JPH05222B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a positioning device for a thermal head.

[Prior art]

The thermal head used in thermal recording devices is
It has an elongated heating element on which a large number of heating elements made of resistors are arranged in the main scanning direction, and when the recording paper is in pressure contact with the surface on which this heating element is provided, while the recording paper is being transported. Electricity is selectively applied to the heat generating elements according to image information, whereby the heat generating elements selectively generate heat to perform recording.

For example, in a transfer type thermal recording device, as shown in FIG. Ink donor film 3
By carrying out this transfer, the recording paper 4 is also transferred by the friction between it and the ink donor film 3, and along with this transfer, desired recording is performed on the recording paper 4.

Therefore, in order to keep the relative positional relationship with the thermal head 5 in a predetermined state, the thermal head 2
It is necessary to accurately adjust the mounting position on the substrate 1. This applies not only to transfer type thermal recording devices but also to direct thermal recording devices.

[Purpose of the invention]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a thermal head positioning device that can accurately and easily attach a thermal head to a substrate.

[Structure of the invention]

The present invention provides a board with a through hole penetrating between its main surfaces, and attaches a mounting bracket having a guide pin of a smaller diameter protruding from the through hole on the main surface of the board opposite to the head mounting surface. The guide pin is inserted into the guide hole of the thermal head through the through hole of the board, and in this state, the mounting bracket is moved along the main surface of the board using the adjustment means, thereby moving the thermal head to the board. This is a thermal head positioning device adapted to position a thermal head at a predetermined position on a thermal head, thereby achieving the above object.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail with reference to FIG. 2, in which parts corresponding to those in FIG. 1 are denoted by the same reference numerals.

In Figure 2, the thermal head mounting board 1
is equipped with a pair of main surfaces 1a and 1b, on which a thermal head 2 is placed and mounted, and a thermal head 2 is mounted between the two main surfaces 1a and 1b at the center and at predetermined positions on the left and right sides. Relatively large-diameter through holes 6, 7, 7' and 8 are provided through the. Also, a protruding edge 9 extending downward on one side edge of the substrate 1
is provided.

On the main surface 1b side of the substrate 1, a mounting bracket 11 having a guide pin 10 having a diameter sufficiently smaller than the through hole 6 of the substrate 1 protruding from the center is provided so as to be movable along the main surface 1b of the substrate 1. It is attached to
During this attachment, the guide pin 10 is inserted into the through hole 6 of the substrate 1.
The guide hole 12 of the thermal head 2 is inserted through the guide hole 12 of the thermal head 2. Furthermore, mounting bracket 1
On one side edge of 1 is a tongue piece 13 bent downward.
is formed, and an adjustment screw 1 is attached to this tongue piece 13.
4 is screwed on. The tip of the screw 14 is engaged with the protruding edge 9 of the substrate 1, and the rotation of the screw 14 causes the mounting bracket 11 to move left and right along the main surface 1b of the substrate 1.

On the other hand, the thermal head 2 has mounting screws 15,
Mounting holes 16, 16' into which the screws 15' are inserted are provided, and screws 15, 15' pass through the mounting holes 16, 16' and the through holes 7, 7' of the substrate 1, respectively.
The tips are screwed into screw holes 17, 17' of the mounting bracket 11. Note that the through holes 7, 7' provided in the substrate 1 also have a sufficiently large diameter with respect to the screws 15, 15'. Furthermore, the mounting bracket 11 has a screw hole 1 into which the tip of a mounting bracket fixing screw 18 that is attached by penetrating the through hole 8 of the board 1 is screwed.
9 is provided.

In the above configuration, the thermal head 2 is attached to the substrate 1 in the following manner.

That is, first, the thermal head 2 is placed on the main surface 1a of the substrate 1, and the guide pin 10 of the mounting bracket 11 is inserted into the guide hole 12 of the thermal head 2 through the through hole 6 of the substrate 1, and then the thermal head 2 is mounted. A metal fitting 11 is attached to the main surface 1b of the substrate 1. Next, insert the mounting screws 15, 15' into the holes 16, 16' of the thermal head 2 and the through holes 7, 7' of the board 1, and screw them into the screw holes 17, 17' of the mounting bracket 11. Tighten lightly to the extent that sliding of the metal fitting 11 on the substrate 1 is not inhibited.

Next, the adjusting screw 14 is rotated to slide the mounting bracket 11 on the main surface 1b of the substrate 1, and the thermal head 2 is moved to a predetermined position on the substrate 1. In this case, the through holes 6, 7, and 7' have diameters that are sufficiently large relative to the guide pin 10 and the mounting screws 15 and 15', so that movement of the mounting bracket 11 and the thermal head 2 within a predetermined range is permitted. Ru.

Next, the thermal head 2 is fixed on the main surface 1a of the substrate 1 with the substrate 1 sandwiched between it and the mounting bracket 11 by firmly tightening the screws 15, 15'.

Next, insert the mounting bracket fixing screw 18 into the through hole 8 of the board 1.
The mounting bracket 11 is fixed to the board 1 by inserting it into the screw hole 19 of the mounting bracket 11 and tightening it. If the mounting bracket 11 is fixed to the board 1 in this way,
When the thermal head 2 is removed from the board 1 by loosening the mounting screws 15, 15', there is no need to adjust the position when installing the thermal head next time.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, it is possible to accurately and easily attach the thermal head 2 to the substrate 1, and fine alignment is possible. Furthermore, even when the mounting screws 15, 15' are tightened, there is no fear that the mounting position of the thermal head 2 will shift.

[Brief explanation of the drawing]

FIG. 1 is a sectional view schematically showing a conventional thermal head mounting structure, and FIG. 2 is a sectional view of a thermal head positioning device according to the present invention. 1...Substrate, 1a, 1b...Main surface, 2...Thermal head, 6, 7, 7', 8...Through hole, 10
... Guide pin, 11 ... Mounting bracket, 12 ... Guide hole, 14 ... Adjustment screw.

Claims (1)

[Scope of Claims] 1. A thermal head mounting substrate having a pair of main surfaces, on which a thermal head is placed and mounted, and a through hole penetrating between the pair of main surfaces. and a guide pin having a smaller diameter than the through hole is provided and is attached movably to the other main surface of the substrate, and when the guide pin is attached, the guide pin passes through the through hole of the substrate. a mounting bracket that is inserted into a guide hole provided in the thermal head; and a mounting bracket that is adjustable in relation to both the mounting bracket and the substrate, and the adjustment allows the mounting bracket to be connected to the other main body of the substrate. A thermal device comprising: positioning means for positioning the thermal head at a predetermined position on the substrate by moving it along a surface; and means for fixing the thermal head to the substrate in the positioned state. Head positioning device.