JPS60212226A - Ultraviolet ray treatment method - Google Patents

Ultraviolet ray treatment method

Info

Publication number
JPS60212226A
JPS60212226A JP59067519A JP6751984A JPS60212226A JP S60212226 A JPS60212226 A JP S60212226A JP 59067519 A JP59067519 A JP 59067519A JP 6751984 A JP6751984 A JP 6751984A JP S60212226 A JPS60212226 A JP S60212226A
Authority
JP
Japan
Prior art keywords
ultraviolet
treated
ultraviolet rays
ultraviolet ray
oxygen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59067519A
Other languages
Japanese (ja)
Inventor
Shinji Suzuki
信二 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ushio Denki KK
Ushio Inc
Original Assignee
Ushio Denki KK
Ushio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Denki KK, Ushio Inc filed Critical Ushio Denki KK
Priority to JP59067519A priority Critical patent/JPS60212226A/en
Publication of JPS60212226A publication Critical patent/JPS60212226A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like

Abstract

PURPOSE:To enable uniform and rapid washing, by partitioning an ultraviolet ray source and an object to be treated in an ultraviolet ray permeable state and supplying gas forming nascent oxygen by ultraviolet rays only to the vicinity of the object to be treated. CONSTITUTION:Ozone or N2O is decomposed by ultraviolet rays of an ultraviolet ray source 2 to form nascent oxygen and the org. contaminant adhered to the surface of an object 5 to be treated is decomposed by said nascent oxygen to perform washing treatment. In this ultraviolet ray treatment method, the ultraviolet ray source 2 and the object 5 to be treated are partitioned by quartz glass 7 or an air curtain in an ultraviolet ray permeable state and gas forming nascent oxygen by ultraviolet rays (e.g., oxygen) is supplied only to the vicinity of the object 5 to be treated while a space including ultraviolet ray source 2 is brought to a vacuum atmosphere or a gaseous atmosphere such as nitrogen absorbing no ultraviolet rays. As a result, uniform and rapid washing is enabled in such a state that the supply amount of treating gas is reduced and the attenuation of ultraviolet rays is low.

Description

【発明の詳細な説明】 不発明は紫外線処理方法、例えばUV10.クリーニン
グに関するものである。
DETAILED DESCRIPTION OF THE INVENTION The invention is directed to ultraviolet treatment methods, such as UV10. It's about cleaning.

紫外線ランプなどの紫外線源より発生する紫外線を利用
して有機汚染物を分解洗浄などの処理をすることが行わ
れているが、この紫外線源、例えば低圧水銀ランプを点
灯すると、主として波長が254nmの水銀共鳴線の紫
外線が外部圧放出され、従として波長が185nmの紫
外線が、更には他の波長のものがわずかに放出される。
Ultraviolet light emitted from an ultraviolet source such as an ultraviolet lamp is used to decompose and clean organic contaminants, but when this ultraviolet source, for example a low-pressure mercury lamp, is turned on, it mainly emits light with a wavelength of 254 nm. Ultraviolet rays of the mercury resonance line are externally emitted, and accordingly, ultraviolet rays with a wavelength of 185 nm and a small amount of other wavelengths are also emitted.

そして、波長185nmの紫外線によってオゾンが生成
し、次にこのオゾンが波長254nmにより分解されて
発生基の酸素が生成し、この発生基の酸素によって有機
汚染物が分解され、ガス状態で飛散することが知られて
いる。また、N20は波長185nmにより分解されて
発生基の#素が生成し、オゾンと同様に有機汚染vlJ
t−分解し、ガス状態で飛散させる。
Then, ozone is generated by ultraviolet rays with a wavelength of 185 nm, and then this ozone is decomposed by a wavelength of 254 nm to generate oxygen as a generating group, and organic pollutants are decomposed by the oxygen in the generating group and scattered in a gaseous state. It has been known. In addition, N20 is decomposed at a wavelength of 185 nm to generate the generating group # element, which causes organic pollution like ozone.
t- Decompose and scatter in gaseous state.

ところで従来の方法は、紫外線ランプが上歯に配設され
た照射室内の下方に被処理体を配置し、照射室内に酸素
などの熟通用ガスを含むガスを供給しながら、被処理体
に紫外IIJt−照射していた。
By the way, in the conventional method, the object to be treated is placed below an irradiation chamber in which an ultraviolet lamp is installed on the upper tooth, and while a gas containing commonly used gas such as oxygen is supplied into the irradiation chamber, ultraviolet rays are applied to the object. IIJt- was irradiated.

そして、紫外線ラングと被処理体との距離が小さいと、
ランプの熱が被処理体に投射されて悪影響を及はし、更
には被処理体表面の光の照射分布が不均一になり、有機
汚染物の分解に局部的な偏りが生じるなどの問題がある
ため、紫外線ランプと被処理体との距離はある程度大き
くしなければならない。従って、照射室の容積が大きく
なるが、このために、ランプより発生した紫外線は被処
理体に到達するまでに酸素および発生したオゾンに吸収
されて減衰し、洗浄などの処理速度を遅くする原因とな
っていた。また、処理速度を高く保持するためには、大
きな容積の照射室内に多量の酸素などの処理用ガスを供
給する必要があり、しかもこの多量に供給された処理用
ガスの極く一部が有機汚染物の分解に寄与するのみであ
って、大部分の処理用ガスは無駄に照射室外に排気され
、その効率は著しく悪かった。
And if the distance between the ultraviolet ray rung and the object to be treated is small,
The heat of the lamp is projected onto the object to be treated, which has an adverse effect, and furthermore, the distribution of light irradiation on the surface of the object to be treated becomes uneven, leading to problems such as localized deviations in the decomposition of organic contaminants. Therefore, the distance between the ultraviolet lamp and the object to be treated must be increased to some extent. Therefore, the volume of the irradiation chamber increases, but for this reason, the ultraviolet rays generated by the lamp are absorbed by oxygen and generated ozone and attenuated before reaching the object to be treated, which slows down the processing speed of cleaning etc. It became. In addition, in order to maintain a high processing speed, it is necessary to supply a large amount of processing gas such as oxygen into the large volume irradiation chamber, and a small portion of this large amount of processing gas supplied is organic. Most of the processing gas was wastefully exhausted outside the irradiation chamber, only contributing to the decomposition of pollutants, and its efficiency was extremely low.

そこで本発明は、これらの事情にかんがみてなされたも
のであって、酸素などの処理用ガスの供給量が少なくて
紫外線の減衰が小さく、例えば洗浄速度の早い紫外線処
理方法を提供することを目的とする。そして、その構成
は、紫外線源の光によりオゾンもしくはN20 ’d 
+’lfF’?’り生成される発生基の酸素により被処
理体の表面に付着する有機汚染物などを分解して洗浄な
どの処理をする紫外線処理方法であって、石英ガラスや
エヤーカーテンなどで紫外線源と被処理体との間を紫外
線が透過可能な状態で区画し、被処理体の近傍にのみ紫
外線により発生基の酸素を生成J“るガスを供給すると
ともに、紫外線源を含む空間は真空や紫外線を吸収しな
いガス雰囲気としたことを特徴とするものである。
SUMMARY OF THE INVENTION The present invention has been made in view of these circumstances, and it is an object of the present invention to provide an ultraviolet treatment method that requires a small supply of a treatment gas such as oxygen, has low attenuation of ultraviolet rays, and has, for example, a high cleaning speed. shall be. The composition is ozone or N20'd by the light of the ultraviolet source.
+'lfF'? This is an ultraviolet treatment method in which organic contaminants adhering to the surface of the object to be treated are decomposed and cleaned using oxygen generated from the generated radicals. The space between the object and the object to be treated is divided in such a way that ultraviolet rays can pass through, and a gas that generates oxygen, which is a generating group due to ultraviolet rays, is supplied only to the vicinity of the object. It is characterized by a gas atmosphere that does not absorb.

以下に図面に示す実施例に基いて本発明を具体的に説明
する。
The present invention will be specifically described below based on embodiments shown in the drawings.

第1図は本発明の実施例に使用される装置の断面図を示
すが、照射室1は図示路の装置箱に内蔵されて二重構造
全なし、発生したオゾンが外部に漏洩しないようになっ
ている。照射室1内の上方には紫外線ランプ2としてU
字状の350W高出力低圧水銀灯が2本配設され、その
背部にはミラー3が配置され、紫外線ランプ2の光は下
方に向けて照射される。そして、照射室1の天井上面に
は冷却水路4が固着され、水冷されている。被処理体5
は直径約10ctnのウェハーであって、底面に固着さ
れた支持具6によって支持されているが、紫外線ランプ
2から被処理体5までの距離は10ωである。被処理体
5の下には温度構部装置を設けて、これを適温に調整し
、有機汚染物の分解を促進するようにするのがよい。
Figure 1 shows a cross-sectional view of the equipment used in the embodiment of the present invention.The irradiation chamber 1 is built into the equipment box along the path shown in the diagram and has no double structure, so that the ozone generated does not leak outside. It has become. In the upper part of the irradiation chamber 1, there is a U as an ultraviolet lamp 2.
Two letter-shaped 350W high-output low-pressure mercury lamps are arranged, a mirror 3 is arranged behind them, and the light from the ultraviolet lamp 2 is directed downward. A cooling water channel 4 is fixed to the upper surface of the ceiling of the irradiation chamber 1 and is water-cooled. Processed object 5
is a wafer with a diameter of about 10 ctn, and is supported by a support 6 fixed to the bottom surface, and the distance from the ultraviolet lamp 2 to the object to be processed 5 is 10ω. It is preferable to provide a temperature control device under the object to be treated 5 to adjust the temperature to an appropriate temperature and promote the decomposition of organic contaminants.

次に、被処理体5の上方2anの位置には石英ガラス板
7が配設されており、被処理体5と紫外線ランプ2とを
区画しているが、被処理体5t−含む空間は紫外線ラン
グ2を含む空間よりずっと小さい。石英ガラス板7の下
方には、酸素などの処理用ガスを含むガスを供給する吸
入孔11と、内部のガスを分解された汚染物とともに排
出する排気孔12が設けられているが、排気孔12よシ
吸引されたガスはオゾン分解室で処理された後に大気中
に放出される。そして、石英ガラス板7の上方であって
、紫外線ランプ2を含む空間には、減圧装置に接続され
た減圧孔15と、窒素ガづのように不活性でありて紫外
線を吸収しないガスの注入孔14が設けられている。も
っとも、注入孔214は設けずに、紫外線ランプ2を含
む空間を真空にすることにより、紫外線がこの空間内で
吸収され、ないようにしてもよい。
Next, a quartz glass plate 7 is disposed at a position 2an above the object to be processed 5, and partitions the object to be processed 5 and the ultraviolet lamp 2, but the space containing the object to be processed 5t is Much smaller than the space containing rung 2. Below the quartz glass plate 7, there are provided an inlet hole 11 for supplying a gas containing a processing gas such as oxygen, and an exhaust hole 12 for discharging the internal gas together with decomposed contaminants. 12 The gas sucked in is treated in an ozone decomposition chamber and then released into the atmosphere. In the space above the quartz glass plate 7 and containing the ultraviolet lamp 2, there is a pressure reduction hole 15 connected to a pressure reduction device, and an inert gas such as nitrogen gas that does not absorb ultraviolet rays is injected. A hole 14 is provided. However, the injection hole 214 may not be provided, and the space containing the ultraviolet lamp 2 may be evacuated so that ultraviolet rays are absorbed in this space and eliminated.

第2図は、石英ガラス板7に代ってエヤーカーテンを配
設した実施例を示すが、第1図の石英ガラス板7に対応
する位置に窒素ガスを流出するノズル81とこれを吸引
して受入れる吸引孔82とが対向して設けられている。
FIG. 2 shows an embodiment in which an air curtain is provided in place of the quartz glass plate 7, and a nozzle 81 for discharging nitrogen gas and a nozzle 81 for sucking the nitrogen gas are located at positions corresponding to the quartz glass plate 7 in FIG. A suction hole 82 for receiving the air is provided oppositely.

従って、被処理体5の少し上方には窒素ガスのエヤーカ
ーテンが張られ、紫外線はこれを透過するが、処理用ガ
スはこれを超えて上方には拡散しないようになっている
Therefore, an air curtain of nitrogen gas is placed slightly above the object to be processed 5, and the ultraviolet rays are transmitted through this, but the processing gas is not diffused upward beyond this.

このように、第1図と第2図において、石英ガラス板と
エヤーカーテンによる実施例を示したが、これらに限ら
れるものではなく、要は、紫外線ランプ2と被処理体5
とを紫外線が透過可能な状態で区画するものであって、
処理用ガスがこれを超えて拡散しないものであればよい
As described above, although the embodiment using the quartz glass plate and the air curtain is shown in FIG. 1 and FIG. 2, the embodiment is not limited to these.
and partitioned in a state where ultraviolet rays can pass through,
It is sufficient if the processing gas does not diffuse beyond this range.

しかして、被処理体5の近傍に処理用ガスが供給され、
紫外線ランプ2を含む空間が減圧され、もしくは更に窒
素ガスが注入される。そして、紫外線ランプ2が点灯さ
れると紫外線は被処理体50表面に照射され、表面に付
着していた有機汚染物は分解されて洗浄などの処理がな
される。
Thus, the processing gas is supplied near the object to be processed 5,
The space containing the ultraviolet lamp 2 is reduced in pressure, or nitrogen gas is further injected. Then, when the ultraviolet lamp 2 is turned on, the surface of the object to be treated 50 is irradiated with ultraviolet rays, and organic contaminants adhering to the surface are decomposed and processing such as cleaning is performed.

ここで、紫外線ランプ2と被処理体5との間は十分な距
離があるために、紫外線ランプ2の熱が被処理体5の表
面に投射される量はわずかであり、この悪影響は排除さ
れる。更に、紫外線ランプ2の光は均一に照射され、洗
浄不良の箇所などは生じない。そして、紫外線ランプ2
を含む広い空間は酸素ガスなどが存在しないために、こ
の空間内では紫外線は減衰せず、強い紫外線を被処理体
5に照射することができるので、処理速度は著しく早く
なり、処理時間が短かくて省エネルギーを図ることがで
きる。更に、処理用ガスが供給される空間は容積が小さ
いために、必要供給量がずっと少なくなり、処理用ガス
量を大巾に節約することができる。
Here, since there is a sufficient distance between the ultraviolet lamp 2 and the object to be processed 5, the amount of heat from the ultraviolet lamp 2 projected onto the surface of the object to be processed 5 is small, and this adverse effect is eliminated. Ru. Furthermore, the light from the ultraviolet lamp 2 is uniformly irradiated, so that there are no spots that are poorly cleaned. And ultraviolet lamp 2
Since there is no oxygen gas in the large space containing the space, the ultraviolet rays do not attenuate in this space, and the object to be processed 5 can be irradiated with strong ultraviolet rays, so the processing speed is significantly increased and the processing time is shortened. In this way, energy saving can be achieved. Furthermore, since the volume of the space into which the processing gas is supplied is small, the required supply amount is much smaller, and the amount of processing gas can be greatly reduced.

次に、具体的な数字でもってこの効果を説明すると、石
英ガラス板7などによって区画されていない従来例にお
いて、ランプと被処理体の距離が10crn、照射室の
容積が15t、奥行きが20crn。
Next, to explain this effect using specific numbers, in a conventional example that is not partitioned by a quartz glass plate 7 or the like, the distance between the lamp and the object to be processed is 10 crn, the volume of the irradiation chamber is 15 t, and the depth is 20 crn.

この内部に濃度500ppmのオゾンが均一に分布して
いるモデルでは、オゾンの波長254nmの紫外線吸収
係数はα=300atm−’・40vL+ −’である
ので254nmの紫外線は被処理体に到達するまでに約
80チが吸収されてしまう。これに対して、本発明は、
上記モデルに1おいて被処理体の上方2crnの位置に
て区画すれば吸収される紫外線は約25俤であり、従来
例に比べて非常に大きな効果が認められる。
In a model in which ozone with a concentration of 500 ppm is uniformly distributed inside this, the ultraviolet absorption coefficient of ozone at a wavelength of 254 nm is α = 300 atm-'・40 vL+ -', so the 254-nm ultraviolet rays will not reach the object to be treated. Approximately 80 chi will be absorbed. In contrast, the present invention
If the above model 1 is sectioned at a position 2 crn above the object to be treated, about 25 rays of ultraviolet light will be absorbed, which is a much greater effect than in the conventional example.

一方、処理速度は酸素ガスの流速に比例するが、従来例
と本発明とで、いずれも33”/minの流速で酸素ガ
ス金泥すには、従来例ではi Q A11nの供給量が
必要であったのに対して、本発明では約1.5’/rn
inであり、90%近くも酸素供給量を節約することが
できる。
On the other hand, the processing speed is proportional to the flow rate of oxygen gas, but in both the conventional example and the present invention, in order to process oxygen gas gold at a flow rate of 33"/min, the conventional example requires a supply amount of i Q A11n. On the other hand, in the present invention, it was about 1.5'/rn
In, the oxygen supply amount can be saved by nearly 90%.

以上説明した実施例からも理解される様に、本発明は、
紫外線源と被処理体との間を紫外線が透過可能な状態で
区画し、被処理体の近傍にのみ紫外線により発生基の酸
素全生成するガスを供給するとともに、紫外線源を含む
空間は真空や紫外線を吸収しないガス雰囲気としたので
、本発明によれば、処理用カスの供給量が少なくて紫外
線の減衰が小さく、均一な洗浄ができ、処理速度の早い
紫外線処理方法を提供することができる。尚、この方法
は、洗浄の他にフォトレジストのアッシング等にもその
ま\そっくり適用できる。
As understood from the embodiments described above, the present invention
The space between the ultraviolet ray source and the object to be treated is divided in such a way that the ultraviolet rays can pass through, and the gas that generates all the oxygen in the generation group by the ultraviolet rays is supplied only in the vicinity of the object to be treated, and the space containing the ultraviolet ray source is kept in a vacuum or in a vacuum. Since the gas atmosphere does not absorb ultraviolet rays, according to the present invention, it is possible to provide an ultraviolet ray treatment method that requires only a small amount of treatment scum, reduces the attenuation of ultraviolet rays, enables uniform cleaning, and has a high processing speed. . In addition to cleaning, this method can also be applied to photoresist ashing and the like.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明実施例の断面図、躯2図は同じく他の実
施例の断面図である。 1・・・照射室 2・・・紫外線う/グ 6・・・ミラ
ー5・・・被処理体 6・・・支持具 7・・・石英ガ
ラス板出顕人 ウシオ電機株式会社 代理人 弁理士 田原寅之助
FIG. 1 is a sectional view of an embodiment of the present invention, and Figure 2 of the body is a sectional view of another embodiment. 1...Irradiation chamber 2...Ultraviolet light beam 6...Mirror 5...Object to be treated 6...Support 7...Quartz glass plate appearance person Ushio Inc. agent Patent attorney Toranosuke Tahara

Claims (1)

【特許請求の範囲】[Claims] 紫外線源の光によりオゾンもしくはN、0を分解し1こ
れにより生成される発生基の酸素によりW処理体の表面
に付着する有41!汚染物などを分解して宏量などの処
理をする紫外線処理方法でありて、石英ガラスやエヤー
カーテンなどで紫外線源と被処理体との間を紫外線が透
過可能な状態で区画し1被処理体の近傍にのみ紫外線に
より発生岡の酸ネを生成するガスを供給するとともに、
紫外線源を含む空間は真空や紫外線を吸収しないガス雰
囲気としたことを特徴とする紫外線処理方法。
Ozone or N, 0 is decomposed by the light of the ultraviolet source, and the generated radical oxygen adheres to the surface of the W-treated body.41! This is an ultraviolet treatment method that decomposes contaminants and treats their bulk, etc., and uses quartz glass, air curtains, etc. to partition the ultraviolet source and the object to be treated so that the ultraviolet rays can pass through. In addition to supplying gas that generates oxidation by ultraviolet rays only near the body,
An ultraviolet treatment method characterized in that the space containing the ultraviolet source is a vacuum or a gas atmosphere that does not absorb ultraviolet rays.
JP59067519A 1984-04-06 1984-04-06 Ultraviolet ray treatment method Pending JPS60212226A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59067519A JPS60212226A (en) 1984-04-06 1984-04-06 Ultraviolet ray treatment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59067519A JPS60212226A (en) 1984-04-06 1984-04-06 Ultraviolet ray treatment method

Publications (1)

Publication Number Publication Date
JPS60212226A true JPS60212226A (en) 1985-10-24

Family

ID=13347303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59067519A Pending JPS60212226A (en) 1984-04-06 1984-04-06 Ultraviolet ray treatment method

Country Status (1)

Country Link
JP (1) JPS60212226A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60235793A (en) * 1984-05-04 1985-11-22 ツエ−ハ−.ゴ−ルドシユミツト アクチエンゲゼルシヤフト Device for hardening flat material
JPH04293539A (en) * 1991-03-25 1992-10-19 Mitsui Eng & Shipbuild Co Ltd Irradiation of gas with light
JPH05117061A (en) * 1991-04-25 1993-05-14 Abb Patent Gmbh Surface treatment
US5275667A (en) * 1992-05-04 1994-01-04 Motorola, Inc. Method of characterizing the level of cleanliness of an inorganic surface
EP0661110A1 (en) * 1993-11-26 1995-07-05 Ushiodenki Kabushiki Kaisha Process for oxidation of an article surface
EP2177278A1 (en) * 2007-08-16 2010-04-21 Asahi Glass Company, Limited Substrate cleaning apparatus and method of cleaning substrate
EP3586986A1 (en) * 2018-06-26 2020-01-01 Helmholtz-Zentrum für Umweltforschung GmbH-UFZ Device and method for sub-molecular dry cleaning and/or for coating with a hydrophilic composition the surface of solid bodies

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607936A (en) * 1983-06-24 1985-01-16 Anelva Corp Photochemical surface treatment device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607936A (en) * 1983-06-24 1985-01-16 Anelva Corp Photochemical surface treatment device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60235793A (en) * 1984-05-04 1985-11-22 ツエ−ハ−.ゴ−ルドシユミツト アクチエンゲゼルシヤフト Device for hardening flat material
JPH04293539A (en) * 1991-03-25 1992-10-19 Mitsui Eng & Shipbuild Co Ltd Irradiation of gas with light
JPH05117061A (en) * 1991-04-25 1993-05-14 Abb Patent Gmbh Surface treatment
US5275667A (en) * 1992-05-04 1994-01-04 Motorola, Inc. Method of characterizing the level of cleanliness of an inorganic surface
EP0661110A1 (en) * 1993-11-26 1995-07-05 Ushiodenki Kabushiki Kaisha Process for oxidation of an article surface
EP2177278A1 (en) * 2007-08-16 2010-04-21 Asahi Glass Company, Limited Substrate cleaning apparatus and method of cleaning substrate
EP2177278A4 (en) * 2007-08-16 2011-09-07 Asahi Glass Co Ltd Substrate cleaning apparatus and method of cleaning substrate
EP3586986A1 (en) * 2018-06-26 2020-01-01 Helmholtz-Zentrum für Umweltforschung GmbH-UFZ Device and method for sub-molecular dry cleaning and/or for coating with a hydrophilic composition the surface of solid bodies

Similar Documents

Publication Publication Date Title
KR100677661B1 (en) Apparatus and method for irradiating ultraviolet light
KR910007110B1 (en) Surface anealing device
US7527695B2 (en) Apparatus and method for cleaning substrate
JP4407252B2 (en) Processing equipment
JPS60212226A (en) Ultraviolet ray treatment method
US6796664B2 (en) Method and device for decontaminating optical surfaces
JP4640421B2 (en) UV irradiation equipment
JP2001300451A (en) Ultraviolet irradiation device
JP2588511B2 (en) Processing equipment
JP2000216128A (en) Apparatus for treating substrate with ultraviolet irradiation
JP3214153B2 (en) Cleaning method using dielectric barrier discharge lamp
JPS6235811B2 (en)
JP2000066003A (en) Method for cleaning optical parts
JPH0612766B2 (en) Light irradiation device
JP2002184742A (en) Dry cleaning device
JPS6253190B2 (en)
JP2588508B2 (en) Processing equipment
JPS607936A (en) Photochemical surface treatment device
JP2002118308A (en) Casing for laser device, its production method, and its cleaning method
JP4645781B2 (en) Substrate processing method and substrate processing apparatus
JP2001191044A (en) Uv treatment method and scrubbing method and scrubbing device
JP2000225337A (en) Ultraviolet treatment method
JPH06333814A (en) Ashing device
KR100327880B1 (en) Apparatus irradiating ultraviolet light
JPH0611347U (en) Resist film ashing device