JPS60229705A - Formation of wooden heat-insulating board - Google Patents

Abstract

PURPOSE:To form a wooden heat-insulating board by a method in which a dry cellulosic base material is impregnated with an urea resin liquid, dried, neutralized, mixed with a resin material, and molded by expansion to form a skin layer on the surface of the expanded molding. CONSTITUTION:A cellulosic base material (e.g., broken chips, pulp, etc.) is dried to within 15wt%, and impregnated with an urea resin adhesive liquid of emulsion type. The mixture is allowed to stand for 20-30min. The urea resin-impregnated base material in neutralized, dried, and broken into sizes of 100- 150 mesh to obtain an aggregate. The aggregate so obtained is mixed with an expansible resin material 2 (e.g., urethane resin or polystyrene resin, etc.) and then with a blowing agent, a stabilizer and a deterioration inhibitor. The mixture is expanded and molded, and a skin layer 2a is provided on the surface of the molding to form a base board (a) for heat-insulating boards.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a heat insulating board having a large amount of cellulose aggregate suitable for use as a wood-like floor material or wall material having excellent heat insulation and sound insulation properties, and having a decorative surface. This is related to the provision of.

Flooring and wall materials that make up ordinary living spaces are required to have moderate moisture absorption on the one hand, and water resistance on the other hand, as well as good heat and sound insulation properties. At the same time, many characteristics, and in some cases contradictory characteristics, are required at the same time, such as appropriate sliding characteristics and appropriate contact resistance.

Many of the conventional wood-based building materials basically satisfy these characteristics, and have been used for a wide range of purposes such as flooring and wall materials. It is something.

However, architectural materials based on Karu wood,
There are many restrictions on its use depending on the characteristics of the material itself, such as whether the material is a coniferous tree or a threshold-leaved tree, or whether it is a material with a lot of resin or a material with a little resin. The characteristics of each material differ greatly depending on many conditions, such as which part of the material, that is, whether it is a square part or not.

For this reason, the board material will warp due to changes in dryness and humidity during use.
Changes such as twisting are likely to occur, and it is required to assemble the boards with these defects in mind.In addition, some materials are highly susceptible to decay and cannot withstand use in humid areas. It is assumed that there is no such case. In addition, the abrasion resistance is generally weak, and the surface is easily worn and soiled, and the water resistance is also generally poor.

The uninvented wood-like heat insulating board was developed especially in view of the inconveniences of the conventional wood materials, and also in view of the recent exhaustion of wood resources, and is made from wood chips, bulbs, rice husks, or Cellulose-based materials such as Hekasu are made into fine powder regardless of their material quality, and this fine powder aggregate is neutralized and hardened to make it compatible with the molded resin material. This eliminates the inconveniences during molding caused by the inclusion of aggregate, and makes it possible to mold and provide resin insulation boards containing a large amount of cellulose material, which was previously considered difficult.

Further, in the present invention, a skin layer is formed on the surface of the heat insulating board thus provided, and this skin layer is used to integrate decorative sheet materials, veneers, etc. This makes it especially easy to attach decorative sheet materials or veneers to the body as well as to make the material phase q adhere to the body. ``The wood-like heat insulating board according to the present invention is made of crushed chips, pulp,
Rice husks or other suitable cellulosic materials are dried so that the moisture content of the materials is within 15% to induce collapse of the fiber structure, and urea-based materials are applied to the cutting materials. The processed material is impregnated with a resin liquid, and then the processed material is dried and crushed in a temperature range of 100°C to 250°C to form a neutralized fine aggregate with a pH of 6 to 17 P), and the aggregate is molded into a molded resin material. 20 to 70 LA is mixed into the foam molding material, a skin layer is formed on the surface of the foam molded material, and a decorative sheet or veneer is attached to the skin layer. Embodiments and substantial other embodiments ancillary to these embodiments are contemplated.

Hereinafter, an example of a typical method for forming a wood-like heat insulating board according to the present invention will be described. First, the aggregate 1 is prepared from a cellulose material such as crushed chip material, pulp material, or rice husk. The material is pre-processed by drying, especially heat drying, so that the moisture content of the material is within 159Ii, which is the air-dried moisture content. As the moisture content in the material falls to within 15%, the drying process rapidly induces the destruction of the f#1 component fiber structure, forming rough bundles or lumps of cellulose. The composition of the cellulose in not only crushed chimney materials but also pulp materials and rice husks has been destroyed, and the cellulose has been separated into pieces.

An emulsion-type urea-based resin adhesive is applied to the material that has dried and the structure itself has collapsed.
By leaving it for 20 to 30 minutes, the urea-based resin adhesive liquid is sufficiently impregnated into the material, and the P)l value of the material is usually about 5.

It has been attempted, if necessary, to further adjust the P)i value of the material toward neutrality by separately adding ammonium chloride or hydrochloric acid as a hardening agent to this resin adhesive solution.

In this way, the material impregnated with the urea-based resin liquid is heated and dried at a temperature of 100 to 250°C in the next step, and then crushed and pulverized to reduce the moisture content. is within 3 to 5%, as close as possible to 0%, and is made into a fine powder of about 100 to +50 mesh.

During heating drying and crushing, the pH of the material itself is 6.
-7, and is generally adjusted to be neutral.

The neutralization treatment of the acidic material at the starting point is largely dependent on the action of the urea-based resin adhesive that is interposed during the process, and the addition of the urea-based resin adhesive is necessary. In unplanned simple heating and drying treatment of cellulose-based materials, the pH of the starting point material is P) 15, whereas the pH of the final point material, which has been made into a dry fine powder, is 2 to 3; conversely, the pH value is It tends to be acidic. On the other hand, by interposing the urea-based resin adhesive liquid, the material of P) 15 is neutralized while gradually releasing the acetic acid contained in the material as wood acid gas as it is heated and dried. The pH of the material was adjusted within the neutralization range of 6 to 7.

In the aggregate l thus provided, most of the moisture contained in the aggregate l is evaporated by the heating and drying treatment applied during the molding of the aggregate l, and it is difficult to perform resin molding using the molded aggregate. There is no generation of water vapor, which is considered a harmful effect, and no foaming, cavities, or
This eliminates the possibility of skin irritation. Furthermore, the removal of this water content also had a significant effect on the volatilization of wood acid contained in wood flour, and the wood flour contained in wood flour usually reacts with H2O groups. This effectively deterred this rather than separating from the government or dissipating the government. Therefore, the elimination of wood acid produced in the heating crushing-hardening process by impregnation with the thermosetting resin material, and the P caused by neutralization.
) In addition to the adjustments in 16 to 7, the generation of residual wood acid gas from the aggregate was effectively inhibited by -i.

The effective elimination and prevention of wood acid gas generation in the aggregate 1 had an extremely important meaning in the subsequent wood Fm molding. That is, when wood acid gas is generated during resin molding, the cylinder screw of the injection machine used for resin molding or the inner wall surface of the molding die is oxidized and corroded, drastically reducing its durability and reducing molding efficiency. reduce
In particular, this caused the problem of molding defects due to uneven injection pressure.

In addition, unlike ordinary pure wood flour, Aggregate 1 is impregnated with or adhered to a hardening resin, so the surface resistance value is extremely reduced, and the aggregate As a result, the extrusion and injection pressure when mixed and molded into a resin material is almost similar to that of general resins. On the other hand, in the past, when wood flour was mixed in, the wood powder slid into contact with the inner peripheral surface of the cylinder, gou, etc., creating considerable frictional resistance, and the inner peripheral surface of the cylinder, gou, etc. This is something that has caused scratches, wear, or damage.

Furthermore, the use of such aggregate improves the compatibility with the mixed resin material, ensures uniform mixing of the aggregate, and minimizes the voids that occur on the peripheral surface of the aggregate in the molded product. This makes it possible to provide molded products with the desired quality.

For the aggregate 1 thus prepared, foamed urethane resin or polystyrene resin, especially 4 with excellent foaming properties, is used.
! The aggregate 1 is mixed into the fat material 2 in a range of 20 to 70%, and a foaming agent, a stabilizer such as lead, a deterioration inhibitor or a coloring agent, etc. are added to the foam molding. A skin layer 2a is further provided on one or both surfaces to form a substrate a of a heat insulating board.

Next, the aggregate 1 is mixed with the resin material 3 such as vinyl chloride, especially soft vinyl chloride, in a range of 10 to 70%, stabilizers, anti-deterioration agents, coloring agents, etc. are added, and resin molding is performed. This is what constitutes the top sheet b of the heat insulating board.

In addition, in the molding of the substrate a, in addition to the usual injection molding, methods such as secondary foaming of a plate-shaped molded product by hot pressing, etc., and molding methods such as roll molding or splitting an extruded tube, etc. are planned. In c)b, roll forming and split-split forming of an extruded tube-like product are planned.

Furthermore, although the skin layer 2a is generally provided as a surface welding layer during reheating of the molded substrate a, especially during secondary foam molding, it may be necessary to separately apply an adhesive or the like. It was planned that the skin layer 2a would be formed using the following steps.

The skin layer 2 on the substrate a of the heat insulating board thus provided
A decorative material such as sheet B or middle plate C described in +iii is added to the 8th side, and by applying pressure and heating, the two are integrally fixed, and the adhesive strength is particularly good. This is what was said.

The wood-like heat insulating board according to the present invention has the above-mentioned advantages in molding by making the aggregate l have special properties, and the molded heat insulating board has the following properties. A response was observed.

That is, (1) It was confirmed that the mixed aggregate 1 and the foamed voids 4 exhibited effective heat insulation and sound insulation functions.

(2) Good abrasion resistance, particularly low friction fatigue when used as flooring and wall materials, and good durability.

Amount of wear of this case (PVC): 35.97 Amount of wear of normal PVC: 46
．． 8 (However, load 1 kg 9 rotations &? Orpm - wear wheel cs -
IIg/1000 revolutions 1lI) (3) Water resistance and moderate hygroscopicity were observed, absorbing sweat from the contact skin surface, providing good adhesion to the skin surface and a soft touch. Ta.

Water absorption rate of this case (PVC): 0.44/Water absorption rate of regular PVC: 0.
09 (However, L, JIS K?209 Water Absorption Test Force Method
Water absorption rate per unit area at 5℃ and 24br) (4)
By mixing aggregate l, there is less molding distortion, and because there is less expansion and contraction after molding, it is possible to provide flooring and wall materials with high precision, and the heat retention due to the mixed aggregate It has good properties and a warm feel to the touch.

(5) Since the aggregate is applied to the surfaces of flooring and wall materials, a moderate amount of frictional resistance is brought to the contact surfaces, reducing the possibility of unexpected sleep accidents when walking, etc. effectively eliminated.

(6) Due to the presence of aggregate l, it blends well with the mixed pigment, making it possible to create vivid colors on the wood-like surface, and since the aggregate l is exposed on the surface, When a decorative film was formed on the surface of the sheet b by printing, gun blowing, etc., it strongly adhered to the aggregate l, and peeling, cracking, etc. of the printed surface and painted film surface were reliably prevented.

(7) Because it has a large amount of aggregate 1, its processing characteristics are close to those of wood, and it is suitable for installation by processing or surface sanding, and is used as a flooring or wall material that has a natural feel and appearance similar to wood. It was possible to provide.

(8) Since the aggregate 1 was exposed on the surface, the adhesive applied well when attaching the decorative sheet B or the veneer C, and a reliable adhesive effect was expected.

(9) Since the aggregate 1 is exposed on the surface, the flooring material to be laid adheres to the 5 surfaces of the slab and does not slip, and when the flooring materials are assembled to each other, the surfaces adhere well, The slippage of the embedded flooring material was effectively prevented.

(10) By having a large amount of aggregate l, sawing treatment,
The same treatment as for ordinary wood such as nailing = 1
It was considered Noh.

(11) It has excellent water resistance and rot resistance, so even if it is installed on the slab without using a waterproof sheet etc. (μ), it will not bring moisture to the floor material surface, and at the same time This property effectively prevents over-moisture on the slab surface during long-term installation due to its breathability.

The method for forming a wood heat insulating board according to the present invention has the following characteristics and is suitable for inexpensive mass production of flooring and wall materials having good durability and weather resistance.

[Brief explanation of the drawing]

Fig. 1 is an enlarged cross-sectional view of the main part of the board a, Fig. 2 is an enlarged cross-sectional view of the main part of the sheet b and the veneer C, Fig. FIG. 4 is a perspective view of the same, and FIG. 5 is a sectional view showing an example of laying. In addition, in Figure 1, 1... aggregate, 2, 3... resin material, 4...
A void, 5...slab, 2a...skin layer are shown. Special J Applicant Iso Engineering Co., Ltd. Representative Patent Attorney Minoru Kuwahara / Figure 2 Figure 3

Claims (2)

[Claims] (1) Dry crushed chimp, pulp, rice husk, or other appropriate cellulose-based material so that the moisture content of the material is within 15% to induce collapse of its fibrous structure, and The processed material is impregnated with urea-based resin liquid.
Dry and crush within the temperature range of C. P)IS~P)17 Neutralized fine aggregate is molded, 20 to 70% of the aggregate is mixed into a molded resin material, and foam molded to form a skin layer on the surface of the foamed molded material. A method for forming a wood-like heat insulating board, characterized in that a decorative sheet J or a veneer is pasted on the skin layer together with eggplant. (2) A method for forming a wood-like heat insulating board according to claim 1, characterized in that the aggregate has a mesh size of 100 to 150 and a water content of 5% or less.