JPS60207356A - Self-cooling semiconductor device for vehicle - Google Patents
Self-cooling semiconductor device for vehicleInfo
- Publication number
- JPS60207356A JPS60207356A JP6359584A JP6359584A JPS60207356A JP S60207356 A JPS60207356 A JP S60207356A JP 6359584 A JP6359584 A JP 6359584A JP 6359584 A JP6359584 A JP 6359584A JP S60207356 A JPS60207356 A JP S60207356A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- wind tunnel
- cooling
- semiconductor device
- generating electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は電車等の車両床下に搭載される半導体装置に
関し、特に装置箱内に上下に貫通する風洞を通る空気の
自然対流を利用して半導体素子の冷却を行うようにした
車両用自冷式半導体装置に関する。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a semiconductor device mounted under the floor of a vehicle such as a train. The present invention relates to a self-cooling type semiconductor device for a vehicle in which elements are cooled.
一般に半導体装置は、半導体素子の発熱の外に、抵抗体
や巻物等の発熱電気品が装置箱内に設置されている。そ
れらの冷却は装置の構成・性能中信頼性上重要な問題で
ある。その一般的な冷却の方式としては、空気の自然対
流を利用した自冷式と、プロワを用いた強制冷却式、さ
らには冷媒に液体を用いた液冷式等があるが、信頼性・
コスト・保守性の面から自冷式が最も優れていると云わ
れている。しかし従来の自冷式のものでは冷却特性上効
率が悪く、特定の範囲の条件下でしか使用できず、装置
としても大形で重量も大きくなる問題があった。Generally, in a semiconductor device, in addition to the heat generated by the semiconductor element, heat generating electrical components such as a resistor and a scroll are installed in the device box. Cooling them is an important issue in terms of reliability in equipment configuration and performance. Common cooling methods include a self-cooling method that uses natural convection of air, a forced cooling method that uses a blower, and a liquid-cooled method that uses liquid as a refrigerant.
The self-cooling type is said to be the best in terms of cost and maintainability. However, conventional self-cooling devices have poor cooling efficiency, can only be used under a specific range of conditions, and have the problem of being large and heavy.
つまり第１図乃至第３図は従来の半導体装置を示すもの
で、装置箱１内の中央部に上下に貫通する風洞２が隔壁
３，３にょシ構成され、その風洞２の下端吸気口４及び
上端排気口５には金網等が張設されている。そうした装
置箱１内の上記風洞２と隔壁３，３で区画された両側密
閉室６，６に半導体素子７及び各種電気品８゜９，１０
．１１等が配設されている。また、その半導体素子７の
冷却のための冷却フィン１２が上記隔壁３から風洞２内
方１：突出して設けられていると共に、装置箱１の天板
部に上記両側密閉室６，６内の空気の冷却のための放熱
フィン１３．１３が取付けられている構成である。In other words, FIGS. 1 to 3 show a conventional semiconductor device, in which a wind tunnel 2 penetrating vertically in the center of a device box 1 is configured with partition walls 3, 3, and an intake port 4 at the lower end of the wind tunnel 2. And the upper end exhaust port 5 is covered with a wire mesh or the like. Semiconductor elements 7 and various electrical components 8°9, 10 are placed in sealed chambers 6, 6 on both sides partitioned by the wind tunnel 2 and partition walls 3, 3 in the equipment box 1.
．． 11th grade is installed. Further, cooling fins 12 for cooling the semiconductor element 7 are provided to protrude from the partition wall 3 to the inside of the wind tunnel 2, and the top plate of the equipment box 1 is provided with cooling fins 12 for cooling the semiconductor elements 7. This is a configuration in which radiation fins 13.13 for cooling the air are attached.
そして、装置箱１内の半導体素子７の熱が冷却フィン１
２から放熱され、それにより温められた風洞２内の空気
が上昇して排気口５から排出されるようになり、この自
然対流で外部空気が下部吸気口４より風洞２内を通って
冷却フィン１２の熱なうはいながら排気口５から抜ける
と云った具合にして、半導体素子７の冷却が行なわれる
。また他の抵抗等の発熱電気品８，１０からの熱は装置
箱１の壁面や上部放熱フィン１３からの自然放熱により
冷却される。Then, the heat of the semiconductor element 7 in the device box 1 is transferred to the cooling fin 1.
2, the heated air inside the wind tunnel 2 rises and is discharged from the exhaust port 5. Due to this natural convection, external air passes through the wind tunnel 2 from the lower intake port 4 and reaches the cooling fins. The semiconductor element 7 is cooled in such a way that the heat of the semiconductor element 12 escapes from the exhaust port 5 while gurgling. In addition, heat from other heat generating electrical components 8 and 10 such as resistors is cooled down by natural heat radiation from the wall surface of the device box 1 and the upper heat radiation fins 13.
しかしながら、上述した従来の構成の半導体装置では、
風洞２内の空気の流れが冷却フィン１２からの熱による
自然対流にもとづくものであることから、その流速が非
常に遅く、この為に冷却能力が低く限界があった。また
他の発熱電気品８，１０の冷却効果も装置箱１の壁面や
放熱フィン１３を通しての自然放熱であることから低い
問題があった。従って、高発熱部品の装着や装置全体の
小型転量な図ることは困難であった。However, in the semiconductor device with the conventional configuration described above,
Since the air flow in the wind tunnel 2 is based on natural convection due to heat from the cooling fins 12, the flow velocity is very slow, and therefore the cooling capacity is low and limited. Furthermore, the cooling effect of the other heat generating electrical components 8 and 10 is also low due to natural heat radiation through the wall surface of the device box 1 and the radiation fins 13. Therefore, it has been difficult to mount high heat generating components and to downsize the entire device.
この発明は上記事情に鑑みなされたもので、自然対流に
よる自冷式でありながら冷却能力の向上が図れて、高発
熱部品の適用や装置の小形軽量化と共に、高信頼性と低
コストで保守性の良い車両用自冷式半導体装置を提供す
ることを目的とする。This invention was made in view of the above circumstances, and although it is a self-cooling type using natural convection, it has improved cooling capacity, uses high heat generation parts, makes the device smaller and lighter, and has high reliability and low cost maintenance. The purpose of the present invention is to provide a self-cooling type semiconductor device for vehicles with good performance.
この発明の車両用自冷式半導体装置は、装置箱内の上下
に貫通する風洞に半導体素子用冷却フィンと共に、他の
電気部品のうち発熱電気部品を該冷却フィンよシ上側に
配して設けて、風洞内の空気の自然対流現象を促進せし
めることにより、冷却風の流速を高めて冷却効果を向上
させるようにした本のである。The self-cooling type semiconductor device for a vehicle of the present invention is provided with cooling fins for semiconductor elements in a wind tunnel penetrating vertically inside a device box, and heat-generating electrical components among other electrical components are arranged above the cooling fins. This book aims to improve the cooling effect by increasing the flow velocity of cooling air by promoting the natural convection phenomenon of air in the wind tunnel.
以下この発明の一実施例を第４図により説明する。なお
図中第３図のものと同一構成をなすものには同一符号を
附して説明の簡略を図ることにする。ここで、装置箱１
内の上下に貫通する風洞２内に半導体素子７の冷却フィ
ンが従来同様設けられているほかに、該風洞２内の上部
排気口５寄シに即ち、上記冷却フィン１２よシ上側に配
して発熱電気品８Ａが設置されている。An embodiment of the present invention will be described below with reference to FIG. Components in the figure having the same configuration as those in FIG. 3 are given the same reference numerals to simplify the explanation. Here, equipment box 1
In addition to the cooling fins for the semiconductor device 7 being provided in the wind tunnel 2 penetrating vertically within the wind tunnel 2 as in the conventional case, cooling fins for the semiconductor device 7 are provided in the wind tunnel 2 near the upper exhaust port 5, that is, above the cooling fins 12. A heat generating electrical appliance 8A is installed.
この発熱電気品８Ａは抵抗体等で従来は装置箱１内の密
閉室６内に納められていたものであるが、こわを外気冷
却タイプに変更して風洞２内に放置している。また、同
じ〈従来は装置箱１の天板部に設けていた放熱フィン１
３Ａが風洞２の隔壁３の上端１寄υ部に増付けられてい
る。The heat-generating electrical component 8A is a resistor or the like, and was conventionally housed in a closed chamber 6 in the equipment box 1, but it was changed to an outside air cooling type and left in the wind tunnel 2. In addition, the same (radiating fin 1 that was previously provided on the top plate of the equipment box 1)
3A is added to the upper end 1 of the partition wall 3 of the wind tunnel 2.
而し、て、上述した構成であれば、半導体素子７の冷却
フィン１２からの熱だけでなく、発熱電気品８Ａ及び放
熱フィン１３人の熱によって、風洞２内の空気が温めら
れて自然対流現象が促進さね、こねにて風洞２内をその
下部吸気口４から上部排気口５ ｉｐ向けて上昇する空
気の流速また、従来密閉室６内に配して壁面等からの自
然放熱によシ冷却を図っていた発熱電気品８Ａが効率よ
く外気冷却されるようになシ、これにて密閉室６内の温
度上昇が少なくなることで、その他の電気品９等の信頼
性を向上できる。更に以上の如き冷却効率の向上により
冷却フィン１２の小形や装置箱１の小形化等が可能とな
って重量の軽減も可能となる。However, with the above configuration, the air in the wind tunnel 2 is heated not only by the heat from the cooling fins 12 of the semiconductor element 7 but also by the heat from the heat-generating electrical components 8A and the heat dissipating fins 13, resulting in natural convection. In addition, the flow rate of air rising inside the wind tunnel 2 from the lower intake port 4 toward the upper exhaust port 5 IP is also increased due to natural heat dissipation from walls etc. The heat-generating electrical components 8A that were being cooled will now be efficiently cooled with outside air, and this will reduce the temperature rise inside the closed room 6, improving the reliability of other electrical components 9, etc. . Furthermore, the improvement in cooling efficiency as described above makes it possible to downsize the cooling fins 12 and the device box 1, thereby reducing the weight.
次に、第５図はこの発明の他の実施例を示すもので、こ
こでは風洞２の上下方向略中間附近から上端排気口５Ａ
までの開口面積を下部吸気口４より大きくした構成で、
更に風洞２内の上部の広くなった個所に前述の発熱電気
品８Ａと共にもう一つの発熱電気品１０ｋを設置した構
成である。この場合風洞２内を流れる空気量は上配実施
例同様多く、冷却フィン１２や発熱電気品ＨＡ、、ＩＯ
Ａを効率よく冷却できるようになる上に、上部排気口５
Ａから吹き上げる高温排気は該排気口５Ａが広いことで
比較的流速が遅くなると共に広範囲に拡散し、これにて
車両床下や同床下機器の極部的加熱が無くなるようにな
る。Next, FIG. 5 shows another embodiment of the present invention, in which the upper end exhaust port 5A is
With a configuration in which the opening area up to the lower intake port 4 is larger than that of the lower intake port 4,
Further, in a wide upper part of the wind tunnel 2, another heat generating electrical component 10k is installed together with the above-mentioned heat generating electrical component 8A. In this case, the amount of air flowing inside the wind tunnel 2 is large as in the upper embodiment, and the cooling fins 12 and heat generating electrical components HA, IO
In addition to being able to efficiently cool A, the upper exhaust port 5
Since the exhaust port 5A is wide, the high-temperature exhaust gas blown up from A has a relatively slow flow rate and is diffused over a wide range, thereby eliminating local heating of the underfloor of the vehicle and the equipment under the floor.
また、第６図及び第７図はこの発明の更に他の実施例を
示すもので、発熱電気品１０Ｂが比較的水分に弱い場合
に有利としたもので、装置箱１内の風洞２の途中から分
岐する分岐風洞２Ｂを設け、その分岐風洞２Ｂの下部吸
気口４Ｂに空気取入れ用ルーパー１４を設けると共に、
上部排気口５Ｂにその周囲を開放する状態で上側を覆う
防水率１５を設け、そしてその分岐風洞２Ｂ内に上記耐
水性に弱い発熱電気品１０Ｂを設置した構成である。こ
れにて上述した同様に冷却効率の向上が図れると共に水
切対策が図れる。Further, FIGS. 6 and 7 show still another embodiment of the present invention, which is advantageous when the heat-generating electrical component 10B is relatively sensitive to moisture. A branch wind tunnel 2B branching from the branch wind tunnel 2B is provided, and an air intake looper 14 is provided at the lower intake port 4B of the branch wind tunnel 2B.
This configuration has a waterproof rating 15 that covers the upper side of the upper exhaust port 5B in an open state, and the heat-generating electrical component 10B, which is weak in water resistance, is installed in the branch wind tunnel 2B. In this way, the cooling efficiency can be improved in the same manner as described above, and measures against water drainage can be taken.
この発明は上述した如くなしたから、空気の自然対流に
よる自冷式であシながら、冷却効率の向上が図れて、高
発熱部品の適用や装置の小形軽量化と共に、高信頼性と
低コストで保守性の良い車両用自冷式半導体装置となる
。Since this invention has been made as described above, although it is a self-cooling type using natural convection of air, it is possible to improve cooling efficiency, use high heat generation parts, reduce the size and weight of the device, and achieve high reliability and low cost. This makes it a self-cooling semiconductor device for vehicles with good maintainability.
第１図は従来の半導体装置全体の側面図、第２図は同平
面図、第３図は同拡大断面図、第４図はこの発明の一実
施例を示す断面図、第５図はこの発明の他の実施例を示
す断面図、第６図はこの発明の更に異なる他の実施例を
示す断面図、第７図は第６図の実施例における平面図で
ある。
１・・・装置箱、２．２Ｂ・・・風洞、３・・・隔壁、
４．４Ｂ・・・吸気口、５．５に、５Ｂ・・・排気口、
６・・・密閉室、７・・・半導体素子、８．８に、９゜
１０に、ＪＯＢ、１１・・・電気品、１２・・・冷却フ
ィン、１３，１３１・・・放熱フィン、１４・・・ルー
パー、１５・・・防水率。
第１図
第３図
第４図
第５図
８Ａ ５Ａ ＩＯＡ
＼ −＼ 憂 ｆ ／
令 令 會 ↑
〜６〜
Ｎ２〜／ 〜θ−
−３９↑ｔ
■１
第６図
第Ｙ図FIG. 1 is a side view of the entire conventional semiconductor device, FIG. 2 is a plan view of the same, FIG. 3 is an enlarged sectional view of the same, FIG. 4 is a sectional view of an embodiment of the present invention, and FIG. FIG. 6 is a sectional view showing another embodiment of the invention, and FIG. 7 is a plan view of the embodiment of FIG. 6. 1... Equipment box, 2.2B... Wind tunnel, 3... Bulkhead,
4.4B...Intake port, 5.5, 5B...Exhaust port,
6... Sealed room, 7... Semiconductor element, 8.8, 9°10, JOB, 11... Electrical product, 12... Cooling fin, 13,131... Radiation fin, 14 ...Looper, 15...Waterproof rate. Figure 1 Figure 3 Figure 4 Figure 5 Figure 5 8A 5A IOA ＼ -＼ Sad f / Rei Rei kai ↑ ~6~ N2~ / ~θ- -39↑t ■1 Figure 6 Figure Y
Claims (2)
内な上下に貫通する風洞内に上記半導体素子の冷却フィ
ンを設けた車両用自冷式半導体装置において、前記電気
品のうち適当な発熱電気品を上記風洞内の上部寄９部に
設置して構成したことを特徴とする車両用自冷式％式％(1) In a self-cooled semiconductor device for a vehicle, in which cooling fins for the semiconductor device are provided in a wind tunnel that penetrates vertically inside the device box in which the semiconductor device and various electrical components are installed, appropriate heat generation among the electrical components is provided. Self-cooling type % type % for vehicles, characterized in that electrical components are installed in the upper part of the wind tunnel.
したことを特徴とする特許請求の範囲第１項記載の車両
用自冷式半導体装置。(2) The self-cooled semiconductor device for a vehicle according to claim 1, wherein the area of the upper exhaust port (in the wind tunnel is larger than that of the lower intake port).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6359584A JPS60207356A (en) | 1984-03-31 | 1984-03-31 | Self-cooling semiconductor device for vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6359584A JPS60207356A (en) | 1984-03-31 | 1984-03-31 | Self-cooling semiconductor device for vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60207356A true JPS60207356A (en) | 1985-10-18 |
Family
ID=13233776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6359584A Pending JPS60207356A (en) | 1984-03-31 | 1984-03-31 | Self-cooling semiconductor device for vehicle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60207356A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10212949A (en) * | 1997-01-30 | 1998-08-11 | Toshiba Transport Eng Kk | Semiconductor control device for vehicle |
| WO2017208487A1 (en) * | 2016-05-30 | 2017-12-07 | Ｆｘｃ株式会社 | Electronic device and heat dissipation structure of electronic device |
-
1984
- 1984-03-31 JP JP6359584A patent/JPS60207356A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10212949A (en) * | 1997-01-30 | 1998-08-11 | Toshiba Transport Eng Kk | Semiconductor control device for vehicle |
| WO2017208487A1 (en) * | 2016-05-30 | 2017-12-07 | Ｆｘｃ株式会社 | Electronic device and heat dissipation structure of electronic device |
| CN109196967A (en) * | 2016-05-30 | 2019-01-11 | Fxc 株式会社 | The heat-dissipating structure of electronic device and electronic device |
| TWI722195B (en) * | 2016-05-30 | 2021-03-21 | 日商Ｆｘｃ股份有限公司 | Electronic device and heat radiation structure of electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2021253401A1 (en) | High- and low-voltage switch cabinet having moisture-proofing and heat-dissipating function | |
| CN210808085U (en) | Electric control cabinet and air conditioner | |
| CN108697036A (en) | A kind of isolated heat radiation structure and its heat dissipating method suitable for charging pile module | |
| CN111654997A (en) | Air-cooled type heat dissipation system and method for vehicle traveling | |
| CN207994912U (en) | Electric and electronic power cabinet | |
| JPS60207356A (en) | Self-cooling semiconductor device for vehicle | |
| JPH09120918A (en) | Transformer | |
| CN208620456U (en) | Novel module radiator and air conditioning system | |
| CN207218518U (en) | A kind of frequency converter of high heat dispersion | |
| JPH09308026A (en) | Cooler of enclosed structure | |
| WO2019058466A1 (en) | Cooling device and cooling method | |
| CN212435573U (en) | Inverter capable of dissipating heat quickly for electric locomotive | |
| CN209325964U (en) | Dehumidification device and electrical equipment | |
| CN208425101U (en) | A kind of isolated heat radiation structure suitable for charging pile module | |
| JP4223827B2 (en) | Heat dissipation structure of electrical device storage box | |
| CN101772230B (en) | Heating control cabinet of high-frequency hot roll | |
| JPS6086338A (en) | Dehumidifying device | |
| CN214879673U (en) | Electric control device for bridge crane sling | |
| CN221575134U (en) | Inverter capable of running for long time | |
| JPH0470800B2 (en) | ||
| CN109038582A (en) | A kind of Active Power Filter-APF and its heat dissipation auxiliary device | |
| CN216451667U (en) | Dampproofing waterproof construction of BMS battery management system casing heat dissipation | |
| CN108415541A (en) | Cooled plate mechanism for cabinet | |
| CN214177862U (en) | Internal circulation closed heat dissipation electrical equipment | |
| CN217543770U (en) | Computer that possesses dampproofing function of heat dissipation |