JPS60225489A - Method of fix-sealing of optical fiber with light emitting/light receiving element - Google Patents

Abstract

PURPOSE:To enable coupling of extremely small axial-shaft by a method wherein an optical fiber is sealed by fixing to a light emitting and a light receiving element with active rays and hardened type resin composite. CONSTITUTION:The optical fiber is sealed by fixing to the light emitting element and/or the light receiving element with active rays and hardened type resin composite hardening on heating. The used resin composite is hardened with active rays and on heating. Particularly, a hardened type resin composite, containing a compound (A) having at least two epoxy groups in a molecule, a photopolymerized compound (B) having a carboxyl group in a molecule, or the mixture of said compound (B) and another photopolymerized compound (C), is used.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for firmly sealing an original fiber and a light emitting/light receiving element (light emitting element and /17'h is a light receiving element).

(Relationship with Prior Art) In recent years, the practical use of nine-light transmission systems using optical fibers is rapidly progressing. Optical transmission systems are capable of multiplexed and long-distance signal transmission without repeating, and have many features not found in conventional coaxial cables, such as high electrical insulation, no electromagnetic induction, light weight, and excellent flexibility. For example, inter-city interrupted transmission lines, inter-office interrupted transmission lines, submarine cable transmission lines, subscriber transmission lines, intra-office/internal transmission lines, aircraft/ship transmission lines, data rings, image guides, light guides, and various other types. The basic configuration used in many fields such as optical measurement sensors is 1) a light emitting element section using a semiconductor laser or light emitting diode, 2) an optical fiber section as an optical transmission path, and 3) a PIN photodiode or 7-parameter. It consists of a light-receiving element using a photodiode, and by combining various optical fibers and light-emitting/light-receiving elements, it has become possible to select a system that matches the required performance. As a result, the cost performance of optical communication systems has significantly improved as the performance of each device has improved and the cost has decreased.

The light emitting elements used as light sources for optical transmission include semiconductor lasers and light emitting diodes using compound semiconductors, the former being used for medium/high speed and medium/long distance communication, and the latter for low/medium speed and short distance communication. However, what is important for any light source for optical transmission is how much light can be put into the optical fiber, that is, how large the optical coupling between the light emitting element and the optical fiber can be. Various methods have been considered for this coupling method.For example, direct coupling method in which the tip of the optical fiber is brought close to the surface of the light emitting element to increase optical coupling ↑Nine side lens coupling method using independent spherical lenses and the tip of the optical fiber There is a tip lens system that uses a lens-shaped lens.

On the other hand, light receiving elements for optical transmission are broadly divided into receiving systems using PIN photodiodes and receiving systems using avalanche photodiodes.In general, KFiPIN photodiode elements are often used for short-distance transmission systems with low receiving signal frequencies. Avalanche photodiode elements are often used in long-distance, high-capacity communication systems. Furthermore, a method of using the light emitting element also as a light receiving element has been considered.

As mentioned above, optical transmission systems basically consist of optical fibers and light emitting/receiving elements, but they also include optical connectors, optical attenuators, optical splitters, optical demultiplexers, optical switches, etc. Systems that combine circuit elements are currently being rapidly developed. While the development of elements used in various optical transmission systems is progressing in this way, as mentioned above,
One of the important requirements for optical transmission systems is the method of coupling the original fiber to the light emitting/receiving element. Generally, connections using optical connectors made by these companies are very expensive, and there are many problems that need to be improved, such as low fitting precision of the connectors. Conventionally, methods have been proposed in which an optical fiber and a light-emitting Φ light-receiving element are fixedly sealed with a thermosetting resin such as an epoxy resin.
Since curing takes a relatively long time, there is a fatal flaw in that axial misalignment occurs between the optical fiber and the light receiving element during the curing process, which significantly reduces the optical coupling efficiency.

(Purpose of the Invention) In order to solve these problems, the present inventors have conducted intensive research to obtain a coupling method with high coupling efficiency regarding the coupling method between an optical fiber and a light emitting-light receiving element. The above problems can be solved by using a curable resin composition that is cured by heating, especially a curable resin composition consisting of an epoxy compound and a photopolymerizable compound containing a photopolymerizable compound having a carboxyl group in the molecule. Solved at once 1. It is possible to couple the optical fiber with the light emitting/light receiving element in an extremely short time, and at the same time, the axis misalignment between the source fiber and the light emitting/yumine beam can be suppressed and the coupling can be suppressed. We have found that this is possible and have achieved this goal according to the present invention.

C Detailed Description of the Invention] That is, the present invention provides a light-emitting device characterized in that a fiber, a light-emitting element, and/or a light-receiving element are fixedly sealed using a curable resin composition that is cured by actinic light and heating. This is a method of fixing and sealing a 7-eyeper and a light-emitting/light-receiving element.

The optical fibers used in the present invention include 1) quartz-based optical fibers made from synthetic quartz synthesized by fermentation reaction or fire hydrolysis reaction of silicon tetrachloride, 2) sodium oxide, calcium oxide, germanium dioxide in addition to silicon dioxide. Examples include multi-component optical fibers made from multi-component glass consisting of 3) plastic optical fibers made from silicone resin, polystyrene resin, acrylic resin, etc.

The light emitting elements used in the present invention include 1) gallium arsenide, indium phosphorus, indium gallium arsenide,
Semiconductor lasers using compound semiconductors such as gallium, indium, arsenic, and phosphorus, and 2) light-emitting diodes using compound semiconductors such as gallium, aluminum, arsenic, and gallium, indium, arsenic, and phosphorus.

The light receiving elements used in the present invention include silicon avalanche photodiodes, silicon photodiodes, germanium avalanche photodiodes, indium-gallium arsenide φ avalanche photodiodes,
Germanium PIN photo diionide, indium
Gallium arsenide-PIN photodiodes, etc. are failing.

The curable resin composition used in the present invention is one that is cured by actinic light and heating.
A curable resin composition containing a mixture of a compound (3) having an epoxy group, a photopolymerizable compound Q31-f having a carboxyl group in the molecule, and another photopolymerizable compound 0 is used. .

The epoxy compound having at least two epoxy groups in the molecule used in the present invention is an epoxy compound having two or more epoxy groups in one molecule, and the epoxy equivalent thereof is 100 to 4000, preferably 100. ~100
It is 0.

A typical compound is bisphenol A.

Bisphenol type epoxy resins which are diglycidyl ethers such as bisphenol F and halogenated bisphenol A, and novolac type epoxy resins which are polyglycidyl ethers such as phenol novolak and cresol novolak are representative polyglycidyls of divalent or higher polyhydric phenols. Examples include ethers, polyglycidyl ethers of dihydric or higher polyhydric alcohols such as ethylene glycol, propylene glycol, neopentyl glycol, 1,4-butanediol, 1,6-hexanediol, and trimethylolpropane. These epoxy compounds can be used alone or in combination of two or more.

Further, epoxy compounds having one epoxy group in the molecule such as allyl glycidyl ether and phenyl glycidyl ether can also be used in combination.

Among these epoxy compounds having at least two epoxy groups in the molecule, preferred epoxy compounds include bisphenol A type epoxy compounds, phenol novolak type polyepoxy compounds, and cresol novolak type polyepoxy compounds.

Examples of the photopolymerizable compound (B) having one or more carboxyl groups in the molecule used in the present invention include (1)
Acrylic acid, methacrylic acid, itaconic acid, crotonic acid,
Unsaturated carboxylic acid compounds such as Fumaru powder (11)
There is a compound represented by the following general formula (I).

8 layers (CHr-C-COO)+R*)-A→R3 juice-4C
OOH) ----(1) m n c In the formula, R1 represents hydrogen or a methyl group, R1 and R each represent an aliphatic or aromatic-alicyclic residue, and A is It represents an ester bond, and m and n each represent a positive integer of 1 to 3. ) In the general formula (1), R1 is preferably a divalent to tetravalent hydrocarbon group having 2 to 10 carbon atoms or a hydroxyl group-containing hydrocarbon group;
A di- to tetravalent aliphatic polybasic acid residue having 6 to 6 carbon atoms
15, or a divalent to tetravalent alicyclic polybasic acid residue having 6 to 10 carbon atoms.

Examples of the compound represented by the general formula (1) include the following compounds.

Examples of the compound where m=1 and n=1 include succinic acid mono(methanoacryloyloxyethyl ester, (acryloyloxyethyl ester) and methacryloyloxyethyl ester.

Hereinafter, the following abbreviations will be made in the same manner.
Hexahydrophthalic acid mono(methacryloyloxyethyl ester, endobisic tetra(2@2-1)-
5-hebutene-2,3-dicarboxylic acid mono(meth)acryloyloxyethyl ester, tetranohydrophthalic acid mono-2-(meth)acryloyloxy-1-(phenoxymethyl)ethyl ester, phthalic acid mono-2-
Examples include hydroxy-3-(methacryloyloxypropyl ester) and conoric acid mono-2-hydroxy-3-(methacryloyloxypropyl ester).

Examples of the compound where m=1 and n=2 include trimellitic acid mono-2-(meth)acryloyloxyethyl ester. Examples of the compound where m=1% and n=3 include pyromellitic acid mono-2-(meth)acryloyloxyethyl ester.

Examples of compounds where m=2 and n=1 include -phthalic acid mono-[2,3-bis(methacryloxyisopropyl)] ester, methyltetrahydride, phthalic acid heptano[2,3-bis(meth)] Acryloyloxyisopropyl] ester, tetranohydrophthalic acid mono-[2
,3-bis(methanoacrylate yloxyisopropyl)
ester, core 1 mono-[2,3-bis(meth)acryloyloxyisopropyl] ester, and the like.

Examples of compounds where m=2 and n=2 include 1 trimellitic acid mono-[4,5-bis(meth)acryloyloxyneopentyl] ester, trimellitic acid mono-[3,
Examples include 4-bis(meth)acryloyloxyisobutyl]ester.

Examples of the compound where m=3 and n=2 include trimellitic acid mono-(3,4,5-tris(meth)acryloyloxyneopentyl) ester.

An example of the compound where m=3 and n=3 is pyromellitic acid mono-(3,4,5-)lis(meth)acryloyloxyneopentyl]ester.

Among the aforementioned compounds, (It) is particularly preferred as the photopolymerizable compound Φ). These photopolymerizable compounds (8) having a carboxyl group in the molecule can be used alone or in combination with two or more types of ta, or in combination with one or more of the other photopolymerizable compounds C) described below. used.

The amount of the photopolymerizable compound (B + C) containing one or more carboxyl groups in the molecule used in the present invention is from 10 to 100%. If the amount is less than 10% by weight, the curability of the resulting resin composition will be significantly poor.

The photopolymerizable compound 0 used in the present invention is a photopolymerizable compound having one or more photopolymerizable double bonds in the molecule.

Examples of original polymerizable compounds having one photopolymerizable double bond in the molecule include (1) methyl (methane acrylate, ethyl (meth)acrylate, n- and l-
Alkyl (methane acrylates, 2-hydroxyethyl (methane acrylate, etc.) (meth)acrylates, or polyoxyalkylene glycol mono(meth)acrylates such as polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(methane acrylate), and heterocycle-containing (methane acrylates) such as tetrahydrofurfuryl (methane acrylates). , dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)
Aminoalkyl (meth)acrylates such as acrylates, mono(methane acrylates) of alkylene oxide adducts of bisphenol A such as ethylene oxide and propylene oxide adducts of bisphenol A, (Ill) isocyanate compounds and one or more One (meth)acryloyloxy group is added in the molecule obtained by further reacting an alcoholic hydroxyl group-containing (meth)acrylate to a terminal incyanate group-containing compound obtained by reacting an alcoholic hydroxyl group-containing compound in advance. Urethane-modified mono (methane acrylates, Oφ
Epoxy mono (methane acrylates) obtained by reacting acrylic acid or methacrylic acid with a compound having one or more epoxy groups in the molecule, and acrylic acid or methacrylic acid as a fungal carboxylic acid component, polyhydric carboxylic acid, and alcohol component. Examples include oligoester mono(meth)acrylates obtained by reacting with polyhydric alcohols having a valence of two or more.

Examples of photopolymerizable compounds having two photopolymerizable double bonds in the molecule include (1) ethylene glycol di(methane acrylate, propylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, Alkylene glycol di(meth)acrylates such as meth)acrylate, neopentyl glycol di(methane acrylate, 1,6-hexanethioldi(methane acrylate), diethylene glycol di(methane acrylate,
Polyoxyalkylene glycol di(meth)acrylates such as triethylene glycol di(methane acrylate, dipropylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate 3/-), polypropylene glycol di(methane acrylate) ,(
11) DiC-methacrylates of alkylene oxide adducts of bisphenol A, such as ethylene oxide and tetrapyrene oxide adducts of bisphenol A, O1
+) A terminal isocyanate group-containing compound obtained by reacting a diisocyanate compound with two or more alcoholic hydroxyl group-containing compounds in advance, is further reacted with an alcoholic hydroxyl group-containing (meth)acrylate; Acrylic rR or /
and eboxydi obtained by reacting methacrylic acid (
Methane acrylates, (7) Acrylic acid te as a carboxylic acid component includes oligoester di[methane acrylates, etc.] obtained by reacting methacrylic acid and polyhydric carboxyl alcohol with a polyhydric alcohol of dihydric or higher valence as an alcohol component. .

Examples of photopolymerizable compounds having three or more photopolymerizable double bonds in the molecule include (+) trimethylolpropane tri(methane acrylate, trimethy4-ethane tri(meth)acrylate, pentaerythritol tetra(methane) Poly(meth)acrylates of trivalent or higher aliphatic polyhydric alcohols such as acrylates, (1) terminal isocyanate group-containing compounds obtained by reacting in advance a diisocyanate compound and a compound containing three or more alcoholic hydroxyl groups; Alcoholic hydroxyl group-containing (urethane-modified poly(methanoacrylates) having three or more (methaneacrytetrayloxy groups) in the molecule obtained by reacting methane acrylate, (11D compounds having three or more epoxy groups in the molecule) Acrylic acid or/
There are also epoxy polys (methane acrylates, etc.) obtained by reacting methacrylic acid and methacrylic acid.

The epoxy compound used in the present invention and the photopolymerizable compound having a carboxyl group in the molecule as described above @) Mata 03
) and the other photopolymerizable compound (O) in a blending ratio of epoxy compound and photopolymerizable compound [CB] '17'! −
Fi03)+(C))=10:90~90:1
0 (Model number I+1n tower wI4-r$ h -film
l / l- sl / lh & (A): Photopolymerizable compound [: 03) or (B) + (C): tin
:80 to 80:20 (weight ratio). If the amount of the epoxy compound (3) is less than 10% by weight, the photopolymerizable compound CB) having a carboxyl group in the molecule described above
The reaction between the epoxy compound and the epoxy compound is substantially too small,
It has excellent adhesion and heat resistance, making it difficult to obtain a cured product. Also,
If the amount of the epoxy compound (2) exceeds 90% by weight, the curable resin composition will not have a high viscosity and will be difficult to handle, and will not take advantage of the advantage of the curing reaction with actinic rays, that is, the fast curing property. I don't get it.

In the present invention, when performing a photopolymerization reaction of a photopolymerizable compound using actinic rays other than electron beams, the following compounds are used: Benzoin or tonohendiynes, 9.10-anthraquinone, 1-tritetra-anthraquinone, 2-chloroanthraquinone, 2-ethylanthraquinone, anthraquinones, benzophenone, p-chlorobenzophenone, p
-Penzophenones such as dimethylaminobenzophenone, 2-hydroxy-2-methylpurbiophenone, 1
-(4-isopropylphenyl)-2-hydroxy-2
- Pcipioquinones such as methylprepioquinone,
Examples include sperones such as diphenzosuberone, sulfur-containing compounds such as diphenyl disulfide, tetramethylthiuram disulfide, and thioxanthone, and pigments such as methylene blue, eosin, and fluorescein, which may be used alone or in combination of two or more.

In the present invention, the blending amount of this photoinitiator is 0.05 to 0.05 to the total amount of the epoxy compound (4) and the photopolymerizable compound.
The amount is 20% by weight, preferably 0.5 to 10% by weight.

In the present invention, when it is necessary to promote the reaction between an epoxy group and a carboxyl group, it is effective to add a reaction promoter. Examples of the reaction accelerator include 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4
- Imidazoles such as methylimidazole, 1-benzyl-2-methylimidazole I, benzyldimethylamine, triethanolamine, N,N-dimethylaminoethanol, N,N-diethylamineethanol, N.

Examples include tertiary amines such as N-dipropylaminoethanol and tertiary amine salts such as triacetate and tribenzoate of tridimethylaminomethylphenol, which may be used alone or in combination of two or more.

In the present invention, the amount of these reaction accelerators added is 0.0 with respect to the total amount of the epoxy compound (3) and the photopolymerizable compound.
5 to 5% by weight, preferably 0.1 to 3.5% by weight
It is.

The curable resin composition used in the present invention can be easily produced by stirring and mixing at room temperature or under heating if necessary. #To prevent thermal polymerization during manufacturing and dark reactions during storage,
Hydroquinone, hydroquinone methyl ether,
t-Butyl-catechol, p-benzoquinone, 2.5-
It is desirable to add a known thermal polymerization inhibitor such as 1-butyl-hydroquinone or phenothiazine. The amount added is from 0.001 to the photopolymerizable compound used in the present invention.
0.1 x amount, preferably 0.001 to 0.0
It is 5% by weight.

In addition to the above-mentioned additives, various additives such as known colorants, surface smoothing agents, antifoaming agents, etc. can be added to the curable resin composition used in the present invention, if necessary.

As a specific method for firmly sealing the source fiber and the light emitting/light receiving element of the present invention, for example, the light emitting element and the light emitting element are molded from polypropylene resin, polycarbonate resin, polymethylpentene resin, etc. /Or after setting the light-receiving element, inject the curable resin composition into the plastic case or glass case, then set the optical fiber in the case, and then use a fine movement table or the like to connect the optical fiber to the light-emitting device.
The distance between the light receiving element and the optical axis is adjusted to lose the fluidity of F) jf, 7 y. After that, the fiber is fixed and completely cured by heating. In addition, the curing method involves first polymerizing a photopolymerizable compound having a carboxyl group or a mixture of a photopolymerizable compound having a carboxyl group and another photopolymerizable compound by irradiation with actinic rays to form a carboxyl group-containing polymer, and then by heating. It consists of two steps in which the epoxy metal (4) and the carboxyl group contained in the polymer are reacted and completely cured.

The photopolymerization reaction conditions are 20 mW/13d~ for element 1.
At 200 mW/-, the time is preferably 0.1 seconds to 5 minutes. ``19 Heat curing reaction temperature: 40℃~250℃
The time is preferably 10 seconds to 120 minutes.

Light sources used for ultraviolet irradiation include sunlight, chemical lamps, low pressure mercury lamps, surface pressure mercury lamps, carbon arc lamps,
Xenon lamps, metal halide lamps, etc. are used. A photoinitiator is not necessarily required when irradiating with an electron beam.

As the heat source used for the power [+f/I%, for example, known C
Effects of the Invention) The curable resin composition used in the present invention has a curing reaction that is essentially different from that of conventional ultraviolet curable resins or thermosetting resins, so it can connect to optical fibers and emit light in a very short time.
It can be firmly sealed with the photodetector, and also has excellent adhesion, transparency,
A final fixed cured product having excellent properties such as moisture resistance, electrical insulation, and thermal shock resistance can be obtained.

Further, the following effects can be seen in the present invention.

1) Since the fluidity of the fixing sealant is lost during the irradiation with active X-rays, the fixation between the original fiber and the light-emitting/light-receiving element becomes quick and accurate, and axial misalignment after fixation is kept to an extremely low level. This speeds up the mounting line and greatly improves product yield. ◎ 2) It is possible to cure thick parts of several thicknesses, which is difficult to do with actinic light-curable resins.

3) Excellent performance such as adhesion, transparency, moisture resistance, electrical insulation, and thermal shock resistance.

4) Epoxy compound (2) and photopolymerizable compound CB in the curable resin composition! The mixture of l9 (B3 binding) has good compatibility, and the viscosity of the resin composition can be adjusted freely.

5) Since the curable resin composition is one-component, it has good workability and excellent storage stability, and since no solvent is used, it provides a good working environment.

6) The area occupied by the equipment required for the curing process is relatively small, making it economical.

(Examples) Hereinafter, the present invention will be described with reference to Examples, but the present invention is not limited to these Examples at all.

In the examples, parts and weights are shown as parts by weight and weight qbf, respectively. The performance of the curable resin composition and its cured product should be measured using the following method.

Viscosity: Measured at 25°C using a Brookfield viscometer according to JIS K6901.

Adhesiveness: The curable resin composition of the present invention is injected into a glass tube with an inner diameter of 5 cm and a height of 5 cl. Next, the knife coating layer and the plastic primary coat layer of various types of optical fibers are removed to form the tip of the optical fiber. After immersing 5gs+ in the resin, it was irradiated with ultraviolet light with an integrated light intensity of 4*880 m J / cd, and then heated at 120°C for 30 minutes. Measure next.

Transparency: A casting plate with a thickness of 3 fl was created, and the light transmittance at a wavelength of 700 nm was measured using a spectrophotometer. Electrical insulation: The volume resistivity was measured according to the method described in JIS K6911. Just in case.

Thermal shock resistance: Create a sample for adhesion measurement in the above 9.
This was subjected to a heat cycle test 12 times, with one cycle at t-40°C for 1 hour and 80'C for 1 hour.
Changes in the appearance of the cured resin after the test were visually evaluated.

Example 1 Epicor with bisphenol A type epoxy compound)
1001 (manufactured by Yuka Shell Epoxy Chemical Co., Ltd.) 100 parts,
48 parts of succinic acid monoacryloyloxyethyl ester and 70 parts of tetrahydrofurfuryl acrylate were placed in a stirring vessel, mixed and stirred at 80°C, and a transparent resin composition (
1) was obtained. The viscosity of the resulting resin composition (1) was 16 poise.

This resin composition (113,100 parts, 2-hydroxy-2-methylglopiophenone o, sls, N, N-
A curable resin composition (&) was obtained by blending 0.5 part of diethylaminoethanol. Next, the cumulative light amount is 4.800mJ/
The resin composition (a) was irradiated with ultraviolet St at d, and then heated at 120° C. for 30 minutes to obtain a cured product of the resin composition (a). The volume resistivity value was t, s x 10 m4 Ω·a at a thickness of 3 mm, and the light transmittance was 1185%.

Further, when the adhesiveness between this resin composition (a) and the quartz-based fiber was measured, the pull-out strength ff was 2.5 to 2.5. Next, we measured the axis misalignment between the quartz fiber and the resin composition (a3) during curing.
After fixing a light-emitting element (a light-emitting diode using a compound semiconductor made of gallium, aluminum, and arsenic) at the center of #1 on the bottom of a glass tube with a height of 5 cIs, the cured resin composition (1) was placed in the glass tube. Next, the optical fiber is set so that the center of the light emitting element and the center of the optical fiber almost coincide with each other, and after that, 800 mJ/cd of ultraviolet rays are irradiated to align the center of the optical fiber before and after curing with the curable resin composition. The axis misalignment with the center of the light emitting element was determined using a microscope and photography.The axis misalignment after ultraviolet irradiation was 20 μm or less, and this did not change even after heat treatment.

Even after the heat cycle test, no cracks or cracks were observed, showing excellent thermal shock resistance.

Example 2 38 parts of Bisphenol Affi epoxy compound Epicor) 828 (Yuka Shell Epoxy Chemical Exhibition), 22 parts of succinic acid monoacryloyloxyethyl ester, and 52 parts of diacrylate, an adduct of 4 moles of ethylene oxide of bisphenol A, were placed in a stirring vessel. and mixed and stirred at room temperature to obtain a transparent resin composition (2). The viscosity of the obtained hazardous resin composition (2) was 15 voids. A curable resin composition was obtained by blending 0.5 part of dibenzyl dimethyl ketal and 0.5 part of benzyl dimethylamine. Next, a cured product was obtained in the same manner as in Example 1. Its volume resistivity value is 3 at a thickness of 3n.
．． It is 6 x 10140 @ 1, and the light transmittance is 81 -.

Then, in exactly the same manner as in Example 1, the adhesion to the quartz-based optical fiber (pulling strength), the axis misalignment between the center of the optical fiber during curing and the center of the light emitting element, and the appearance after heat cycling were measured and evaluated.

The results were as follows.

Adhesion C (pulling strength) 2.3111 Axial misalignment 20 μm or less Thermal shock resistance No cracks or cracks were observed after heat cycling Good Example 3 Resin compositions (a) and ( b) Adhesion to a multi-component optical fiber, misalignment between the center of the multi-component optical fiber and the center of the light emitting element, and thermal shock resistance were measured and evaluated using T-T. The results obtained are shown in Table 1.

1st!5th! Comparative Example 1 Epicote 8, a bisphenol A type epoxy compound
28 (100 parts of Yuka Shell Epoxy Chemical Co., Ltd.), 80 parts of hexahydrophthalic anhydride, 1.8 parts of benzyldimethylamine and 1.8 parts of triphenyl phosphite were placed in a stirring container, mixed and stirred at 50°C, A transparent thermosetting resin composition (c)' was obtained.

The obtained thermosetting resin composition (c) had a viscosity of 183 voids.

Next, in exactly the same manner as in Example 1, the inner diameter was 5sgt and the height was 5sgt.
After fixing the light-emitting element in the glass tube of cIII, the thermosetting resin composition *(c) was injected. Next, insert the quartz optical fiber into the center of the glass tube so that the center of the original fiber and the center of the light emitting element are t! Set the tips so that they match, immerse the tips in the fat composition (c), and then heat at 120° C. for 30 minutes. When we measured the axis misalignment after curing, we found that it required heating for more than 20 minutes to fix the original fiber, which was cumbersome and the workability was poor, and the measured value of the axis misalignment obtained was quite large at over 300 μm. there were. Furthermore, within this range of axis misalignment, there were large variations from measurement to measurement, making it difficult to securely seal with an optical fiber with good precision.

Comparative Example 2 40 parts of diacrylate of 4 moles of ethylene oxide adduct of bisphenol A, 15 parts of tetrahydrofurfuryl acrylate, and 15 parts of trimethylolbupan triacrylate were placed in a stirring vessel, mixed and stirred at room temperature, and a transparent resin composition ( 3) Source. The obtained resin composition (3
) had a viscosity of 4 voids. The obtained resin composition (3
3 parts of benzoin ethyl ether was added to 1100 parts to obtain an ultraviolet curable resin composition (d).

Next, in exactly the same manner as in Example 1, the inner diameter was 5u and the height was 5cI.
After fixing the light emitting element in the glass tube s, the ultraviolet curable resin composition (d) is injected, and the quartz-based optical fiber is placed in the center of the glass tube so that the center of the optical fiber and the center of the light emitting element almost coincide with each other. set, its tip 5 is immersed in the resin composition (d), and then the cumulative light amount is 4 soo m.
J/- ultraviolet rays were irradiated to measure axis misalignment and adhesion. The axis misalignment between the center of the quartz-based optical fiber and the center of the light emitting element before and after curing of this ultraviolet curable resin composition (d) was less than 20 μm, and the fluctuation was low. '1 or less, and the adhesiveness is extremely poor. fc.

Patent applicant: Toyobo Co., Ltd.

Claims (2)

[Claims] (1) Adhesive sealing of an optical fiber and a light-emitting/light-receiving element, characterized in that the optical fiber and the light-emitting element and/or the light-receiving element are firmly sealed using a curable resin composition that is cured by actinic rays and heating. How to stop. (2) The curable resin composition that is cured by actinic light and heating is a compound (A) having at least two epoxy groups in the molecule and a photopolymerizable compound (B) having a carboxyl group in the molecule, or the compound 03) and another photopolymerizable compound (C). .