JPS60211782A - Extrusion molding connector of plastic insulating cable - Google Patents
Extrusion molding connector of plastic insulating cableInfo
- Publication number
- JPS60211782A JPS60211782A JP6785484A JP6785484A JPS60211782A JP S60211782 A JPS60211782 A JP S60211782A JP 6785484 A JP6785484 A JP 6785484A JP 6785484 A JP6785484 A JP 6785484A JP S60211782 A JPS60211782 A JP S60211782A
- Authority
- JP
- Japan
- Prior art keywords
- cable
- extrusion molding
- temperature
- polyethylene
- connection part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（技術分野）
本発明は接続部の絶縁層を押出モールドにより形成した
プラスチック絶縁ケーブルの押出モールド接続部の改良
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to an improvement in an extrusion molded connection part of a plastic insulated cable in which an insulating layer of the connection part is formed by extrusion molding.
（発明の背景）
架橋ポリエチレン絶縁ケーブル等のプラスチック絶縁ケ
ーブルの接続部絶縁層の形成方法には種々の方法がある
が、ケーブル絶縁層の形成と同じように、架橋剤を配合
したポリエチレン混和物を押出機を用いて金型中に押出
して成形するいわゆる押出モールド法、が最も好ましい
といえる。(Background of the Invention) There are various methods for forming an insulating layer at the connection part of a plastic insulated cable such as a crosslinked polyethylene insulated cable, but in the same way as for forming a cable insulating layer, a polyethylene mixture containing a crosslinking agent is used. The most preferred method is the so-called extrusion molding method in which the material is extruded into a mold using an extruder.
図面は架橋ポリエチレン絶縁ケーブルの押出モールド接
続部の一部断面を表わした説明図で、架橋ポリエチレン
絶縁ケーブル（Ｃ）の絶縁層（１）の端部を鉛筆状に削
り、導体（３）を接続用スリーブ（４）で接続し、導体
（３）及び接続用スリーブ（４）上に半導電性テープ等
にて内部半導電層（５）を形成した後上記接続部を金型
にて覆い、金型内に架橋剤を配合したポリエチレン混和
物を押出機により押出して成形して絶縁層（６）を形成
する。この後加硫管をＮス
施して南ガス等により加圧、加熱してポリエチレンを架
橋せしめる。その後この上にケーブル（Ｃ）の半導電層
■にわたって接続部外部半導電層（７）を施す。この場
合上記絶縁層（６）は通常架橋剤としてジクミルパーオ
キサイド（ＤＣＰ）を配合したポリエチレン混和物を金
型内に押出すが、この際会（Ｃ）絶縁層（１１表面を融
点近傍の温度（約ｍ”ｃ ）に保持した後押出成型する
。The drawing is an explanatory diagram showing a partial cross section of the extrusion molded connection part of the cross-linked polyethylene insulated cable.The end of the insulation layer (1) of the cross-linked polyethylene insulated cable (C) is shaved into a pencil shape and the conductor (3) is connected. After forming an internal semiconductive layer (5) with semiconductive tape or the like on the conductor (3) and the connection sleeve (4), cover the connection part with a mold, An insulating layer (6) is formed by extruding and molding a polyethylene mixture containing a crosslinking agent into a mold using an extruder. Thereafter, the vulcanized tube is subjected to nitrogen gas, and the polyethylene is crosslinked by applying pressure and heating using a gas or the like. Thereafter, a connection outer semiconducting layer (7) is applied over this over the semiconducting layer (1) of the cable (C). In this case, the insulating layer (6) is usually formed by extruding a polyethylene mixture containing dicumyl peroxide (DCP) as a crosslinking agent into a mold. After maintaining the temperature (approximately m"c), it is extruded.
押出されたポリエチレン混和物とケーブル絶縁層（１）
との接着が良好なものを得るためには出来るだけ金型温
度を高く保ちたいが押出温度がＤＣＰの分解温度（１３
０〜１４０℃）によってきまるため金型温度は１２０°
Ｃ位が限度（この場合ケーブル絶縁層の表面温度は約１
１０°Ｃ）でこれ以上高くすることができない。一方接
着に必要なケーブル表面の温度はポリエチレンの融点（
この場合的１１０°Ｃ）以上であり高い方が好ましい。Extruded polyethylene blend and cable insulation layer (1)
In order to obtain good adhesion to the DCP, it is necessary to keep the mold temperature as high as possible, but the extrusion temperature is the
The mold temperature is 120°.
The limit is at position C (in this case, the surface temperature of the cable insulation layer is approximately 1
10°C) and cannot be increased any higher. On the other hand, the cable surface temperature required for adhesion is the melting point of polyethylene (
In this case, the temperature is 110°C or higher, and the higher the temperature, the better.
したがって、上記温度は接着に必要な下限ぎり！りの温
度であるため現場での温度コントロールか困難で接着不
良をおこすおそれがある。Therefore, the above temperature is at the lower limit necessary for bonding! Because the temperature is so low, it is difficult to control the temperature on site and there is a risk of adhesion failure.
（発明の開示と効果）
本発明の押出モールド接続部は上記の問題点を解消した
もので、接続部絶縁層がポリエチレンに架橋剤としてジ
ターシャリ−ブチルパーオキサイド（ＤＴＢＰ）を配合
した混和物の押出モールドにより形成されていることを
特徴とするものである。即ち、本発明においては、架橋
剤とじてＤＣＰより分解温度が高いＤＴＢＰ （分解温
度は１４０〜１５０°Ｃ）を用いるもので、その結果、
押出温度、金型予熱温度とも従来のＤＣＰを用いもので
ある。(Disclosure and Effects of the Invention) The extrusion mold connection part of the present invention solves the above problems, and the connection part insulating layer is formed by extrusion of a mixture of polyethylene and ditertiary butyl peroxide (DTBP) as a crosslinking agent. It is characterized by being formed by a mold. That is, in the present invention, DTBP, which has a higher decomposition temperature than DCP (decomposition temperature is 140 to 150°C), is used as a crosslinking agent, and as a result,
Conventional DCP was used for both the extrusion temperature and mold preheating temperature.
図面は架橋ポリエチレン絶縁ケーブルの押出モールド接
続部の一部断面を表わした説明図である。
（Ｃ）・・・・・・架橋ポリエチレン絶縁ケーブル、（
１）・・・・・・ケーブル絶縁層、（２）・・・・・・
ケーブル半導電層、（３）・・・・・・ケーブル導体、
（Φ・・・・・・接続用スリーブ、（５）・・・・・・
半導電層、（６）・・・・・・接続部絶縁層、（７）・
・・・・・接続部半導電層The drawing is an explanatory view showing a partial cross section of an extrusion molded connection part of a crosslinked polyethylene insulated cable. (C)...Cross-linked polyethylene insulated cable, (
1)...Cable insulation layer, (2)...
cable semiconductive layer, (3)...cable conductor,
(Φ... Connection sleeve, (5)...
Semi-conducting layer, (6)...Connection part insulating layer, (7).
...Connection semiconducting layer
Claims (1)
出モールド接続部において、接続部絶縁層がポリエチレ
ンに＃橋剤としてジターシャリ−ブチルパーオキサイド
を配合した混和物の押出モールドにより形成されている
ことを特徴とするプラスチック絶縁ケーブルの押出モー
ルド接続部(1) l' m, t! An extrusion mold of a plastic insulated cable, characterized in that, in the extrusion mold connection of a polyethylene insulated cable, the connection part insulating layer is formed by extrusion molding of a mixture of polyethylene and ditertiary butyl peroxide as a bridging agent. connection part
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6785484A JPS60211782A (en) | 1984-04-04 | 1984-04-04 | Extrusion molding connector of plastic insulating cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6785484A JPS60211782A (en) | 1984-04-04 | 1984-04-04 | Extrusion molding connector of plastic insulating cable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60211782A true JPS60211782A (en) | 1985-10-24 |
Family
ID=13356950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6785484A Pending JPS60211782A (en) | 1984-04-04 | 1984-04-04 | Extrusion molding connector of plastic insulating cable |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60211782A (en) |
-
1984
- 1984-04-04 JP JP6785484A patent/JPS60211782A/en active Pending
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