JPS6024057A - Hybrid element - Google Patents

Abstract

PURPOSE:To obtain a hybrid element having a memory holding function by itself by boring separate holes to a vessel made of ceramics, making a memory element and a battery for a backup power supply consisting of a solid electolytic battery contain in the vessel and clogging the holes by hole sealing plates. CONSTITUTION:A hole 2 for receiving a memory element is bored to a vessel 1 made of ceramics, and external terminals 9 for leading out connected to the received memory element are formed to the external wall of the vessel 1. A hole 3 receiving a battery for a backup power supply also formed separately in the same manner, a metal evaporated film conbining a current collecting plate is applied on the bottom of the hole 3, and terminals 9 connected to the metal evaporated film are shaped to the external wall of the vessel 1. The memory element 4 is received in the hole 2 and a hole sealing plate 5 is fusion-bonded to a flange section 2a formed to the fringe of the hole 2, and the battery 6 is received in the hole 3 and a hole sealing plate 7, a lower surface thereof has a battery hold-down spring 8, is fusion-bonded to the flange section 3a of the fringe of the hole 3. The battery 6 is constituted by a laminate composed of a conductive substrate 6a, a titanium disulfide layer 6b, a solid electrolytic layer 6c and a lithium layer 6d at that time.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid device in which batteries are placed in the same container.

Conventionally, a backup power source for memory devices has generally been provided by a battery separately installed on a printed circuit board. However, as the memory capacity of ICs increases and the power consumption becomes extremely low, it has become desirable to be able to increase the memory bank on an IC-by-IC basis.

The inventors of the present invention have conducted various studies to meet such demands, and have focused on the fact that IC containers require a large number of lead-out terminals and are therefore larger than memory devices. The inventors discovered that by placing the battery in the same container as the memory element, it was possible to increase the memory bank in units of ICs, leading to the completion of the present invention.

In the hybrid device of the present invention, a conventionally used memory device may be used as the memory device, but it is preferable that the container be made of ceramic and that a solid electrolyte battery be used as the battery for the bank amplifier power supply. This is because solid electrolyte batteries do not have to worry about leakage, have little self-discharge, and have high long-term stability, and ceramics have good waterproof and gas permeability, making it difficult for water and gas to pass through. This is because it is preferable to prevent reactions between the active material and water or gas.Also, with solid electrolyte batteries, there is no risk of leakage, so the bottom of the hole in the container and the inner surface of the sealing plate should be covered with conductive material. This is because, by forming the battery from the material, there is no need for a battery case or a battery cover, which is advantageous when downsizing the battery.

When a memory element becomes contaminated, its performance deteriorates significantly. Therefore, when installing the memory element and the battery for backup power supply, it is preferable to provide separate holes in the container for accommodating the memory element and the battery. In addition, from this point of view, when installing, first place the memory element in the hole for the memory element, seal it with a sealing plate to make it airtight, and then put the battery for backup power into the hole for the battery. is preferable.

Furthermore, since the space for accommodating batteries is small and limited, secondary batteries are preferable as backup power batteries, and in particular, thin film solid electrolyte secondary batteries can produce batteries with small volume, and the hybrid of the present invention It is very suitable as a backup power source for devices.

Next, embodiments of the present invention will be described with reference to the drawings.

First, the structure of the hybrid element of the present invention will be explained with reference to FIG. 1. The container 1 is made of a ceramic base, and the ceramic container 1 has a hole 2 for accommodating a memory element and a battery for powering the back amplifier. A hole 3 is provided for this purpose.

First, the memory element 4 is inserted into the memory element hole 2 of this ceramic container 1, and after wiring is performed by wire bonding (an image of wire bonding is shown as 10 in Fig. 2) in the usual manner, the ceramic A base sealing plate 5 is fused to the flange portion 2a of the hole 2 to seal the opening of the hole 2.

Next, a thin film solid electrolyte secondary battery 6 is inserted into the battery hole 3. In this battery 6, titanium disulfide Jii#6b is formed on a conductive substrate 6a by chemical paper deposition, a solid electrolyte layer 6c made of Li4Si04-Li3PO4 is formed on top of it by sputtering, and a lithium layer is further formed on top of the solid electrolyte layer 6c. 6d by vapor deposition.

After housing the battery 6, a metal sealing plate 7 is fused to the flange portion 3a of the hole 3. Incidentally, a metal brazing material was applied in advance to the flange portions 2a and 3a of the hole 2.3, and a battery holding spring 8 was previously attached to the inside of the sealing plate 7 by spot welding. The bottom of the battery hole 3 is formed of a metal vapor-deposited film, which also serves as a current collector plate from the battery 6, and is electrically connected to the memory element hole 2. Reference numeral 9 denotes an external terminal for extraction, and this external terminal 9 is configured to be electrically connected to the hole for the memory element. Although the battery 6 is shown to be thicker than the depth of the hole 3 for housing the battery in order to clarify its structure, it is actually made to have a thickness that can be accommodated in the hole 3. Specifically, the thickness of the conductive substrate 6a is about 100 μm, the total thickness of the three layers of the titanium disulfide layer 6b, the solid electrolyte layer 6c, and the lithium layer 6d is about 100 μm, and the thickness of the battery as a whole is about 200 μm. be.

Next, the connection relationship between the battery and the container in the container will be clarified with reference to FIG. In FIG. 2, reference numeral 11 denotes a metallized ceramic substrate, and a metal vapor-deposited film 12 is formed on the bottom of the battery hole 3 of this substrate 11 as described above. 13 is provided toward the bottom of the hole 2 for the memory element, and the bottom of the hole 3 for the battery and the hole 2 for the memory element are configured to be electrically connected.

A lead metallization 15 is formed around the bottom 14 of the memory element hole 2 toward the side surface of the substrate 11, and silver solder is attached to a portion of the lead metallization 15 near the side surface of the substrate 11. The external terminal 9 is fused to the silver soldered portion. After fusing the external terminals 9, the high temperature fusing glass 1
A ceramic-based intermediate plate 17 is fused to the substrate 11 via 6. The middle plate 17 is provided with a hole 2 for a memory element and a hole 3 for a battery, and sealing metallization 18 and 19 are provided in the portions of the holes 2 and 3 that will become the flange portions 2a and 3a. A lead metallization 20 is connected from the lead metallization 18 to the bottom of the memory element hole 2 through the metallization 19.
is formed so that the battery 6 accommodated in the hole 3 can function as a power source for bank-up of the memory element 4.

Then, a ceramic upper plate 22 is fused to this middle plate 17 via a glass 21 for high temperature fusion, a memory element 4 and a battery 6 are housed in the holes 2.3, and the sealing plates 5 and 7 are inserted into the holes. 2.3 is fused to the flange portions 2a and 3d to complete the hybrid element.

In the embodiment, the holes 2.3 are provided on the upper side, but they may be provided on the lower side (ie, the side toward which the legs of the external terminals 9 are facing).

Further, although the leads from the battery 6 are wired inside the container, they may also be wired using external terminals. Further, although a metal sealing plate was used to collect current on the negative electrode side of the battery, it is also possible to use a ceramic sealing plate and provide a separate current collecting plate.

As explained above, according to the present invention, the memory element and its back amplifier power supply battery are installed in the same container by using the empty space of the IC container to install the battery for the bank amplifier power supply of the memory element. Additionally, a hybrid device is provided which has its own memory retention function.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view showing one embodiment of the hybrid element of the present invention, and FIG. 2 is an exploded perspective view of a container used in the hybrid element shown in FIG. 1. 1. Container, 2. Hole for accommodating memory element, 3. Hole for accommodating battery, 4. Memory element, 5. Sealing plate,
6.Battery, 7.Sealing plate patent applicant Hitachi Maxell Ltd.Figure 12

Claims (1)

[Claims] (11) A hybrid element characterized in that a memory element and a memory backup power supply battery are installed in the same container. (2) The container is made of ceramic, and a solid electrolyte battery is used as a backup power supply battery. The hybrid device according to claim 1. (3) The container is provided with separate holes for accommodating the memory element and the battery for back-up power supply, and the memory element and the battery for backup power supply are accommodated in each hole. After that, the hybrid element according to claim 1 or 2, wherein the opening of the hole is sealed by fusing a sealing plate to the container. (4) A memory element is accommodated in the hole for the memory element, The hybrid element according to claim 3, wherein a battery is housed in the battery hole after being sealed.