JPS6024057A - Hybrid element - Google Patents
Hybrid elementInfo
- Publication number
- JPS6024057A JPS6024057A JP58132244A JP13224483A JPS6024057A JP S6024057 A JPS6024057 A JP S6024057A JP 58132244 A JP58132244 A JP 58132244A JP 13224483 A JP13224483 A JP 13224483A JP S6024057 A JPS6024057 A JP S6024057A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- battery
- memory element
- vessel
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 13
- 239000007784 solid electrolyte Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 abstract description 3
- 230000006870 function Effects 0.000 abstract description 3
- 229910052744 lithium Inorganic materials 0.000 abstract description 3
- CFJRPNFOLVDFMJ-UHFFFAOYSA-N titanium disulfide Chemical compound S=[Ti]=S CFJRPNFOLVDFMJ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract 2
- 238000001465 metallisation Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910001386 lithium phosphate Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
- H10B99/10—Memory cells having a cross-point geometry
Landscapes
- Semiconductor Memories (AREA)
Abstract
Description
【発明の詳細な説明】
電池を同一の容器内に設置したハイブリッド素子に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid device in which batteries are placed in the same container.
従来、メモリ素子のバックアップ電源は、プリント基板
に別途設置した電池によるのが一般的であった。しかし
ながら、ICのメモリ容量が増加し、かつ消費電力が非
常に小さくなってきていることより、IC単位でメモリ
バンクアップができることが望まれるようになってきた
。Conventionally, a backup power source for memory devices has generally been provided by a battery separately installed on a printed circuit board. However, as the memory capacity of ICs increases and the power consumption becomes extremely low, it has become desirable to be able to increase the memory bank on an IC-by-IC basis.
本発明者らは、そのような要望に応えるべく種々研究を
重ねた結果、IC容器が取出端子を多く要するため、メ
モリ素子に比べて大きく作られていることに着目し、メ
モリバックアンプ電源用電池をメモリ素子と同一の容器
内に設置することによって、IC単位でメモリバンクア
ップができることを見出し、本発明を完成するにいたっ
た。The inventors of the present invention have conducted various studies to meet such demands, and have focused on the fact that IC containers require a large number of lead-out terminals and are therefore larger than memory devices. The inventors discovered that by placing the battery in the same container as the memory element, it was possible to increase the memory bank in units of ICs, leading to the completion of the present invention.
本発明のハイブリッド素子において、メモリ素子は従来
から使用されているメモリ素子をそのまま使用すればよ
いが、容器はセラミック製にし、バンクアンプ電源用電
池としては固体電解質電池を用いるのが−好ましい。こ
れは、固体電解質電池は漏液の心配がなくかつ自己放電
が少なくて長期安定性が高く、またセラミックスは防水
性、耐気体透過性が良好で水や気体が透過しに<(、電
池の活物質と水や気体との反応を防止するのに好ましい
からである。また、固体電解質電池であれば漏液の心配
がないので、容器の穴の底部や封目板の内面を導電性の
材料で形成することにより、電池ケースや電池蓋の必要
がなく、電池の小型化に際して好都合であるからである
。In the hybrid device of the present invention, a conventionally used memory device may be used as the memory device, but it is preferable that the container be made of ceramic and that a solid electrolyte battery be used as the battery for the bank amplifier power supply. This is because solid electrolyte batteries do not have to worry about leakage, have little self-discharge, and have high long-term stability, and ceramics have good waterproof and gas permeability, making it difficult for water and gas to pass through. This is because it is preferable to prevent reactions between the active material and water or gas.Also, with solid electrolyte batteries, there is no risk of leakage, so the bottom of the hole in the container and the inner surface of the sealing plate should be covered with conductive material. This is because, by forming the battery from the material, there is no need for a battery case or a battery cover, which is advantageous when downsizing the battery.
そして、メモリ素子は汚染されると性能劣化が著しいこ
とから、メモリ素子とバックアップ電源用電池の設置に
際して、容器にそれらメモリ素子と電池を収容するため
の穴を別々に設けるのが好ましい。また、そのような観
点から、設置に際しては、まずメモリ素子をメモリ素子
用の穴に収容し、封目板で封口して密閉状態にしてから
、バックアップ電源用電池を電池用の穴に収容するのが
好ましい。When a memory element becomes contaminated, its performance deteriorates significantly. Therefore, when installing the memory element and the battery for backup power supply, it is preferable to provide separate holes in the container for accommodating the memory element and the battery. In addition, from this point of view, when installing, first place the memory element in the hole for the memory element, seal it with a sealing plate to make it airtight, and then put the battery for backup power into the hole for the battery. is preferable.
さらに、電池収容用のスペースが小さく限られているこ
とから、バックアップ電源用電池としては二次電池が好
ましく、特に薄膜固体電解質二次電池が体積の小さい電
池を作ることができ、本発明のハイブリッド素子におけ
るバックアップ電源として非常に好適である。Furthermore, since the space for accommodating batteries is small and limited, secondary batteries are preferable as backup power batteries, and in particular, thin film solid electrolyte secondary batteries can produce batteries with small volume, and the hybrid of the present invention It is very suitable as a backup power source for devices.
次に本発明の実施例を図面とともに説明する。Next, embodiments of the present invention will be described with reference to the drawings.
まず、第1図により本発明のハイブリッド素子の構造を
説明すると、容器1はセラミック基で、このセラミック
製容器1にはメモリ素子を収容するための穴2とそのバ
ックアンプ電源用電池を収容するための穴3が設けられ
ている。First, the structure of the hybrid element of the present invention will be explained with reference to FIG. 1. The container 1 is made of a ceramic base, and the ceramic container 1 has a hole 2 for accommodating a memory element and a battery for powering the back amplifier. A hole 3 is provided for this purpose.
そして、まず、このセラミック製容器1のメモリ素子用
の穴2にメモリ素子4を入れ、常法によりワイヤーボン
ディング(第2図にワイヤーボンディングのイメージを
10で示す)によって配線を行なった後、セラミック基
の封口板5を穴2のフランジ部2aに融着して穴2の開
口部を封口する。First, the memory element 4 is inserted into the memory element hole 2 of this ceramic container 1, and after wiring is performed by wire bonding (an image of wire bonding is shown as 10 in Fig. 2) in the usual manner, the ceramic A base sealing plate 5 is fused to the flange portion 2a of the hole 2 to seal the opening of the hole 2.
つぎに電池用の穴3に薄膜固体電解質二次電池6を入れ
る。この電池6は導電性基板6a上にケミカルペーパー
ディポジションにより二硫化チタンJii#6bを形成
し、その上部にLi4Si04−Li3PO4からなる
固体電解質層6cをスパッタ法により形成し、さらにそ
の上部にリチウム層6dを蒸着により形成することによ
ってつくられたものである。Next, a thin film solid electrolyte secondary battery 6 is inserted into the battery hole 3. In this battery 6, titanium disulfide Jii#6b is formed on a conductive substrate 6a by chemical paper deposition, a solid electrolyte layer 6c made of Li4Si04-Li3PO4 is formed on top of it by sputtering, and a lithium layer is further formed on top of the solid electrolyte layer 6c. 6d by vapor deposition.
電池6を収容した後、金属製の封口板7を穴3のフラン
ジ部3aに融着する。なお、上記穴2.3のフランジ部
2a、3aには、金属ロウ材を前もってつけておき、封
口板7の内側には電池押え用のばね8をスポット溶接に
より前もって取り付けておいた。電池用の穴3の底部は
金属蒸着膜で形成されており、電池6からの集電板を兼
ねており、メモリ素子用の穴2まで電気的に接続するよ
うになっている。9は取出用の外部端子で、この外部端
子9はメモリ素子用の穴まで電気的に接続するように構
成されている。なお電池6はその構成を明らかにするた
めに電池収容用の穴3の深ざより厚い厚さで表示されて
いるが、実際には穴3に収容できる厚さにつくられてい
る。具体的には導電性基板6aの厚さが約100μmで
、二硫化チタン層6b、固体電解質層6cおよびリチウ
ム層6dの3層合計で約100μm厚で、電池全体とし
ての厚さが約200μmである。After housing the battery 6, a metal sealing plate 7 is fused to the flange portion 3a of the hole 3. Incidentally, a metal brazing material was applied in advance to the flange portions 2a and 3a of the hole 2.3, and a battery holding spring 8 was previously attached to the inside of the sealing plate 7 by spot welding. The bottom of the battery hole 3 is formed of a metal vapor-deposited film, which also serves as a current collector plate from the battery 6, and is electrically connected to the memory element hole 2. Reference numeral 9 denotes an external terminal for extraction, and this external terminal 9 is configured to be electrically connected to the hole for the memory element. Although the battery 6 is shown to be thicker than the depth of the hole 3 for housing the battery in order to clarify its structure, it is actually made to have a thickness that can be accommodated in the hole 3. Specifically, the thickness of the conductive substrate 6a is about 100 μm, the total thickness of the three layers of the titanium disulfide layer 6b, the solid electrolyte layer 6c, and the lithium layer 6d is about 100 μm, and the thickness of the battery as a whole is about 200 μm. be.
次に上記容器における電池と容器との接続関係を第2図
により明らかにする。第2図において、11はメタライ
ズセラミック基板で、この基板11の電池用の穴3の底
部となる部分には前述のように金属蒸着膜12が形成さ
れ、この金属蒸着膜12がらり一ド用メタライズ13が
メモリ素子用の穴2の底部に向けて設けられ、電池用の
穴3の底部とメモリ素子用の穴2は電気的に接続できる
ように構成されている。Next, the connection relationship between the battery and the container in the container will be clarified with reference to FIG. In FIG. 2, reference numeral 11 denotes a metallized ceramic substrate, and a metal vapor-deposited film 12 is formed on the bottom of the battery hole 3 of this substrate 11 as described above. 13 is provided toward the bottom of the hole 2 for the memory element, and the bottom of the hole 3 for the battery and the hole 2 for the memory element are configured to be electrically connected.
メモリ素子用の穴2の底部14の周辺部がらり一ド用メ
タライズ15が基板11の側面に向って形成され、該リ
ード用メタライズ15の基板11の側面近傍の部分には
銀ロウが付着され、該銀ロウ付は部分に外部端子9が融
着さ、れる。外部端子9の融着後、高温融着用ガラス1
6を介してセラミック基の中板17を基板11に融着す
る。中板17にはメモリ素子用の穴2および電池用の穴
3が設けられ、穴2、3のフランジ部2a、3aとなる
部分には封止用メタライズ18.19が設けられ、該封
止用メタライズ18からメタライズ19を通ってメモリ
素子用の穴2の底部へつながるリード用メタライズ20
が形成され、穴3に収容された電池6がメモリ素子4の
バンクアップ用電源として働き得るようにされている。A lead metallization 15 is formed around the bottom 14 of the memory element hole 2 toward the side surface of the substrate 11, and silver solder is attached to a portion of the lead metallization 15 near the side surface of the substrate 11. The external terminal 9 is fused to the silver soldered portion. After fusing the external terminals 9, the high temperature fusing glass 1
A ceramic-based intermediate plate 17 is fused to the substrate 11 via 6. The middle plate 17 is provided with a hole 2 for a memory element and a hole 3 for a battery, and sealing metallization 18 and 19 are provided in the portions of the holes 2 and 3 that will become the flange portions 2a and 3a. A lead metallization 20 is connected from the lead metallization 18 to the bottom of the memory element hole 2 through the metallization 19.
is formed so that the battery 6 accommodated in the hole 3 can function as a power source for bank-up of the memory element 4.
そして、この中板17に高温融着用のガラス21を介し
てセラミック製の上板22が融着され、穴2.3にそれ
ぞれメモリ素子4および電池6を収容し、封口板5およ
び7を穴2.3のフランジ部2a、3dに融着してハイ
ブリッド素子が完成される。Then, a ceramic upper plate 22 is fused to this middle plate 17 via a glass 21 for high temperature fusion, a memory element 4 and a battery 6 are housed in the holes 2.3, and the sealing plates 5 and 7 are inserted into the holes. 2.3 is fused to the flange portions 2a and 3d to complete the hybrid element.
実施例では穴2.3を上部側に設けたが、下部側(すな
わち外部端子9の脚が向いている側)に設けてもよい。In the embodiment, the holes 2.3 are provided on the upper side, but they may be provided on the lower side (ie, the side toward which the legs of the external terminals 9 are facing).
また電池6からのリードを容器内部に配線したが、外部
端子を用いて行なうこともできる。また、電池の負極側
の集電に金属製の封目板を用いたが、これをセラミック
製のものにして、別途集電板を設けてもよい。Further, although the leads from the battery 6 are wired inside the container, they may also be wired using external terminals. Further, although a metal sealing plate was used to collect current on the negative electrode side of the battery, it is also possible to use a ceramic sealing plate and provide a separate current collecting plate.
以上説明したように、本発明によれば、IC容器の空き
体積を利用してメモリ素子のバンクアンプ電源用電池を
設置することにより、同一容器内にメモリ素子とそのバ
ックアンプ電源用電池を設けた、それ自身でメモリ保持
機能を有するハイブリッド素子が提供される。As explained above, according to the present invention, the memory element and its back amplifier power supply battery are installed in the same container by using the empty space of the IC container to install the battery for the bank amplifier power supply of the memory element. Additionally, a hybrid device is provided which has its own memory retention function.
第1図は本発明のハイブリッド素子の一実施例を示す分
解斜視図であり、第2図は第1図に示すハイブリッド素
子に使用された容器の分解斜視図である。
1・・容器、 2・・メモリ素子収容用の穴、3・・電
池収容用の穴、 4・・メモリ素子、5・・封口板、
6・・電池、 7・・封口板特許出願人 日立マクセル
株式会社
12図FIG. 1 is an exploded perspective view showing one embodiment of the hybrid element of the present invention, and FIG. 2 is an exploded perspective view of a container used in the hybrid element shown in FIG. 1. 1. Container, 2. Hole for accommodating memory element, 3. Hole for accommodating battery, 4. Memory element, 5. Sealing plate,
6.Battery, 7.Sealing plate patent applicant Hitachi Maxell Ltd.Figure 12
Claims (1)
一の容器内に設置したことを特徴とするハイブリッド素
子。 (2)容器をセラミック製にし、バックアップ電源用電
池として固体電解質電池を用いた特許請求の範囲第1項
記載のハイブリッド素子。 (3)容器にメモリ素子とバックアンプ電源用電池とを
収容する穴を別々に設け、それぞれの穴にメモリ素子と
バックアップ電源用電池を収容した後、封口板を容器に
融着して穴の開口部を封口した特許請求の範囲第1項ま
たは第2項記載のハイブリッド素子。 (4) メモリ素子用の穴にメモリ素子を収容し、封口
したのち、電池用の穴に電池を収容した特許請求の範囲
第3項記載のハイブリッド素子。[Claims] (11) A hybrid element characterized in that a memory element and a memory backup power supply battery are installed in the same container. (2) The container is made of ceramic, and a solid electrolyte battery is used as a backup power supply battery. The hybrid device according to claim 1. (3) The container is provided with separate holes for accommodating the memory element and the battery for back-up power supply, and the memory element and the battery for backup power supply are accommodated in each hole. After that, the hybrid element according to claim 1 or 2, wherein the opening of the hole is sealed by fusing a sealing plate to the container. (4) A memory element is accommodated in the hole for the memory element, The hybrid element according to claim 3, wherein a battery is housed in the battery hole after being sealed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58132244A JPS6024057A (en) | 1983-07-19 | 1983-07-19 | Hybrid element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58132244A JPS6024057A (en) | 1983-07-19 | 1983-07-19 | Hybrid element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6024057A true JPS6024057A (en) | 1985-02-06 |
Family
ID=15076733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58132244A Pending JPS6024057A (en) | 1983-07-19 | 1983-07-19 | Hybrid element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6024057A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS627640A (en) * | 1985-07-02 | 1987-01-14 | Sumitomo Electric Ind Ltd | Production of glass |
-
1983
- 1983-07-19 JP JP58132244A patent/JPS6024057A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS627640A (en) * | 1985-07-02 | 1987-01-14 | Sumitomo Electric Ind Ltd | Production of glass |
JPH0551541B2 (en) * | 1985-07-02 | 1993-08-02 | Sumitomo Electric Industries |
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