JPS60236214A - Laser cvd method - Google Patents

Laser cvd method

Info

Publication number
JPS60236214A
JPS60236214A JP9253584A JP9253584A JPS60236214A JP S60236214 A JPS60236214 A JP S60236214A JP 9253584 A JP9253584 A JP 9253584A JP 9253584 A JP9253584 A JP 9253584A JP S60236214 A JPS60236214 A JP S60236214A
Authority
JP
Japan
Prior art keywords
substrate
film
irradiation
laser beam
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9253584A
Other languages
Japanese (ja)
Inventor
Kazuyuki Toki
土岐 和之
Tadayoshi Otani
男谷 忠義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jeol Ltd
Original Assignee
Jeol Ltd
Nihon Denshi KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeol Ltd, Nihon Denshi KK filed Critical Jeol Ltd
Priority to JP9253584A priority Critical patent/JPS60236214A/en
Publication of JPS60236214A publication Critical patent/JPS60236214A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/483Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using coherent light, UV to IR, e.g. lasers

Abstract

PURPOSE:To economically form a film within a minute short period by allowing growth of a film at the desired region on a substrate where a nucleus is formed by irradiation of ultraviolet ray through irradiation of visible laser beam to such region in a reaction chamber where a process gas is supplied. CONSTITUTION:Pressure within a reaction chamber is set adequately by opening an exhaustion port 5 and adequately setting supply of gas from a gas cylinder 2 and a substrate 10 is irradiated with the ultraviolet ray withing a short period (about several minutes) from an ultraviolet ray source 6 through a window 7A. Irradiation of such ultraviolet ray realizes formation of a very thin film or process gas (nucleus for growth of film) on the substrate. Next, a holder 9 is moved so that the substrate 10 is placed just under a window 7B by means of a holder moving mechanism 11. Here, the laser beam is focused to the desired position on the substrate 10 from a laser source 8 through the window 7B for irradiation for very short period (about several seconds) in accordance with thickness of film. This irradiation allows the growth of film because the laser energy is absorbed by the nucleus, only at the area where is irradiated with the visible laser beam.

Description

【発明の詳細な説明】 本発明は核形成時間を短縮したレーザCV D 7Jh
法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides a laser CVD 7Jh with shortened nucleation time.
Regarding the law.

最近、CVD(Cl1elllICal V apor
 D (!pO3!1ion)技術を使った膜形成が盛
んに行なわれ−Cいる。該CVD方法の最たるものの一
つ4.1.l板が配置された反応室にプロビスガスを流
し、該ガスを早機表面に熱的に解離吸着さ−Uて、該量
板土に膜を成長させるものであるが、これは低温上T:
膜形成が出*41い問題がある。又、ブL1t?スガス
を尋人した反応室内に配置された゛電極に直流又は高周
波用EEを印加しくプラズマを発住させ、電離したガス
粒子を基椴1に付6さUる様にしたプラズマCV D 
lfiあるが、該ゾラズン中のイオン或い1.L^速中
竹粒子が前記膜に絢突りることにJ、り該lし)の特性
が劣化乃る問題がある。
Recently, CVD (Cl1ellICal V apor
Film formation using the D (!pO3!1ion) technology is being actively carried out. One of the best CVD methods 4.1. Provis gas is flowed into a reaction chamber in which a plate is placed, and the gas is thermally dissociated and adsorbed onto the surface of the plate to grow a film on the plate.
There is a problem with film formation. Also, B L1t? A plasma CVD method in which plasma is generated by applying direct current or high frequency EE to an electrode placed in a reaction chamber in which gas is introduced, and ionized gas particles are attached to the substrate 1.
lfi, but the ions in the Zolazun or 1. There is a problem in that the properties of the film deteriorate due to the presence of the bamboo particles in the film.

そこC1この様な問題の無いCV I) fJ法とし−
(、プロセスガスが尋人され1.:反応り;ば内に配置
され/J基板方向にレーザ光線若しくは紫外線ラン/光
を照射しC該ガスを光解離さけ、該光解離し/、=ガス
粒子を阜扱十に(NJ Rさせる様にした光CV l)
 fJ法が考えられている。該光CVDrj法の内、レ
ーザ光線を使用するものをレーザ゛CV l) fJ 
7)*、紫外線ランプを使用覆るものをランプCVDプ
ノ法ど称りれぽ、後者は細く絞ることfJ Mしいが、
重石(レーザCV D 7J >人)(まレーザの波長
A−タ)2細く絞ることが出来るので、Ic、l−8t
、J(if 81素子の配線や半導体用のマスクの修理
にイ」効と11されている。
Therefore, C1 is a CV without such problems I) fJ method -
(1.: When the process gas is placed in the reactor, / J is irradiated with laser beam or ultraviolet light / light in the direction of the substrate to avoid photo-dissociation of the gas, and the photo-dissociation /, = gas Particles are treated differently (light CV l made to cause NJR)
The fJ method is being considered. Among the optical CVDrj methods, those using laser beams are called laser CV Drj methods.
7) *Use an ultraviolet lamp and cover it with the CVD method.
Weight (laser CV D 7J > person) (laser wavelength A-ta) 2 Since it can be narrowed down, Ic, l-8t
, J (if 81) It is said to be effective for repairing device wiring and semiconductor masks11.

しかし、この様trレーリ゛CV I) fJ法にb問
題がある。特に可視光シー1フ’光線を基数に照射した
場合、直ぐに早扱J−に膜が形成され1F、角くの問(
長い場合には数10分以上)膜の成長が起こらないこと
である。そして、この期間の長さはプロレスガスの種類
、基板の表面状態(例えば、基板の表面の水分の付着程
度)、及びレーザ光線の波長やパワー等により一定では
ないことである。
However, there is a problem with this tr Rayleigh CV I) fJ method. In particular, when the visible light sea 1F' ray is irradiated to the base, a film is immediately formed on the 1F, square problem (
In the case of a long period of time (more than several tens of minutes), film growth does not occur. The length of this period is not constant depending on the type of wrestling gas, the surface condition of the substrate (for example, the degree of moisture adhesion on the surface of the substrate), the wavelength and power of the laser beam, etc.

本発明はこの様な問題を解決づることを目的としたもの
である。
The present invention is aimed at solving such problems.

さて、このレーザ光線照射後膜が成長しない期間の長さ
はプロセスガスの種類、基板の表面状態(例えば、基板
の表面の水分の付着程度)、及びレーザ光線のパワー等
により異っているが、これらの条件に拘わらず、レーザ
CVD方法ではレーザ光線照l)I後暫くの間膜が成長
しない期間がある。
The length of the period during which the film does not grow after laser beam irradiation varies depending on the type of process gas, the surface condition of the substrate (for example, the degree of moisture adhesion on the substrate surface), the power of the laser beam, etc. Regardless of these conditions, in the laser CVD method, there is a period during which the film does not grow for a while after laser beam irradiation.

この1v1間基板のレーザ光線が当っている部分で何が
起こっているのかを考察しl〔所、膜が成長する為に必
要な膜の種〈核)が葛根表面で発生していることを電子
顕@鏡観察により確認した。従って、以後前記期間を核
形成期間と称する。では、何故レーザCVD方法におい
て核形成期間が長いのかを考察した所、可視光レーザは
波長が長いので、一般的にプロレスガスに吸収されにり
く、核の発生に時間が掛るものと思われる。
We considered what is happening in the part of the substrate that is hit by the laser beam during this 1v1 interval, and found that the seeds (nuclei) of the film necessary for film growth are generated on the root surface. Confirmed by electron microscope observation. Therefore, the period will hereinafter be referred to as the nucleation period. Now, when considering why the nucleation period is long in the laser CVD method, it seems that since the visible light laser has a long wavelength, it is generally difficult to be absorbed by the wrestling gas, and it takes time for the generation of nuclei.

そこで、本発明は可視光レー’f CV l) ij法
により膜を成長させる前工程に、ブ]−ルスガスの吸収
が極めて良く、極短時間で核形成が出来るフンゾCVD
方法を入れ、該核形成工程の後【す視光レーザCVD方
法により速やかに、該核形成が(う4jわれた基板に膜
を成長させる様にする方法を捉供する様にした。
Therefore, in the present invention, in the pre-process of growing a film using the visible light laser method, we have developed a method that uses a chemical vapor deposition method (CVD) that has extremely good absorption of blue gas and can form nuclei in a very short time.
The present invention provides a method in which a film is grown on a substrate on which the nucleation is performed immediately after the nucleation step by a visual laser CVD method.

尚、紫外線領域のシー+1光線もあるが、該光源は紫外
線光源に比べ非常に高価Cある。
Although there is C+1 light in the ultraviolet region, this light source is much more expensive than the ultraviolet light source.

添付図は本発明の可視光レー+J’ CV D方法の一
実施例として示した可視光レーザ゛CVD54P?の概
略図である11図中1(J反応室ぐ、ガスボンベ2に繋
がったガス供給口3、す1気手段4に繋がったJ、II
気口5、紫外線光源6からの紫外線を反応室内に導く窓
7A、レーザ光源8からのレーザ光線を反応室内に導く
窓7Bを備えている。9はり板10を載置した基板ホル
ダで、該ホルダは反応室外に設けられたホルダ移動機4
f1511により2次冗的に移動j4能である。12G
、Lレーザ光学系で、前記レ−1,/’光1Iri8か
らのレーザ光線を絞るレンズやレーリ゛光線の照射位置
を制御するミラーから成る。
The attached drawing shows a visible light laser CVD54P as an embodiment of the visible light laser+J' CVD method of the present invention. In Figure 11, which is a schematic diagram, 1 (J reaction chamber, gas supply port 3 connected to gas cylinder 2,
It includes an air vent 5, a window 7A that guides ultraviolet rays from an ultraviolet light source 6 into the reaction chamber, and a window 7B that guides a laser beam from a laser light source 8 into the reaction chamber. 9 A substrate holder on which a beam plate 10 is placed, and the holder is moved by a holder moving machine 4 provided outside the reaction chamber.
It is possible to move j4 in a second-order redundant manner by f1511. 12G
, L laser optical system, consisting of a lens that focuses the laser beams from the laser beams 1 and 1Iri8, and a mirror that controls the irradiation position of the laser beams.

斯くの如き装置において、ホルダ移動機構9にJ、り基
板10が窓7Aの直下に来る様にホルダ9を移動させる
。そして、先ず、1)1気手段4により反応室1内を高
真空にし、排気口5を閉じる様にする。この状態で、ガ
スボンベ2からプ[1セスガス〈例、N2ガスに3iト
14ガスを含Δ、だ混合ガス)を反応室内に供給し、該
反応室内を数T orr程度の11力にりる。この状態
において、基板10の表面に充分ブD t?スガスを吸
着させる。次に、前記il+気]」5を聞き、前記ガス
ボンベ2からのガスの供給Φを適宜に設定して反応室内
の圧力を適宜な程度にし、紫外線光源6から紫外線を窓
7△を介して前記基板10上に短い時間(例えば、数分
稈厄)照射づる。この紫外線照射により、該基板1に極
めて薄い(100Å以下)プロセスガスのMu(IP!
成長の為の核)を形成する。次に、前記ホルダ移動FM
構11により基板10が窓17Bの直下に来る様にホル
ダ9を移動させる。ここで、レーザ光源8からレーザ光
線を窓7Bを介して、前記基板10の任意の位置に集束
して膜厚に応じた極短時間(数秒稈麿)照射する。該照
射により、可視光レーザ光線が照射された個所丈、前記
核にレーザーLネルギーが吸収され、紛が成長づる。
In such an apparatus, the holder 9 is moved by the holder moving mechanism 9 so that the substrate 10 is directly under the window 7A. First, 1) the inside of the reaction chamber 1 is made into a high vacuum using the 1-air means 4, and the exhaust port 5 is closed. In this state, a process gas (e.g., a mixed gas containing N2 gas and 3i and 14 gases) is supplied into the reaction chamber from the gas cylinder 2, and a force of about several Torr is applied inside the reaction chamber. . In this state, the surface of the substrate 10 is sufficiently coated with Dt? adsorbs gas. Next, the pressure inside the reaction chamber is adjusted to an appropriate level by appropriately setting the gas supply Φ from the gas cylinder 2, and ultraviolet rays are emitted from the ultraviolet light source 6 through the window 7△. The substrate 10 is irradiated for a short period of time (eg, several minutes). This ultraviolet irradiation causes the substrate 1 to be coated with extremely thin (100 Å or less) process gas Mu (IP!).
form a nucleus for growth). Next, the holder movement FM
The holder 9 is moved by the mechanism 11 so that the substrate 10 is directly under the window 17B. Here, a laser beam from the laser light source 8 is focused on an arbitrary position on the substrate 10 through the window 7B and irradiated for a very short time (several seconds) depending on the film thickness. As a result of the irradiation, the laser L energy is absorbed by the nucleus in the area irradiated with the visible laser beam, and particles grow.

尚、前記実施例では紫外線を照(ト)してから基板をレ
ーザ光線照射位置に移動さI!(レーリ゛光線を照射づ
る様にしているが、Jlを始めからレーザ照射位置に配
買しておき、紫外線を照射しつつレーザ光線を照射づる
様に成しCもよい。
In the above embodiment, the substrate is moved to the laser beam irradiation position after being irradiated with ultraviolet rays. (Although it is designed to irradiate a laser beam, it is also possible to arrange Jl at the laser irradiation position from the beginning and irradiate the laser beam while irradiating ultraviolet rays.

本発明によれば、波長の短い紫外線により基(長に膜成
長の為の核を形成しておき、該基板の([足位置に可視
光レーザ光線を照射して該基板の(T足位置に膜を形成
する様にしているので、安価にしかも極短時間に膜を形
成することが出来る。即ら、本発明によれば、可視光レ
ーザCVDによる核形成期間は略零となる。
According to the present invention, a nucleus for film growth is formed in the base (long) using short wavelength ultraviolet rays, and a visible laser beam is irradiated at the (T foot position of the substrate). Since the film is formed in such a manner that the film can be formed at low cost and in a very short time, the nucleation period by visible light laser CVD becomes approximately zero according to the present invention.

【図面の簡単な説明】[Brief explanation of the drawing]

添付図は本発明のレーザCV D ij法の一実施例と
しC示したレーザCV 1.)装置の概略1ツ1ぐある
。 1;友応室 2:ガスボンベ 4 : IJI気T段 6:紫外線光源 7A、713:窓 8ニレ−1f光源 9:重板ホルダ 10:基板 11:ホルダ移動機構 12:レーリ゛光学系 特許出願人 [1本電子株式会社 代表者 9藤 −夫
The attached drawings are one embodiment of the laser CV Dij method of the present invention. ) There is an outline of each device. 1; Friendship room 2: Gas cylinder 4: IJI-T stage 6: Ultraviolet light source 7A, 713: Window 8-1f light source 9: Heavy plate holder 10: Substrate 11: Holder moving mechanism 12: Rayleigh optical system patent applicant [Representative of 1Pon Electronics Co., Ltd. 9 Fuji - Husband

Claims (1)

【特許請求の範囲】[Claims] グ11セスガスが導入された反応VにJ3いて、紫外線
照射により核が形成された基板上の(f意の個所に可視
光レーザ光線を照射し°(該個所に119を成長さUる
レーザCVD方法。
11 In reaction V where a process gas has been introduced, a visible laser beam is irradiated onto a location on the substrate where a nucleus has been formed by ultraviolet irradiation. Method.
JP9253584A 1984-05-09 1984-05-09 Laser cvd method Pending JPS60236214A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9253584A JPS60236214A (en) 1984-05-09 1984-05-09 Laser cvd method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9253584A JPS60236214A (en) 1984-05-09 1984-05-09 Laser cvd method

Publications (1)

Publication Number Publication Date
JPS60236214A true JPS60236214A (en) 1985-11-25

Family

ID=14057056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9253584A Pending JPS60236214A (en) 1984-05-09 1984-05-09 Laser cvd method

Country Status (1)

Country Link
JP (1) JPS60236214A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026664A (en) * 1988-04-07 1991-06-25 Hitachi, Ltd. Method of providing a semiconductor IC device with an additional conduction path

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5940525A (en) * 1982-08-30 1984-03-06 Mitsubishi Electric Corp Growth of film

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5940525A (en) * 1982-08-30 1984-03-06 Mitsubishi Electric Corp Growth of film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5026664A (en) * 1988-04-07 1991-06-25 Hitachi, Ltd. Method of providing a semiconductor IC device with an additional conduction path

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