is dispersed through small holes as shown in 49.

As described above, by providing a honeycomb core between chip layers, it is possible to reduce the specific gravity of particle board comparable to conventional high density and high rigidity, and it is possible to change the material type, shape, and configuration of the honeycomb core. This makes it possible to obtain particle board that can be used in a wide range of applications. In addition, in the above example, a case where a honeycomb core is used and a foam type adhesive is applied is shown, but the shape is not limited to a hexagon, but other polygons may be used, and the adhesive can be arbitrarily selected. .

As described above, according to the present invention, by providing a fly cam core between chips, a particle board suitable for a wide range of uses can be obtained, and in particular, a material with low specific gravity and high bending strength can be obtained.

[Brief explanation of drawings]

Table 1 is a schematic process diagram showing the conventional manufacturing process, FIG. 2 is a partial sectional view of the particle board obtained in the process shown in Table 1, and FIG. FIG. 4 is a perspective view of the henicum core after adhesive application, and FIG. 5 is a partial sectional view showing the structure before and after hot press pressing. In the figure, 1 is the surface layer A, 2 is the center layer B, 8 is the center layer C,
4 is the surface layer D135, the surface layer chip A136 is the center layer chip B137ζ, the center layer chip 0138 is the surface layer chip D14
6 is a honeycomb core. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa

Claims (6)

[Claims] (1) A particle board consisting of a plurality of layers of wood chips, characterized in that continuous honeycomb cores or polygonal cells are provided in the layers. (2) A particle board characterized in that, in the particle board, a thermally foamable adhesive is added to the chips forming at least one layer. (3) In the particle board, Heni Kamuko 1
Or particle board characterized by coating polygonal cells with a reinforced resin adhesive or a heat-foamed adhesive. (4) An adhesive addition step in which adhesive is added to the wood chips, a forming step in which multiple layers of the chips are laminated in layers, and a heat pressing step in which the multiple chip layers are heat pressed together. A method for manufacturing a particle board, characterized in that a continuous honeycomb core or polygonal cell is formed in at least one chip layer. (5) The method for manufacturing particle board according to claim 4, further comprising a device for supplying continuous honeycomb cores or polygonal cells in the forming step. (6) The method for manufacturing particle board according to claim 4 or 5, characterized in that the forming step includes a device for applying an adhesive to the connected honeycomb cores or polygonal cells.