JPS60210388A - Cutting instrument of plate material - Google Patents

Abstract

PURPOSE:To cut a thick plate by irradiating a laser beam to a plate surface from the 1st nozzle nearly at right angles with the plate surface and by irradiating a laser beam to another surface of the plate from the 2nd nozzle at specified angle against a vertical axis with the plate material. CONSTITUTION:The 1st cutting nozzle 2a that a laser beam 6 is irradiatable nearly at right angles with the surface of a plate material 1 is disposed and the 2nd cutting nozzle 2b that a laser beam 6' is irradiatable at specified angle theta1 against the vertical axis with the plate material 1 to another surface thereof is disposed. The inclination angle theta of the cutting nozzle is adjusted within 90 deg.. Then the laser beam 6' is irradiated from the 2nd nozzle 2b and the plate material 1 is cut by welding from its end part with its moving to left, and at the same time the amount of a thickness t1 is cut by welding with the laser beam 6 irradiated from the 1st nozzle 2a and a whole plate thickness t0 is cut. A laser cutting of a thick plate is thus becomes possible.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a plate cutting device capable of cutting thick plates.

[Prior art]

Conventionally, as shown in Fig. 1, a laser cutting device for a plate material supplies a laser beam (6) and cutting gas vertically from the top of a planarly processed plate material (1), and cuts the material to be cut. A certain plate material (1) or cutting nozzle (2) was moved while cutting. That is, in FIG. 1, a laser beam (6) is reflected vertically downward by a mirror (4), further converged by a lens (3), and irradiated onto a plate (1). Cutting gas into the nest is passed through the cutting nozzle (
It is supplied from the supply port (5) provided in 2) and is ejected from the same nozzle as the convergent laser beam.

However, with conventional cutting equipment, the material to be cut, the plate material (
If the thickness of 1) increases, the focused beam energy and cutting gas will not effectively reach the back surface of the plate material (1), resulting in significantly poor cutting quality or even the cutting itself becoming impossible. For example, Figure 2 shows the conditions for cutting steel plates using a conventional cutting device with an output of 800W and 500W, but with 800W it is impossible to cut a plate thickness of 6mm or more, and with 500W it is impossible to cut a plate thickness of 4mm or more. . As described above, there was a drawback that it was difficult to cut thick plates. [Summary of the Invention] This invention was made to solve the above drawback.
The first nozzle is arranged so as to irradiate the laser beam on the single force side of the plate at an angle of 0° and θ<900 from the line perpendicular to the plane of the plate, and the angle is 0°≦ from the line perpendicular to the plane of the plate. O<90°
To provide a cutting device for a plate material that can cut a thick plate by arranging a second nozzle so as to irradiate a laser beam onto the surface of the plate material at an angle of .

[Embodiment J of the invention FIG. 3 shows an embodiment of the invention. In the diagram, a first cutting nozzle (2a) that can irradiate a laser beam is placed almost perpendicular to one surface of the material to be cut, that is, a plate (1), and the other surface of the plate (1) is A second cutting nozzle (2b) capable of irradiating the plate material (1) with a laser beam at a predetermined angle (υ1) with respect to an axis perpendicular to the plate material (1) is arranged.

In FIG. 3 configured in this way, the laser beam is irradiated from the second cutting nozzle (2b), the plate material (1) is moved to the left in the figure, and the laser beam is irradiated from the first cutting nozzle (2a). irradiate. This increases the thickness by 10)
The plate material (1) is melt-cut from the end by the second cutting nozzle (2b) at an angle (θl), and then cut by the first cutting nozzle (2b).
According to a), the calendar cut tl) is fused.

In this way, the first and second cutting nozzles (zaX2b) work together to cut the plank (1). Here, the plate thickness (10) and the cutting Wr thickness tl shared by the first cutting nozzle (2a)
) is preferably tl) 100 to.

FIG. 4 shows another embodiment, in which the first and second cutting nozzles (2a) (2b) are set at the same angle (θ1) with respect to the axis perpendicular to the plate material (1). (θ2)
It is expected that the same effect as in the above embodiment will be obtained by tilting the surface by a certain amount.

However, it is preferable that the respective inclination angles have a relationship of θ1≧02.

In the above embodiment, the case where cutting was performed by moving the board was explained, but the cutting nozzle may also be moved. Furthermore, the laser beams supplied to the first and second cutting nozzles may be supplied from separate laser generators, or the laser beams generated by one laser generator may be divided.

〔Effect of the invention〕

As explained above, according to the present invention, the first nozzle is arranged so as to irradiate one surface of the plate with a laser beam at an angle of 00<θ<90° from a line perpendicular to the surface of the plate,
By arranging the second nozzle so as to irradiate the laser beam onto the other force side of the plate at an angle of 0°≦θ<90° from a line perpendicular to the surface of the plate, thick plates can be cut. becomes possible.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing a conventional one, FIG. 8g2 is a configuration diagram of one embodiment of the present invention, and FIGS. 3 and 4 are configuration diagrams of other embodiments. In the figure, (1) is a plate material, (2a) is a first cutting nozzle, (2b) is a second cutting nozzle, and (6) is a laser beam. In addition, the same reference numerals in each figure indicate the same or corresponding parts.

Claims (2)

[Claims] (1) In a device that cuts the plate material by moving the plate material and a laser beam relatively along a cutting line, for one side of the plate material, the cutting is performed from a reference line perpendicular to the surface of the plate material. Arrange a first nozzle that irradiates the first laser beam at an angle of 0° and θ1 <90° set in the direction of the line,
A second nozzle for irradiating a second laser beam at an angle of 0°≦θ2<90° set in the direction of the cutting line from the reference line to the surface of the other force of the plate material is arranged. A cutting device for plate materials. (2) The plate material cutting device according to claim 1, wherein the irradiation angle of both nozzles satisfies θ1≧02.