JPS60216619A - Surface acoustic wave splitter - Google Patents

Surface acoustic wave splitter

Info

Publication number
JPS60216619A
JPS60216619A JP7379284A JP7379284A JPS60216619A JP S60216619 A JPS60216619 A JP S60216619A JP 7379284 A JP7379284 A JP 7379284A JP 7379284 A JP7379284 A JP 7379284A JP S60216619 A JPS60216619 A JP S60216619A
Authority
JP
Japan
Prior art keywords
saw
surface acoustic
generator
splitter
acoustic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7379284A
Other languages
Japanese (ja)
Inventor
Shiro Ogata
司郎 緒方
Junichi Takagi
高木 潤一
Naohisa Inoue
直久 井上
Masaharu Matano
俣野 正治
Maki Yamashita
山下 牧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Tateisi Electronics Co
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tateisi Electronics Co, Omron Tateisi Electronics Co filed Critical Tateisi Electronics Co
Priority to JP7379284A priority Critical patent/JPS60216619A/en
Publication of JPS60216619A publication Critical patent/JPS60216619A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/74Multiple-port networks for connecting several sources or loads, working on the same frequency or frequency band, to a common load or source
    • H03H9/76Networks using surface acoustic waves

Abstract

PURPOSE:To allow an SAW generator to produce plural surface acoustic waves (SAW) by constituting the generator where plural slots are arranged with a prescribed interval and a prescribed angle on an SAW propagating path of a medium through which a surface acoustic wave SAW is propagated. CONSTITUTION:The SAW generator 11 where many parallel electrodes are connected alternately and formed by metallic vapor-deposition is provided on an acoustooptic substrate 10 made of an LiNbO3 crystal. A high frequency signal is impressed to the SAW generator 11 from a high frequency signal generator 13. An SAW splitter 12 made of many slots having an angle satisfying the diffraction condition of the Bragg in the propagating direction of the SAW1 and with a prescribed interval is formed. A part of the SAW1 is subjected to the Bragg diffraction is branched as an SAW2 by the splitter 12 and the other part is transmitted as it is and becomes an SAW3.

Description

【発明の詳細な説明】 発明の背景 この発明は、基板その他の媒体表面を伝播する弾性表面
波を少なくとも2方向に分岐ないし分割させる弾性表面
波スプリッタに関する。
BACKGROUND OF THE INVENTION The present invention relates to a surface acoustic wave splitter that branches or splits surface acoustic waves propagating on the surface of a substrate or other medium into at least two directions.

弾性表面波(以下SAWという)は、光、電子、通信機
器その仙の素子に広く応用されつつある。しかしながら
、1つのSAWを2方向以上に分岐させるSAWスプリ
ッタはまだ実現されていない。SAW利用素子等におい
て、複数のSAWが必要な場合には複数のSAW発生手
段、たとえばインターディジタル・1−ランスデューサ
(以下[)Tという)を設Cブでいた。しかしながら、
複数のSAW発生手段を1基板上に設りるとその分だけ
配置スペースが必要であるから素子の形状が大きくなる
、SAW発生手段の形状のばらつきのために同一特性の
SA、Wが得にくい、SAW発生手段としてIDTを採
用した場合には、これを複数個形成しようとするど電極
作成過程での歩留りが低下するなどの諸問題があった。
Surface acoustic waves (hereinafter referred to as SAW) are being widely applied to elements of optical, electronic, and communication equipment. However, a SAW splitter that branches one SAW into two or more directions has not yet been realized. When a plurality of SAWs are required in a SAW-using element, a plurality of SAW generating means, such as an interdigital one-transducer (hereinafter referred to as "T"), have been installed. however,
When multiple SAW generation means are installed on one substrate, the space required for the arrangement increases, which increases the size of the element.Due to variations in the shape of the SAW generation means, it is difficult to obtain SA and W with the same characteristics. When an IDT is employed as a SAW generating means, there are various problems such as a decrease in yield in the electrode manufacturing process when attempting to form a plurality of IDTs.

発明の概要 この発明は、1つのSAW発生手段から得られる1つの
SAWを少なくとも2つに分岐、分割させるSAWスプ
リッタを提供し、上記のような諸問題を解決することを
目的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a SAW splitter that branches and splits one SAW obtained from one SAW generating means into at least two, and to solve the above-mentioned problems.

この発明によるSAWのスプリッタは、SAWが伝播す
る媒体のSAW伝播路上に、複数の溝が所定間隔で形成
され、SAWの伝播方向に所定の角度で配列されている
ことを特徴とする。
The SAW splitter according to the present invention is characterized in that a plurality of grooves are formed at predetermined intervals on a SAW propagation path of a medium through which the SAW propagates, and are arranged at a predetermined angle in the SAW propagation direction.

この発明によると、1つのSAWが複数の異なる方向に
伝播するSAWに分岐されるので、1基板上に形成すべ
きSAW発生手段の数を減少させることが可能であり、
素子形状を小ざくすることができるようになるとともに
、SAW発生手段としてIDTを用いる場合にもその作
成工程における歩留りを向上することが可能である。ま
た、分岐されたSAWの+iJを等しくすることができ
る。基板が等方性であれば分岐されたSAWの特性が同
一となるので好ましい。
According to the present invention, since one SAW is branched into a plurality of SAWs propagating in different directions, it is possible to reduce the number of SAW generation means to be formed on one substrate,
The device shape can be made smaller, and even when an IDT is used as a SAW generating means, it is possible to improve the yield in the manufacturing process. Further, +iJ of the branched SAWs can be made equal. It is preferable if the substrate is isotropic because the characteristics of the branched SAWs will be the same.

溝の長さや深さを変えることにより分岐覆るSA、Wの
強度を任意に設定することができ、分岐角は港の間隔を
変えることにより任意に定めることが可能である。
By changing the length and depth of the grooves, the strength of the branch covering SA and W can be arbitrarily set, and the branching angle can be arbitrarily determined by changing the interval between ports.

実施例の説明 第1図において、LiNb0a結晶等の音響光学基板(
10)上の一部にI D T (11)が形成されてい
る。I D T (11)はよく知られているように、
互いに平行な多数の電極が交互に接続されることにより
構成されている。jD丁(11)はマスキング技術を併
用した金属蒸着等により形成される。このI D T 
(111には高周波信号発生器(13)から高周波信号
が印加される。これにより、ID T (11)からS
AW1が発生し、I D T (11)の電極と直交す
る方向に伝播していく。
Description of Examples In FIG. 1, an acousto-optic substrate (such as a LiNb0a crystal)
10) I D T (11) is formed in a part of the upper part. As I D T (11) is well known,
It is constructed by connecting a large number of mutually parallel electrodes alternately. The jD block (11) is formed by metal vapor deposition using a masking technique. This ID
(A high frequency signal is applied to 111 from the high frequency signal generator (13). As a result, from ID T (11) to S
AW1 is generated and propagates in a direction perpendicular to the electrode of I D T (11).

I D T (11)から発生した5AWIの伝播路上
において、基板(10)にはSAWのスプリッタ(12
)が形成されている。スプリッタ(12)は、第2図に
拡大されて示されているように、基板(10)表面上に
形成され、一定間隔dで平行に配列された多数の溝(1
4)から構成されている。溝(14)の方向は、5AW
Iの伝播方向に対してブラッグ回折条件を満足する角度
θに形成されている。
On the propagation path of 5AWI generated from IDT (11), there is a SAW splitter (12) on the substrate (10).
) is formed. The splitter (12) is formed on the surface of the substrate (10), as shown enlarged in FIG.
4). The direction of the groove (14) is 5AW
It is formed at an angle θ that satisfies the Bragg diffraction condition with respect to the propagation direction of I.

5AW1は溝(14)によってその一部がブラッグ回折
して5AW2として分岐される。5AW1の他の部分は
そのまま溝(14)を透過し5AW3として直進する。
A portion of 5AW1 undergoes Bragg diffraction due to the groove (14) and is branched as 5AW2. The other part of 5AW1 passes through the groove (14) as it is and goes straight as 5AW3.

5AW2と5AW3の巾は等しい。5AW2と5AW3
への分岐比は、溝(14)の深さと長さTによって任意
に設定することができる。また分岐角度は溝(14)の
間隔dを変えることによって任意に設定Jることが可能
である。溝(14)はたとえば、イオンビーム加工(エ
ツチング)、レーザ加工等により形成される。
The widths of 5AW2 and 5AW3 are equal. 5AW2 and 5AW3
The branching ratio to can be arbitrarily set by the depth and length T of the groove (14). Furthermore, the branching angle can be arbitrarily set by changing the interval d between the grooves (14). The groove (14) is formed by, for example, ion beam processing (etching), laser processing, or the like.

第3図は、SAWスプリッタの応用例を示しており、マ
ツハツエンダ型のSAW伝播路が形成されている。基板
(20)どしてはガラスのような等方性の材何が用いら
れている。基板(20)の一部に形成されたI D T
 (11)上には、ZnOのような圧電性結晶(21)
が装fJされている。この結晶(21)の上面の一部は
5AWIの伝播方向に向って厚さが減少するように傾斜
状に形成されている。圧電性結晶(21)の存在によっ
てSAWの伝播効率が向上する。
FIG. 3 shows an application example of the SAW splitter, in which a Matsuhatsu Enda type SAW propagation path is formed. The substrate (20) is made of an isotropic material such as glass. IDT formed on a part of the substrate (20)
(11) On top is a piezoelectric crystal such as ZnO (21)
is equipped with fJ. A part of the upper surface of this crystal (21) is formed in an inclined shape so that the thickness decreases in the direction of propagation of 5AWI. The presence of the piezoelectric crystal (21) improves the propagation efficiency of the SAW.

I D 7 (11)から発生した5AW1はSAWス
プリッタ(12)によって回折波5AW2と直進波5A
W3とに分岐される。これらの5AW2と5AW3とは
基板(20)上に形成された反射溝(22)(23)で
それぞれ方向変換され、5AW3.はこの反射ののち直
進してSAWの検知器(25)、たどえばI DT、に
より電気信号に変換される。
5AW1 generated from ID 7 (11) is divided into diffracted wave 5AW2 and straight wave 5A by SAW splitter (12).
It is branched into W3. The directions of these 5AW2 and 5AW3 are changed by reflection grooves (22) and (23) formed on the substrate (20), respectively, and 5AW3. After this reflection, the signal travels straight and is converted into an electrical signal by the SAW detector (25), ie, the IDT.

反射溝(22)で反射した5AW2はさらに反射溝(2
4)で反射して検知器(25)に検知される。検知器(
25)の出力信号は高周波アナライザ(26)に送られ
る。
5AW2 reflected by the reflection groove (22) is further reflected by the reflection groove (22).
4) and is detected by the detector (25). Detector (
The output signal of 25) is sent to a high frequency analyzer (26).

5AW2と5AW3の伝播路長が等しければ、検知器(
25)はI D T (11)で励振された5AW1と
同じ波形のSAWを検知する。一方のSAWの伝播路、
たとえば5AW3の伝播路のうち反04 tfli (
23)と反射ff+7(24)の位置との間に、熱など
の何らかの物理量が加えられる領域(R)を設【ノてお
き、この領域(R)における基板(20)の密度、屈折
率などを変化させる。5AW3はこの領域(R>を通過
するときに領域(R)に加えられる物理量によって変調
される。したがって、5AW2と5AW3とは反射溝(
24)よりも検知器(25)側で合波されたときに干渉
し、この干渉に関する情報がアナライザ(26)によっ
て分析される。アナライザ(26)によるSAWの干渉
性の分析にもとづいて、領域(R)に加えられた物理量
の大きさなどを知ることができる。
If the propagation path lengths of 5AW2 and 5AW3 are equal, the detector (
25) detects a SAW having the same waveform as 5AW1 excited by I D T (11). One SAW propagation path,
For example, in the propagation path of 5AW3, anti-04 tfli (
A region (R) to which some physical quantity such as heat is applied is set between the position of reflection ff+7 (24) and the density, refractive index, etc. of the substrate (20) in this region (R). change. 5AW3 is modulated by the physical quantity applied to the region (R) when passing through this region (R>. Therefore, 5AW2 and 5AW3 are the reflection grooves (
When multiplexed on the detector (25) side of the detector (24), the signals interfere, and information regarding this interference is analyzed by the analyzer (26). Based on the analysis of SAW coherence by the analyzer (26), it is possible to know the magnitude of the physical quantity added to the region (R).

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の実施例を示す斜視図、第2図はSA
Wスプリッタを拡大して示す平面図、第3図はSAWス
プリッタの応用例を示す斜視図である。 (10)・・・基板、(12)・・・SAWスプリッタ
、(14)・・・反射溝。 以上 第2図 \
Figure 1 is a perspective view showing an embodiment of this invention, Figure 2 is a SA
FIG. 3 is a plan view showing an enlarged W splitter, and FIG. 3 is a perspective view showing an application example of the SAW splitter. (10)...Substrate, (12)...SAW splitter, (14)...Reflection groove. Above is Figure 2\

Claims (1)

【特許請求の範囲】[Claims] 弾性表面波が伝mする媒体の弾性表面波伝播路上に、複
数の溝が所定間隔で形成され、弾性表面波の伝播方向に
所定の角度で配列されている、弾性表面波スプリッタ。
A surface acoustic wave splitter in which a plurality of grooves are formed at predetermined intervals on a surface acoustic wave propagation path of a medium through which surface acoustic waves propagate, and are arranged at a predetermined angle in the propagation direction of the surface acoustic waves.
JP7379284A 1984-04-11 1984-04-11 Surface acoustic wave splitter Pending JPS60216619A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7379284A JPS60216619A (en) 1984-04-11 1984-04-11 Surface acoustic wave splitter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7379284A JPS60216619A (en) 1984-04-11 1984-04-11 Surface acoustic wave splitter

Publications (1)

Publication Number Publication Date
JPS60216619A true JPS60216619A (en) 1985-10-30

Family

ID=13528390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7379284A Pending JPS60216619A (en) 1984-04-11 1984-04-11 Surface acoustic wave splitter

Country Status (1)

Country Link
JP (1) JPS60216619A (en)

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