JPS60225453A - Formation of resist pattern - Google Patents

Formation of resist pattern

Info

Publication number
JPS60225453A
JPS60225453A JP8009584A JP8009584A JPS60225453A JP S60225453 A JPS60225453 A JP S60225453A JP 8009584 A JP8009584 A JP 8009584A JP 8009584 A JP8009584 A JP 8009584A JP S60225453 A JPS60225453 A JP S60225453A
Authority
JP
Japan
Prior art keywords
ink
printing
pattern
screen printing
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8009584A
Other languages
Japanese (ja)
Inventor
Shiro Takahashi
四郎 高橋
Hiroshi Igarashi
五十嵐 博史
Yutaka Yamada
豊 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP8009584A priority Critical patent/JPS60225453A/en
Publication of JPS60225453A publication Critical patent/JPS60225453A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports

Abstract

PURPOSE:To contrive the continuous formation of fine resist patterns on a long roll of metallic band by a method wherein a fine pattern is printed on the surface of the metallic band by means of a printing machine having a screen printing plate with the number of mesh of 130 or more and an ultraviolet-setting printing ink having resisting property, and is then hardened with ultraviolet rays. CONSTITUTION:A long roll of metallic band 2 rolled out of a take-up reel 1, when passing through a printing roller 3 and an impression drum 4 which rotate in pressure contact, is given a fixed pattern thereon. The printing roller 3 is cylindrical with a stretch of a screen printing plate in the periphery, and is provided inside with a squeegee 5 and an ink supply port 6 lying from one end of the printing roller 3 to the other end, and with an ink vacuum port 7 in the neighborhood of the end. The ink in a tank 8 is supplied from the ink supply port 6 into the printing roller 3 by means of a pump 9, and the ink flowing out to the edge of the squeegee 5 during printing is sucked from the ink vacuum port 7 by means of a pump 10 and then fed back to the tank 8. The printed pattern on the metallic hand 2 hardens by being exposed to ultraviolet rays when passing through the bottom of an ultraviolet irradiation device 11. Thereafter, the metallic band 2 is rolled up by the take-up reel 12. A substance having resisting property is used for the screen printing ink setting with ultraviolet rays.

Description

【発明の詳細な説明】 (産業上の利用分野〕 電子部品や電子機器に使われているリードフレームやコ
ネクター、スイッチ等などの基材には銅合金、ステンレ
ス等が使われているが、素子端子の接続部やコンタクト
部分の完全な電気的接触と長期耐久性の保証のために金
、銀、その他の貴金属のメッキが不可欠である。最近こ
れらの、貴金属メッキは省貴金属、コスト低下の要求か
らボンディング又はコンタクトすべき小面積部分にだけ
パターンメッキされるようになってきた。本発明はこの
ようなパターンメッキを可能とするための微細なレジス
トパターンの形成方法に関する。
[Detailed Description of the Invention] (Industrial Application Field) Copper alloys, stainless steel, etc. are used for the base materials of lead frames, connectors, switches, etc. used in electronic components and electronic devices, but Plating with gold, silver, and other precious metals is essential to ensure complete electrical contact and long-term durability of terminal connections and contacts.Recently, these precious metal platings are required to reduce precious metals and reduce costs. Since then, pattern plating has been performed only on small areas to be bonded or contacted.The present invention relates to a method for forming a fine resist pattern to enable such pattern plating.

〔従来の技術〕[Conventional technology]

パターンメッキされる基材は、従来、金属帯片として生
産工程に供給され、不連続な生産処理が行われてきたが
、効率の高い大量生産のためには長巻の金属帯又はフー
プの形で連続生産工程に供給される必要がある。
Traditionally, substrates to be pattern plated have been supplied to the production process as metal strips, which have been processed in discontinuous manners, but for highly efficient mass production, they have been supplied in the form of long metal strips or hoops. must be fed into a continuous production process.

パターンメッキされた長巻の金属又はフープを作製する
ためには、パターンメッキすべき部分のみを残して表裏
全面をメツキレシスト膜でマスキングした長巻の金属帯
の基材が作製されなければならない。このようなレジス
トパターンを連続的に形成する方法としては平版印刷、
凸版印刷などの印刷方式が考えられるが、これらの抑刷
方式によればレジストパターンの膜厚が薄くならざるを
得ず、充分なレジスト性を確保することは困難である。
In order to produce a pattern-plated long-wound metal strip or hoop, a long-wound metal strip base material must be prepared in which the entire front and back surfaces are masked with a metal resist film, leaving only the portion to be pattern plated. Methods for continuously forming such resist patterns include lithographic printing,
Printing methods such as letterpress printing can be considered, but these press printing methods inevitably result in a thin resist pattern, making it difficult to ensure sufficient resistivity.

スクリーン印刷方式によれば充分な厚さをもつレジスト
膜厚を形成し得るが、従来からレジストパターンの形成
によく使用されているフラットスクリーン印刷方式は枚
葉印刷方式であるため、長巻の金属帯に対する連続パタ
ーンの □印刷には不向きである。一方、ロータリース
クリーン印刷方式は捺染印刷の分野で使用されているが
、布地に厚さ100μ程度の印刷皮膜を形成することを
目的としてスクリーン版が作製されているために、スク
リーン目が粗く、微細なレジストパターンの形成に使用
できるものではなかった。
The screen printing method can form a resist film with sufficient thickness, but since the flat screen printing method, which has traditionally been commonly used to form resist patterns, is a sheet-fed printing method, it is possible to form a resist film with a sufficient thickness. □Not suitable for printing continuous patterns on bands. On the other hand, the rotary screen printing method is used in the field of textile printing, but since the screen plate is made with the purpose of forming a printing film with a thickness of about 100 μm on the fabric, the screen pattern is coarse and fine. It could not be used to form a resist pattern.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明の目的は、長巻の金属帯に微細なレジストパター
ンを連続的に形成する方法を提供することにある。
An object of the present invention is to provide a method for continuously forming a fine resist pattern on a long metal strip.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、上記目的を達成する方法として、メツシュ数
130以上のスクリーン版を有するロータリースクリー
ン印刷機とレジスト性を有する紫外線硬化性スクリーン
印刷インキを用いて金属帯表面に微細パターンを印刷し
、この印刷パターンを紫外線に露出して硬化させること
を特徴とするレジストパターンの形成方法を提供する。
As a method for achieving the above object, the present invention prints a fine pattern on the surface of a metal strip using a rotary screen printing machine having a screen plate with a mesh number of 130 or more and an ultraviolet curable screen printing ink having resist properties. A method for forming a resist pattern is provided, which comprises exposing a printed pattern to ultraviolet light and curing it.

第1図は本発明を実施するための装置の概略図である。FIG. 1 is a schematic diagram of an apparatus for carrying out the invention.

巻出リール(1)から巻出された長巻の金属帯(2)は
、圧接して回転する版胴(3)と圧胴(4)の間を通過
し、その際、金属帯(2)上に所定のパターンが印刷さ
れる。
The long metal strip (2) unwound from the unwinding reel (1) passes between the plate cylinder (3) and the impression cylinder (4), which rotate in pressure contact with each other. ) on which a predetermined pattern is printed.

版胴(3)は周面にスクリーン版を張設した円筒形状の
、もので、内部に、版胴(3)の一端から他端に到るス
キージ−(5)とインキ供給口(6)を設け、端部付近
にインキ吸引口(7)が設けられている。タンク(8)
内に収容されたインキはポンプ(9)によってインキ供
給口(6)から版胴(3)の内部に供給され、印刷中に
スキージ−(5)の端に流れ出てくるインキはポンプ(
lO)によってインキ吸引口(7)から吸引しタンク(
8)に帰還させる。金属帯(2)上に印刷された印刷パ
ターンは紫外線照射装置(11)の下を通過する際、紫
外線に露出されて硬化する。
The plate cylinder (3) has a cylindrical shape with a screen plate stretched around its circumference, and inside there is a squeegee (5) extending from one end of the plate cylinder (3) to the other end and an ink supply port (6). An ink suction port (7) is provided near the end. Tank (8)
The ink stored in the plate cylinder (3) is supplied from the ink supply port (6) to the inside of the plate cylinder (3) by the pump (9), and the ink flowing out to the end of the squeegee (5) during printing is removed by the pump (9).
The ink is sucked from the ink suction port (7) by the ink tank (
8). The printed pattern printed on the metal strip (2) is exposed to ultraviolet light and cured when passing under the ultraviolet irradiation device (11).

その後、金属帯(2)は巻取リール(12)によって巻
取ら・れる。
Thereafter, the metal strip (2) is wound up by a take-up reel (12).

紫外線硬化性スクリーン印刷インキはメツキレシスト性
、ソルダーレジスト性、エツチングレジスト性等各種レ
ジスト性を有するものが使用され、これは公知の各種紫
外線硬化性原料及び助剤類を使用して作製することがで
きる。例えば紫外線重合性不飽和二重結合特に好ましく
は(メタ)アクリル系二重結合を1分子中に少なくと石
2個以上有するアクリル、ポリエステル、ポリウレタン
、ポリアミド、エポキシ系等の各種ポリマー又はプレポ
リマーを紫外線重合性七ツマ−1特に好ましくは(メタ
)アクリル系モノマーで希釈し、これに周知の増感剤、
更に必要に応じて着色顔料、体質顔料、モノマーおよび
プレポリマーに相溶性のよい非反応性樹脂、各種助剤等
を添加して適性粘度に調整することにより作製すること
ができる。
UV-curable screen printing inks are used that have various resist properties such as metki resist properties, solder resist properties, and etching resist properties, and can be produced using various known UV-curable raw materials and auxiliary agents. . For example, various polymers or prepolymers such as acrylic, polyester, polyurethane, polyamide, and epoxy-based polymers having at least two or more (meth)acrylic double bonds in one molecule, particularly preferably UV-polymerizable unsaturated double bonds. Ultraviolet polymerizable 7-mer-1 is particularly preferably diluted with a (meth)acrylic monomer, and a well-known sensitizer,
Furthermore, it can be produced by adding a highly compatible non-reactive resin, various auxiliary agents, etc. to the coloring pigment, extender pigment, monomer, and prepolymer as necessary to adjust the viscosity to an appropriate level.

次に実施例により本発明を具体的に説明する。Next, the present invention will be specifically explained with reference to Examples.

実施例 下記成分を3本ロールミルで練肉してメツキレシスト性
を有する紫外線硬化性スクリーン印刷インキを作製した
Example The following components were kneaded in a three-roll mill to prepare an ultraviolet curable screen printing ink having mesh-resistance properties.

7タロシアニン顔料 1重量部 タ ル り 15 # 2−エチルアントラキノン(増感剤) 3 〃エポキシ
エステル樹脂 20 〃 紫外線重合性エポキシアクリレート樹脂 35 〃トリ
メチロールプロパントリアクリレート 20 〃2−ヒ
ドロキシエチルメタアクリレート 5 〃流れ改良助剤
 1 〃 ロータリースクリーン印刷機(オリジン電気社製)に2
.5m/m1mのストライプパターンを有する155メ
ツシユのスクリーン版を取付け、上記インキを使って厚
み0.1m / m 、幅100m/mのコイル状に巻
いたステンレス製金属帯の表面に4m/分のスピードで
連続印刷し、印刷パターンを紫外線で硬化させて金属帯
表面にストライブパターンのレジスト硬化皮膜を形成し
た。
7 Talocyanine pigment 1 part by weight Tartar 15 #2-Ethylanthraquinone (sensitizer) 3 Epoxy ester resin 20 Ultraviolet polymerizable epoxy acrylate resin 35 Trimethylolpropane triacrylate 20 2-Hydroxyethyl methacrylate 5 Flow improvement aid 1 〃 2 for rotary screen printing machine (manufactured by Origin Electric Co., Ltd.)
.. A 155-mesh screen plate with a stripe pattern of 5 m/m and 1 m was attached, and the above ink was applied to the surface of a stainless steel metal strip wound into a coil with a thickness of 0.1 m/m and a width of 100 m/m at a speed of 4 m/min. The printed pattern was then cured with ultraviolet rays to form a hardened resist film in the form of a stripe pattern on the surface of the metal strip.

一方、金属帯の裏面はベタのスクリーン版を使って全面
印刷し、同様に硬化させた。このようにしてパターン形
成された金属帯を特開昭56−126206号明細書の
メッキ工程手順に従って脱脂、化学研摩、電解活性化及
び金メッキの各処理を行い、次いで市販の塩化メチレン
主体の剥輔*II−yr +−,1; −y L th
mえ加l錯?プ 4帽マリ[ニノっり謳1ν人メッキさ
れたステンレス金属体を得た。
On the other hand, the back side of the metal strip was printed on the entire surface using a solid screen plate and cured in the same way. The metal strip patterned in this way is subjected to degreasing, chemical polishing, electrolytic activation, and gold plating according to the plating process procedure described in JP-A-56-126206, and then a commercially available methylene chloride-based stripper. *II-yr +-, 1; -y L th
Melancholy? I obtained a plated stainless steel metal body.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く、本発明の方法によれば、長巻の金属
帯に微細なレジストパターンを連続的に形成できるので
、電子部品の素子端子の接続部やコンタクト部分に使わ
れる部分的な貴金属メッキに必要なレジストパターンの
連続的生産が可能となる。しかし、本発明の方法は、上
記の如きメツキレシストパターンの形成に限られるもの
でなく、プリント配線板のためのレジストパターンのほ
か、金属、プラスチック、セラミック、ガラス、木材等
の各種基材表面をメッキ、エツチング、ホーニング、着
色゛、変質等の各種物理的、化学的手段で加工する際に
必要とされるレジストパターンの形成にも使える。
As explained above, according to the method of the present invention, it is possible to continuously form a fine resist pattern on a long metal strip, so that it is possible to form a fine resist pattern continuously on a long metal strip. It becomes possible to continuously produce the resist patterns necessary for However, the method of the present invention is not limited to the formation of a resist pattern as described above, and can also be used to form resist patterns for printed wiring boards, as well as the surfaces of various substrates such as metal, plastic, ceramic, glass, and wood. It can also be used to form resist patterns required when processing materials by various physical and chemical means such as plating, etching, honing, coloring, and alteration.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の方法を実施するための装置の概略図で
あり、(1)は巻出しリール、(2)は金属帯、(3)
は版胴、(4)は圧胴、(5)はスキージ−1(6)は
インキ供給口、(7)はインキ吸引口、(8)はタンク
、(9)、(10)はポンプ、(11)は紫外線照射装
置、(12)は巻取リールを表す。 代理人 弁理士 高 橋 勝 利
FIG. 1 is a schematic diagram of an apparatus for carrying out the method of the present invention, in which (1) is an unwinding reel, (2) is a metal strip, and (3) is an unwinding reel.
is the plate cylinder, (4) is the impression cylinder, (5) is the squeegee, (6) is the ink supply port, (7) is the ink suction port, (8) is the tank, (9) and (10) are the pump, (11) represents an ultraviolet irradiation device, and (12) represents a take-up reel. Agent Patent Attorney Katsutoshi Takahashi

Claims (1)

【特許請求の範囲】[Claims] メツシュ数130以上のスクリーン版を有するロータリ
ースクリーン印刷機とレジスト性を有する紫外線硬化性
スクリーン印刷インキを用いて金属帯表面に微細パター
ンを印刷し、この印刷パターンを紫外線に露出して硬化
させることを特徴とするレジストパターンの形成方法。
A fine pattern is printed on the surface of the metal strip using a rotary screen printing machine equipped with a screen plate with a mesh number of 130 or more and an ultraviolet curable screen printing ink with resist properties, and this printed pattern is exposed to ultraviolet light and cured. Characteristic resist pattern formation method.
JP8009584A 1984-04-23 1984-04-23 Formation of resist pattern Pending JPS60225453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8009584A JPS60225453A (en) 1984-04-23 1984-04-23 Formation of resist pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8009584A JPS60225453A (en) 1984-04-23 1984-04-23 Formation of resist pattern

Publications (1)

Publication Number Publication Date
JPS60225453A true JPS60225453A (en) 1985-11-09

Family

ID=13708632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8009584A Pending JPS60225453A (en) 1984-04-23 1984-04-23 Formation of resist pattern

Country Status (1)

Country Link
JP (1) JPS60225453A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135767A (en) * 1988-11-17 1990-05-24 Hitachi Ltd Formation of pattern and brazing method
ITVI20110122A1 (en) * 2011-05-13 2012-11-14 St Microelectronics Srl METHOD AND APPARATUS FOR THE MANUFACTURE OF LEAD FRAMES
CN104540331A (en) * 2014-12-31 2015-04-22 广州兴森快捷电路科技有限公司 Printed circuit board solder mask manufacturing method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135767A (en) * 1988-11-17 1990-05-24 Hitachi Ltd Formation of pattern and brazing method
ITVI20110122A1 (en) * 2011-05-13 2012-11-14 St Microelectronics Srl METHOD AND APPARATUS FOR THE MANUFACTURE OF LEAD FRAMES
WO2012156034A1 (en) * 2011-05-13 2012-11-22 Stmicroelectronics S.R.L. Method and apparatus for manufacturing lead frames
CN103650122A (en) * 2011-05-13 2014-03-19 意法半导体股份有限公司 Method and apparatus for manufacturing lead frames
US9461011B2 (en) 2011-05-13 2016-10-04 Stmicroelectronics S.R.L. Method and apparatus for manufacturing lead frames
CN107622952A (en) * 2011-05-13 2018-01-23 意法半导体股份有限公司 Method and apparatus for manufacturing lead frame
CN107622952B (en) * 2011-05-13 2020-06-16 意法半导体股份有限公司 Method and apparatus for manufacturing lead frame
CN104540331A (en) * 2014-12-31 2015-04-22 广州兴森快捷电路科技有限公司 Printed circuit board solder mask manufacturing method

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