JPH0563273B2 - - Google Patents

Info

Publication number
JPH0563273B2
JPH0563273B2 JP59083783A JP8378384A JPH0563273B2 JP H0563273 B2 JPH0563273 B2 JP H0563273B2 JP 59083783 A JP59083783 A JP 59083783A JP 8378384 A JP8378384 A JP 8378384A JP H0563273 B2 JPH0563273 B2 JP H0563273B2
Authority
JP
Japan
Prior art keywords
laser
head
cutting
processing
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59083783A
Other languages
Japanese (ja)
Other versions
JPS60227987A (en
Inventor
Akyasu Okazaki
Masayoshi Hashiura
Michio Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59083783A priority Critical patent/JPS60227987A/en
Priority to DE8585105151T priority patent/DE3568544D1/en
Priority to EP85105151A priority patent/EP0159723B1/en
Publication of JPS60227987A publication Critical patent/JPS60227987A/en
Publication of JPH0563273B2 publication Critical patent/JPH0563273B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035Aligning the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は切断加工ヘツドの配置を改良したレー
ザ加工機に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a laser processing machine with an improved arrangement of a cutting head.

〔発明の背景〕[Background of the invention]

ガスレーザ発生装置は、混合ガスたとえばHe,
N2,CO2等を有する励起空間内でグロー放電を
行なえば、混合ガスが励起され、レーザ光を発生
する。レーザ光は励起空間内に設けた複数の鏡間
を共振し、出力鏡より外部に取出し、鉄板、セラ
ミツク等に切断加工を施す。加工時に切断幅が狭
まい方が精密加工にまで適用できるので、製品適
用範囲を広くできる。この状態を満足するレーザ
光は、一般にシングルモード特性と称されてい
る。シングルモード特性とは、レーザ光の中心点
でその外周部より著しく突出したエネルギー密度
が大きい特性である。シングルモード特性を得る
ためには、レーザ光の共振長を伸ばすために、励
起空間の両端に折返鏡を設け、折返鏡間でレーザ
光を何回も往復させたり、或いはレーザ光の光軸
が中心に来るように複数の鏡位置を調整したり、
等の作業を行なつていたが、高いパワー密度のレ
ーザビームを得るのに限界が有つた。
A gas laser generator uses a mixed gas such as He,
When glow discharge is performed in an excitation space containing N 2 , CO 2 , etc., the mixed gas is excited and laser light is generated. The laser beam resonates between a plurality of mirrors provided in the excitation space, is extracted to the outside through an output mirror, and is used to cut iron plates, ceramics, etc. Narrower cutting widths can be applied to precision machining, allowing for a wider range of product applications. Laser light that satisfies this condition is generally referred to as having single mode characteristics. The single mode characteristic is a characteristic in which the energy density at the center of the laser beam is significantly higher than at the outer periphery. To obtain single-mode characteristics, in order to extend the resonance length of the laser beam, folding mirrors are installed at both ends of the excitation space, and the laser beam is sent back and forth between the folding mirrors many times, or the optical axis of the laser beam is Adjust multiple mirror positions so that they are centered,
However, there was a limit to the ability to obtain a laser beam with high power density.

〔発明の目的〕[Purpose of the invention]

本発明は上述の点に鑑みなされたもので、その
目的とするところは、高いパワー密度のレーザビ
ームを得ることができ、これを使用することによ
り狭い切断幅で加工できるレーザ加工機を提供す
るにある。
The present invention has been made in view of the above-mentioned points, and its purpose is to provide a laser processing machine that can obtain a laser beam with high power density and can perform processing with a narrow cutting width by using the laser beam. It is in.

〔発明の概要〕[Summary of the invention]

本発明は出力レーザビームを検討した結果、出
力レーザビームはある距離でレーザビームが集光
され、スポツト径が小さく、かつ高いパワー密度
を有するビームウエストが存在することがわか
り、ここのビームウエストに切断加工ヘツドを設
置して、狭い切断幅で加工できるようにしたもの
である。
As a result of examining the output laser beam, it was found that the output laser beam has a beam waist where the laser beam is focused at a certain distance, the spot diameter is small, and the power density is high. A cutting head is installed to enable processing with a narrow cutting width.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例を第1図の複合レーザ加
工機1により説明する。
Embodiments of the present invention will be described below using a composite laser processing machine 1 shown in FIG.

該図に示す如く、レーザ発生器2の出力側と加
工テーブル3とは、空間を介して対応配置してい
る。加工テーブル3の上面には、2組のレール4
を設置している。レール4はレーザ発生器2から
レーザビーム1Aと直交する方向に配置してい
る。レール4は溶接用および切断用加工ヘツド
5,6を嵌め込んでいる。熱処理用加工ヘツド7
は加工テーブル上に固定されている。これらの加
工ヘツド5,6,7は、レーザ発生器側の対応面
に穴8を、穴8と反対側に傾斜面9を、それぞれ
形成し、溶接用および切断用加工ヘツド5,6の
底面には、レール4に嵌め込むガイド10を取付
けて、箱体11を構成している。傾斜面9に取付
けた第2図のベンドミラー12は、レーザ発生器
2からのレーザビーム1Aを照射し、直角方向の
集光レンズ13に照射する。集光レンズ13と箱
体10との間はパイプ14A,Bにより連絡さ
れ、集光レンズ13はパイプ14A,14Bに支
持されている。パイプ14Aは溶接用および切断
用加工ヘツド5,6と同様にレール4を介して
(α←→β)方向に移動することができる。集光レ
ンズ13を透過したレーザビーム1Aは、被加工
物15たとえば鉄板を照射し、鉄板を切断する。
移動テーブル16は上方側に被加工物15を載置
し、下方側にガイド17を取付け、ガイド17は
レーザビーム1Aと同方向に延びるレール18に
嵌込んでいる。したがつて、移動テーブル16は
(α′←→β′)方向に移動できる。
As shown in the figure, the output side of the laser generator 2 and the processing table 3 are arranged in correspondence with each other with a space in between. There are two sets of rails 4 on the top surface of the processing table 3.
is installed. The rail 4 is arranged in a direction perpendicular to the laser beam 1A from the laser generator 2. The rail 4 accommodates welding and cutting heads 5, 6. Processing head 7 for heat treatment
is fixed on the processing table. These processing heads 5, 6, and 7 each form a hole 8 on the corresponding surface on the laser generator side and an inclined surface 9 on the opposite side to the hole 8, and the bottom surfaces of the processing heads 5, 6 for welding and cutting. A box body 11 is constructed by attaching a guide 10 to be fitted into the rail 4. The bend mirror 12 shown in FIG. 2 attached to the inclined surface 9 irradiates the laser beam 1A from the laser generator 2, and irradiates the condenser lens 13 in the right angle direction. The condensing lens 13 and the box body 10 are communicated by pipes 14A, B, and the condensing lens 13 is supported by the pipes 14A, 14B. The pipe 14A, like the welding and cutting heads 5, 6, can be moved in the (α←→β) direction via the rail 4. The laser beam 1A transmitted through the condenser lens 13 irradiates the workpiece 15, for example, an iron plate, and cuts the iron plate.
A workpiece 15 is placed on the moving table 16 on the upper side, and a guide 17 is attached on the lower side, and the guide 17 is fitted into a rail 18 extending in the same direction as the laser beam 1A. Therefore, the moving table 16 can move in the (α'←→β') direction.

この構成で、レーザビーム1Aはレーザ発生器
2の全反射鏡2Aと出力鏡2Bとの間で共振し、
出力鏡2Bから外部に照射される。このレーザビ
ーム1Aはアクリルバーンパターン又はビーム径
集光測定器で測定すると、第3図、及び第4図に
示す如く、レーザビーム1Aが集光され、スポツ
ト径が小さく、かつ高いパワー密度のエルギーを
有するビームウエスト1Bを有する。本発明では
切断用加工ヘツド6を、このビームウエスト1B
に配置している。その結果、高いパワー密度のエ
ルギーを有するレーザビームを利用できるので、
ビームモードに応じて被加工物15を切断する時
に切断幅を小さくできる。このため、被加工物を
切断する時に粗切断から精密切断まで広い範囲に
適用できる。
With this configuration, the laser beam 1A resonates between the total reflection mirror 2A and the output mirror 2B of the laser generator 2,
The light is irradiated to the outside from the output mirror 2B. When this laser beam 1A is measured with an acrylic burn pattern or a beam diameter concentrator, the laser beam 1A is focused, as shown in FIGS. 3 and 4, and has a small spot diameter and a high power density energy. It has a beam waist 1B. In the present invention, the cutting head 6 is connected to the beam waist 1B.
It is located in As a result, a laser beam with high power density and energy can be used.
The cutting width can be made smaller when cutting the workpiece 15 depending on the beam mode. Therefore, it can be applied to a wide range of applications from rough cutting to precision cutting when cutting workpieces.

一方、切断用加工ヘツド6を溶接用加工ヘツド
5と熱処理用加工ヘツド7との間に配置すれば、
たとえば長丈状の鋼板を真中から切断し、同じ寸
法の短丈状の鋼板に形成する場合、移動テーブル
16に固定された鋼板の真中を切断用加工ヘツド
6の下に設置する。そうすると、鋼板は切断用加
工ヘツド6の対応個所から溶接用加工ヘツド5お
よび熱処理用加工ヘツド7方向へ等しい距離だけ
延びるので、鋼板設置場所を多く必要としない。
たとえば、切断用加工ヘツドを溶接用加工ヘツド
の個所に配置してあるとすれば、上述の状態のよ
うに鋼板を配置した時に、鋼板が一方側に突出し
て、鋼板設置場所を多く必要とするが、本実施例
の構成とすることにより、それが防止される。ま
た、切断した鋼板を溶接又は熱処理をする時に、
切断した鋼板を切断用加工ヘツド6から溶接用加
工ヘツド5又は熱処理用加工ヘツド7に移動する
移動距離が少ないので、作業能率を向上すること
ができる。
On the other hand, if the cutting head 6 is placed between the welding head 5 and the heat treatment head 7,
For example, when cutting a long steel plate from the middle to form short steel plates of the same size, the center of the steel plate fixed to the moving table 16 is placed under the cutting head 6. In this case, the steel plate extends an equal distance from the corresponding location of the cutting head 6 toward the welding head 5 and the heat treatment head 7, so that the steel plate does not require much space.
For example, if the processing head for cutting is located at the location of the processing head for welding, when the steel plate is arranged as in the above situation, the steel plate will protrude to one side, requiring more space to install the steel plate. However, this can be prevented by the configuration of this embodiment. Also, when welding or heat treating cut steel plates,
Since the moving distance for moving the cut steel plate from the cutting processing head 6 to the welding processing head 5 or the heat treatment processing head 7 is short, work efficiency can be improved.

更に、第1図のように切断用加工ヘツド6のレ
ーザ発生器側に溶接用加工ヘツド5を、これと反
対側に熱処理用加工ヘツド7を、配置すれば、次
の効果を達成できる。すなわち、第3図、及び第
4図に示す如く、ビームウエスト1Bよりレーザ
発生器側のレーザビーム1Cの径は、他方側のレ
ーザビーム径1Dより小さい。つまり、レーザビ
ーム1Dの発散角は、レーザビーム1Cのそれよ
り広いので、熱処理用加工ヘツド7ではスポツト
径を溶接用および切断用加工ヘツド5,6のスポ
ツト径より大きくできる。したがつて、広い面積
の熱処理を容易に行うことができる。
Furthermore, by arranging the welding processing head 5 on the laser generator side of the cutting processing head 6 and the heat treatment processing head 7 on the opposite side as shown in FIG. 1, the following effects can be achieved. That is, as shown in FIGS. 3 and 4, the diameter of the laser beam 1C on the laser generator side of the beam waist 1B is smaller than the laser beam diameter 1D on the other side. That is, since the divergence angle of the laser beam 1D is wider than that of the laser beam 1C, the spot diameter of the heat treatment processing head 7 can be made larger than the spot diameter of the welding and cutting processing heads 5, 6. Therefore, heat treatment over a wide area can be easily performed.

尚、第4図の如く、出力鏡2Bに凸レンズを使
用すれば、レーザ発振器2からのレーザビーム径
を細くできるので、例えば切断用を主にする場合
はビーム集光径を細くできる効果を生じる。ま
た、溶接、熱処理の場合にあつても、ビームが細
くなるので、レンズ、ミラー、ホルダーを小さく
でき、必要に応じた寸法で対応できる効果もある
と共に、小型化できる。
Furthermore, as shown in Fig. 4, if a convex lens is used for the output mirror 2B, the diameter of the laser beam from the laser oscillator 2 can be made narrower, so that, for example, when the laser beam is mainly used for cutting, the beam condensing diameter can be made narrower. . In addition, even in the case of welding and heat treatment, since the beam becomes narrower, the lenses, mirrors, and holders can be made smaller, which has the effect of allowing the size to be adjusted according to needs, and the size can be reduced.

〔発明の効果〕〔Effect of the invention〕

以上説明した本発明のレーザ加工機によれば、
レーザビームのウエストポイントに切断用加工ヘ
ツドを配置したものであるから、高いパワー密度
のレーザビームを使用して加工が行えるので、切
断幅を狭く加工できる此種レーザ加工機を得るこ
とができる。
According to the laser processing machine of the present invention explained above,
Since the processing head for cutting is arranged at the waist point of the laser beam, processing can be performed using a laser beam with high power density, so it is possible to obtain this type of laser processing machine that can perform processing with a narrow cutting width.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の実施例である複合レーザ加工
機の概略視斜図、第2図は第1図の加工ヘツドの
概略図、第3図、及び第4図はレーザビームのウ
エストポイントを説明するための図である。 2……レーザ発生器、1A,1C,1D……レ
ーザビーム、1B……ビームウエスト、5……溶
接用加工ヘツド、6……切断用加工ヘツド、7…
…熱処理用加工ヘツド。
Fig. 1 is a schematic perspective view of a compound laser processing machine that is an embodiment of the present invention, Fig. 2 is a schematic diagram of the processing head shown in Fig. 1, and Figs. 3 and 4 show the waist point of the laser beam. It is a figure for explaining. 2... Laser generator, 1A, 1C, 1D... Laser beam, 1B... Beam waist, 5... Welding processing head, 6... Cutting processing head, 7...
...Processing head for heat treatment.

Claims (1)

【特許請求の範囲】 1 レーザ発生器からのレーザビームを照射する
途中に溶接用加工ヘツド切断用加工ヘツド、及び
熱処理用加工ヘツドを備えたレーザ加工機におい
て、前記レーザビームのウエストポイントに前記
切断用加工ヘツドを配置したことを特徴とするレ
ーザ加工機。 2 前記レーザ発生器側から溶接用加工ヘツド、
切断用加工ヘツド、及び熱処理用加工ヘツドを順
次配置したことを特徴とする特許請求の範囲第1
項記載のレーザ加工機。 3 前記溶接用加工ヘツドと熱処理用加工ヘツド
との間に切断用加工ヘツドを配置したことを特徴
とする特許請求の範囲第1項記載のレーザ加工
機。
[Scope of Claims] 1. In a laser processing machine equipped with a welding processing head, a cutting processing head, and a heat treatment processing head during irradiation with a laser beam from a laser generator, the cutting is performed at the waist point of the laser beam. A laser processing machine characterized by having a processing head arranged for use in laser processing. 2 Welding processing head from the laser generator side,
Claim 1 characterized in that a processing head for cutting and a processing head for heat treatment are arranged in sequence.
Laser processing machine described in section. 3. The laser processing machine according to claim 1, further comprising a cutting head disposed between the welding head and the heat treatment head.
JP59083783A 1984-04-27 1984-04-27 Laser beam machine Granted JPS60227987A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP59083783A JPS60227987A (en) 1984-04-27 1984-04-27 Laser beam machine
DE8585105151T DE3568544D1 (en) 1984-04-27 1985-04-26 Laser beam machining apparatus
EP85105151A EP0159723B1 (en) 1984-04-27 1985-04-26 Laser beam machining apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59083783A JPS60227987A (en) 1984-04-27 1984-04-27 Laser beam machine

Publications (2)

Publication Number Publication Date
JPS60227987A JPS60227987A (en) 1985-11-13
JPH0563273B2 true JPH0563273B2 (en) 1993-09-10

Family

ID=13812224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59083783A Granted JPS60227987A (en) 1984-04-27 1984-04-27 Laser beam machine

Country Status (3)

Country Link
EP (1) EP0159723B1 (en)
JP (1) JPS60227987A (en)
DE (1) DE3568544D1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2821883C2 (en) * 1978-05-19 1980-07-17 Ibm Deutschland Gmbh, 7000 Stuttgart Device for material processing

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Publication number Publication date
DE3568544D1 (en) 1989-04-13
EP0159723A2 (en) 1985-10-30
EP0159723A3 (en) 1986-01-22
EP0159723B1 (en) 1989-03-08
JPS60227987A (en) 1985-11-13

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