JPS602380A - Positioning device for thermal head - Google Patents

Positioning device for thermal head

Info

Publication number
JPS602380A
JPS602380A JP11048983A JP11048983A JPS602380A JP S602380 A JPS602380 A JP S602380A JP 11048983 A JP11048983 A JP 11048983A JP 11048983 A JP11048983 A JP 11048983A JP S602380 A JPS602380 A JP S602380A
Authority
JP
Japan
Prior art keywords
thermal head
substrate
fitting
base
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11048983A
Other languages
Japanese (ja)
Other versions
JPH05222B2 (en
Inventor
Norihiko Koizumi
小泉　則彦
Noriyoshi Ishikawa
典良 石川
Ren Suwai
スワイ・レン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP11048983A priority Critical patent/JPS602380A/en
Publication of JPS602380A publication Critical patent/JPS602380A/en
Publication of JPH05222B2 publication Critical patent/JPH05222B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads

Landscapes

  • Electronic Switches (AREA)

Abstract

PURPOSE:To enable to accurately adjust a fitting position, by a method wherein a guide pin is passed through a through-hole of a base, is inserted into a guide hole of a thermal head, and a metallic fitting having the guide pin projected therefrom is positioned by moving along the major surface of the base. CONSTITUTION:First, the thermal head 2 is placed on a major surface 1a of the base 1, the guide pin 10 of the metallic fitting 11 is passed through the through- hole 6 of the base 1, is inserted into the guide hole 12 of the head 2, and the fitting 11 is affixed to a major surface 1b of the base 1. Next, screws 15, 15' are engaged into threaded holes 17, 17' of the fitting 11 to tentatively fix them, and an adjusting screw 14 is rotated to slide the fitting 11 on the major surface 1b through the large diameter through-holes 6, 7, 7', thereby moving the thermal head 2 to a predetermined position on the base 1. Then, the head 2 is fixed to the base 1 by the screws 15, 15', and the fitting 11 is fixed to the base 1 by a screw 18. Accordingly, fitting can be performed accurately and easily, fine positioning can be achieved, and the fitting position is prevented from being shifted.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はサーマルヘッドの位置決め装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a thermal head positioning device.

〔従来技術〕[Prior art]

感熱記録装置に用いられるサーマルヘッドは、その面上
に抵抗体よりなる多数の発熱要素を主走査方向に配列し
た細長い発熱体を有し、この発熱体の設けられた面上に
記録用紙を圧接した状態において、記録用紙を移送しな
から画情報に応じて発熱要素に選択的に通電し、これに
よって発熱要素が選択的に発熱して記録を行なうもので
ある。A thermal head used in a thermal recording device has a long and narrow heating element on which a large number of heating elements made of resistors are arranged in the main scanning direction, and the recording paper is pressed against the surface on which this heating element is provided. In this state, the heat generating elements are selectively energized according to the image information without transporting the recording paper, so that the heat generating elements selectively generate heat to perform recording.

ところで例えば転写型感熱記録装置においては、第１図
に示すように、取付用基板ｌ上に取付けられたサーマル
ヘッド２０面上にインクドナーフィルム３および記録用
紙４をバックローラ５によって圧接した状態で、インク
ドナーフィルム３の移送を行なうことにより、記録用紙
４もインクドナーフィルム３との間の摩擦によって移送
され、かつこの移送に伴なって記録用紙４に所望の記録
が行なわれるようになされている。For example, in a transfer type thermal recording device, as shown in FIG. By transporting the ink donor film 3, the recording paper 4 is also transported by friction between the ink donor film 3 and the recording paper 4, and the desired recording is performed on the recording paper 4 along with this transport. There is.

したがって、サーマルヘクト５との相対位置関係を所定
の状態におくために、サーマルヘッド２０基板１に対す
る取付位置を正確に調整する必要がある。このことは転
写型感熱記録装置のみでなく、直接感熱記録装置におい
ても同様である。Therefore, in order to keep the relative positional relationship with the thermal head 5 in a predetermined state, it is necessary to accurately adjust the mounting position of the thermal head 20 with respect to the substrate 1. This applies not only to transfer type thermal recording devices but also to direct thermal recording devices.

〔発明の目的〕[Purpose of the invention]

そこで本発明は、サーマルヘッドの基板に対する取付を
正確かつ容易に行なうことができるサーマルヘッドの位
置決め装置を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a thermal head positioning device that can accurately and easily attach a thermal head to a substrate.

本発明は、基板にその両主表面間に貫通する透孔な設け
、この透孔より小径のガイドピンを突設した取付金具を
基板のヘッド載置面とは反対側の主表面上に添接してこ
のガイドピンを前記基板の透孔を通してサーマルヘクト
のガイド孔に嵌挿し、この状態において取付金具を調整
手段を用いて基板の主表面に沿って移動させ、これによ
ってサーマルヘッドを基板上の所定位置に位置決めする
ようになさｊたサーマルヘッドの位置決め装置であり、
これによって上記目的を１成するものである。The present invention provides a board with a through hole penetrating between its two main surfaces, and a mounting bracket with a guide pin of a smaller diameter protruding from the through hole on the main surface of the board opposite to the head mounting surface. The guide pin is inserted into the guide hole of the thermal hect through the through hole of the substrate, and in this state, the mounting bracket is moved along the main surface of the substrate using the adjusting means, thereby aligning the thermal head on the substrate. A thermal head positioning device configured to position a thermal head at a predetermined position,
This accomplishes one of the above objectives.

〔実施例〕〔Example〕

以下本発明の一実施例を第１図との対応部分に同一符号
の付された＄２図を参照して詳細に説明する◎ 第２図において、サーマルヘッド取付用基板１Ｆｉｉ対
の主表面１ａｔ１ｂを備え、−万の主表面ｌ庇上にサー
マルヘッド２を載置して取付けるようになされており、
その中央位置および左右の所定位置に両生表面１ａｓｌ
ｂ間を貫通する比較的大径の透孔６．７．７’！よび８
が設けられている。また基板１の一１ｆｔ１１緑に下方
に伸びる突縁部９が設けられている。An embodiment of the present invention will be described in detail below with reference to FIG. 2, in which parts corresponding to those in FIG. The thermal head 2 is mounted on the eave of the main surface of the main surface.
Amphibian surface 1asl at the central position and predetermined positions on the left and right sides.
Relatively large diameter through hole 6.7.7' penetrating between b! and 8
is provided. Further, a protruding edge portion 9 extending downward is provided on one side of the substrate 1.

基板１の主表面１ｂ９１１には、基板１の透孔６よりも
充分小さい径を有するガイドビン１０を中央位置に突設
したを付金具１１が、基板１の主表面１ｂに沿って移動
できるように添接さｊており、この添接時に、カイトピ
ン１０が基板１１の透孔６を貫通してサーマルヘッド２
のガイド孔１２に嵌挿されるように力されている。さら
に取付金具１１の−１ＩＩＩ縁には下方に向って折曲さ
れた舌片１３が形成されており、この舌片１３に調整用
ネジ１４が螺装されている。ネ１７１４の先端は基板１
の突＃部９に係着され、ネジ１４０回動にエリ取付金具
１１が基板１の主表面１ｂＶＣ沿って左右に移動するよ
うになされている。On the main surface 1b 911 of the substrate 1, a fitting 11 having a guide pin 10 having a diameter sufficiently smaller than the through hole 6 of the substrate 1 protruding from the center is movable along the main surface 1b of the substrate 1. At the time of attachment, the kite pin 10 passes through the through hole 6 of the substrate 11 and connects to the thermal head 2.
It is forced so that it is inserted into the guide hole 12 of. Further, a tongue piece 13 bent downward is formed at the -1III edge of the mounting bracket 11, and an adjustment screw 14 is screwed into this tongue piece 13. The tip of the screw 1714 is connected to the board 1.
The edge fitting 11 is attached to the protrusion 9 of the board 1, and is configured to move left and right along the main surface 1bVC of the substrate 1 as the screw 140 rotates.

一万サーマルヘッド２には、取付用ネジ１５゜１５′が
挿通される取付用孔１６　、１６　’が設けられ、ネジ
１５　、１５　’が、取付用孔１６　、１６　’および
基板】の透孔７，７′をそれぞれ貫通して、先端が取付
金具１１のネジ孔１７　、１７　’に螺装されるように
なされている。なお、基板１に設けられた透Ｉｌ、７．
７′もネジ１５　、１５　’に対して充分大きな径を有
する。さらに、取付金具１１　Ｖｃは、基板１のＥｔＡ
孔８を貫通して取付けられる取付金具固定用ネジ１８の
先端が岬装されるネジ孔１９が設けられている。The thermal head 2 is provided with mounting holes 16 and 16' through which mounting screws 15 and 15' are inserted. 7 and 7', respectively, and the tips thereof are screwed into screw holes 17 and 17' of the mounting bracket 11. Note that the transparent Il provided on the substrate 1, 7.
7' also has a sufficiently large diameter relative to the screws 15, 15'. Furthermore, the mounting bracket 11 Vc is connected to the EtA of the board 1.
A screw hole 19 is provided, into which the tip of a screw 18 for fixing a mounting bracket that is attached through the hole 8 is fitted.

以上の構成において、サーマルヘッド２０基板１ｖｃ対
する取付は下記のようにして行なわれる。In the above configuration, the thermal head 20 is attached to the substrate 1vc in the following manner.

すなわち、まずサーマルヘッド２を基板１の主表面ｌａ
上に載置するとともに、取付金具１１のガイドピン１０
を基板１の透孔６を通じてサーマルヘクト２のガイド孔
１２に嵌挿した状態で、取付金具１１を基板１の主表面
１ｂに添接する。That is, first, the thermal head 2 is placed on the main surface la of the substrate 1.
the guide pin 10 of the mounting bracket 11.
is inserted into the guide hole 12 of the thermal hect 2 through the through hole 6 of the substrate 1, and the mounting bracket 11 is attached to the main surface 1b of the substrate 1.

次に取付用ネジ１５　、１５　’をサーマルヘッド２の
孔１６　、１６　’および基板１の透孔７，７′に挿通
して取付金具１１のネジ孔１７．１７’に螺装して、取
付金具１１０基板１に対する摺動が阻害さｉｉ、ない程
度に軽く締付ける。Next, insert the mounting screws 15 and 15' into the holes 16 and 16' of the thermal head 2 and the through holes 7 and 7' of the board 1, and screw them into the screw holes 17 and 17' of the mounting bracket 11, and then install. Tighten the metal fittings 110 lightly to the extent that sliding against the substrate 1 is not obstructed.

次に調整用ネジ１４を回動じて取付金具１１を基板１の
主表面ｌｂ上を摺動させ、サーマルヘッド２を基板１上
の所、定位置に移動させる。Ｃの場合、透孔６および７
．７′はガイドピン１０および取付用ネジ１５　、１５
　’に対して充分大きい径を有するので、取付金具工１
およびサーマルヘッド２の所定の範囲内の移動が許容さ
れる。Next, the adjustment screw 14 is turned to slide the mounting bracket 11 on the main surface lb of the substrate 1, and the thermal head 2 is moved to a predetermined position on the substrate 1. In case of C, through holes 6 and 7
．． 7' is a guide pin 10 and mounting screws 15, 15
Since it has a sufficiently large diameter compared to ',
The thermal head 2 is allowed to move within a predetermined range.

次にネジ１５　、１５　’を固く締着してサーマルヘッ
ド２を、取付金具１１との間に基板１を挾んだ状態で基
板１の主表面ｌａｄ：に固定する。Next, the thermal head 2 is fixed to the main surface lad: of the substrate 1 with the substrate 1 sandwiched between it and the mounting bracket 11 by firmly tightening the screws 15 and 15'.

次に取付金具固定用ネジ１８を基板１の透孔８に挿通し
て取付金具１１のネジ孔】９に螺装して締着し、取付金
具１１を基板１に固定する。このように取付金具１１を
基板１に同定してｋけば、取付用ネジ１５　、１５　’
をゆるめてサーマルヘッド２を基板１から取り外した場
合、次にサーマルヘッドを取付ける際に位置調整を行な
う必要がない。Next, the mounting bracket fixing screw 18 is inserted into the through hole 8 of the board 1 and screwed into the screw hole 9 of the mounting bracket 11 and tightened, thereby fixing the mounting bracket 11 to the board 1. After identifying the mounting bracket 11 to the board 1 in this way, the mounting screws 15, 15'
If the thermal head 2 is removed from the substrate 1 by loosening the screw, there is no need to adjust the position when installing the thermal head next time.

〔発明の効果〕〔Effect of the invention〕

以上の説明で明らかなように、本発明によれば、サーマ
ルヘッド２０基板１に対する取付を正確かつ容易に行な
うことができ、微細な位置合せが可能になる。さらに取
付用ネジ１５　、１．５　’を締着する場合にも、それ
によってサーマ、ルヘッド２の取付位置がずれるおそれ
もなくなる。As is clear from the above description, according to the present invention, it is possible to accurately and easily attach the thermal head 20 to the substrate 1, and fine alignment is possible. Furthermore, even when the mounting screws 15 and 1.5' are tightened, there is no fear that the mounting position of the thermal head 2 will shift.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のサーマルヘッドの取付構成を概略的に示
す断面−、第２図は本発明によるサーマルヘッドの位置
決め装置の断簡図である。 １・−・基板、ｌ　ａ　＋　ｌ　ｂ−・−主表面、　２
・・・サーマルヘッド、６，７．７’、８・・・透孔、
１０・・・ガイドピン、１１・・・取付金具、１２・・
・ガイド孔、　１４−・・調整用ネジ。FIG. 1 is a cross-sectional view schematically showing a conventional thermal head mounting structure, and FIG. 2 is a simplified cross-sectional view of a thermal head positioning device according to the present invention. 1.--Substrate, la + l b-.-main surface, 2
...Thermal head, 6, 7.7', 8...Through hole,
10... Guide pin, 11... Mounting bracket, 12...
・Guide hole, 14-...adjustment screw.

Claims (1)

【特許請求の範囲】 １対の主表面を有し一方の主表面上にサーマルヘッドが
載置取付けられかつ前記】対の主表面間に貫通して透孔
が形成されるサーマルヘッド取付用基板と、 前記透孔よりも小径のガイドビンが設けられかつ前記基
板の他方の主表面に対して可動的に添接して取付けられ
、該添接時に、前記ガイドピンが前記基板の透孔を貫通
して前記サーマルヘッドに設けられるガイド孔に嵌挿す
る取付金具と、 該取付金具と前記基板との双方に関連して調節可能に設
けられ、該調節により前記取付金具な前記基板の他方の
主表面に沿って移動させて前記サーマルヘッドを前記基
板上の所定位置に位置決めする位置決め手段と、 該位置決めされた状態において前記サーマルヘッドを前
記基板に固定する手段とを具備することを特徴とするサ
ーマルヘッドの位置決め装置。[Scope of Claims] A thermal head mounting substrate having a pair of main surfaces, a thermal head mounted on one of the main surfaces, and a through hole penetrating between the pair of main surfaces. and a guide pin having a smaller diameter than the through hole is provided and attached movably to the other main surface of the substrate, and when the guide pin is attached, the guide pin passes through the through hole of the substrate. a mounting bracket that is fitted into a guide hole provided in the thermal head; and a mounting bracket that is adjustable in relation to both the mounting bracket and the substrate, and the adjustment allows the mounting bracket to be inserted into the other main body of the substrate. A thermal device comprising: positioning means for positioning the thermal head at a predetermined position on the substrate by moving it along a surface; and means for fixing the thermal head to the substrate in the positioned state. Head positioning device.
JP11048983A 1983-06-20 1983-06-20 Positioning device for thermal head Granted JPS602380A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11048983A JPS602380A (en) 1983-06-20 1983-06-20 Positioning device for thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11048983A JPS602380A (en) 1983-06-20 1983-06-20 Positioning device for thermal head

Publications (2)

Publication Number Publication Date
JPS602380A true JPS602380A (en) 1985-01-08
JPH05222B2 JPH05222B2 (en) 1993-01-05

Family

ID=14537034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11048983A Granted JPS602380A (en) 1983-06-20 1983-06-20 Positioning device for thermal head

Country Status (1)

Country Link
JP (1) JPS602380A (en)

Also Published As

Publication number Publication date
JPH05222B2 (en) 1993-01-05

Similar Documents

Publication Publication Date Title
US6237832B1 (en) Wave soldering fixture
US4821051A (en) Optical printhead having thermal expansion stress relief
US4875057A (en) Modular optical printhead for hard copy printers
US4159176A (en) Device for aligning a photomask on a printed circuit board
JP2545394B2 (en) Depth Stopper
US6618563B2 (en) System and method for printing on a print medium with a combination laser and ink jet printer
US4244109A (en) Apparatus for mounting and aligning printed circuit board
JPH07106664B2 (en) Thermal print head
JPS602380A (en) Positioning device for thermal head
SE9301440D0 (en) METHOD AND APPARATUS FOR ADJUSTING A PRINTHEAD
JPH07154065A (en) Correcting jig for printed board
DE69607234D1 (en) Clamping device for lithographic plates
JP2888647B2 (en) Thermal head mounting structure
JPS6347484Y2 (en)
JP2570025Y2 (en) Thermal head
JPH07192417A (en) Optical sensor
JP2987843B2 (en) Fixing method of metal substrate for thermal head
JPH0381176A (en) Thermal head
KR960024619A (en) Film positioning device
JP2878009B2 (en) Thermal printing equipment
JPH0745990Y2 (en) Heat sink mounting structure
JP2915277B2 (en) Printing device
JP2509045Y2 (en) Heat dissipation leaf spring
JP2604181Y2 (en) Thermal head
JPH0550625A (en) Thermal head