JPS60213028A - 終点検出方法 - Google Patents
終点検出方法Info
- Publication number
- JPS60213028A JPS60213028A JP59069490A JP6949084A JPS60213028A JP S60213028 A JPS60213028 A JP S60213028A JP 59069490 A JP59069490 A JP 59069490A JP 6949084 A JP6949084 A JP 6949084A JP S60213028 A JPS60213028 A JP S60213028A
- Authority
- JP
- Japan
- Prior art keywords
- time
- level
- period
- etching
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59069490A JPS60213028A (ja) | 1984-04-06 | 1984-04-06 | 終点検出方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59069490A JPS60213028A (ja) | 1984-04-06 | 1984-04-06 | 終点検出方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60213028A true JPS60213028A (ja) | 1985-10-25 |
| JPH0139649B2 JPH0139649B2 (https=) | 1989-08-22 |
Family
ID=13404197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59069490A Granted JPS60213028A (ja) | 1984-04-06 | 1984-04-06 | 終点検出方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60213028A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107919273A (zh) * | 2017-11-20 | 2018-04-17 | 上海陛通半导体能源科技股份有限公司 | 一种刻蚀终点确定方法、晶圆刻蚀方法以及刻蚀系统 |
-
1984
- 1984-04-06 JP JP59069490A patent/JPS60213028A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107919273A (zh) * | 2017-11-20 | 2018-04-17 | 上海陛通半导体能源科技股份有限公司 | 一种刻蚀终点确定方法、晶圆刻蚀方法以及刻蚀系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0139649B2 (https=) | 1989-08-22 |
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